SPST, 2 Func, CMOS, CQCC20
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Vishay |
| package instruction | QCCN, LCC20,.35SQ |
| Reach Compliance Code | unknow |
| Analog Integrated Circuits - Other Types | SPST |
| JESD-30 code | S-XQCC-N20 |
| JESD-609 code | e0 |
| normal position | NO |
| Number of functions | 2 |
| Number of terminals | 20 |
| Maximum on-state resistance (Ron) | 45 Ω |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| output | SEPARATE OUTPUT |
| Package body material | CERAMIC |
| encapsulated code | QCCN |
| Encapsulate equivalent code | LCC20,.35SQ |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| power supply | 5,+-15 V |
| Certification status | Not Qualified |
| surface mount | YES |
| Maximum connection time | 150 ns |
| switch | BREAK-BEFORE-MAKE |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | NO LEAD |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| DG401AZ | DG423DN | 364502V167 | DG403AZ | |
|---|---|---|---|---|
| Description | SPST, 2 Func, CMOS, CQCC20 | SPDT, 2 Func, 1 Channel, CMOS, PQCC20, PLASTIC, LCC-20 | RAST 5 connectors, pitch 5.0 mm | SPDT, 2 Func, CMOS, CQCC20 |
| Is it Rohs certified? | incompatible | incompatible | - | incompatible |
| Maker | Vishay | Vishay | - | Vishay |
| package instruction | QCCN, LCC20,.35SQ | QCCJ, | - | QCCN, LCC20,.35SQ |
| Reach Compliance Code | unknow | unknown | - | unknow |
| Analog Integrated Circuits - Other Types | SPST | SPDT | - | SPDT |
| JESD-30 code | S-XQCC-N20 | S-PQCC-J20 | - | S-XQCC-N20 |
| JESD-609 code | e0 | e0 | - | e0 |
| Number of functions | 2 | 2 | - | 2 |
| Number of terminals | 20 | 20 | - | 20 |
| Maximum on-state resistance (Ron) | 45 Ω | 35 Ω | - | 45 Ω |
| Maximum operating temperature | 125 °C | 85 °C | - | 125 °C |
| Minimum operating temperature | -55 °C | -40 °C | - | -55 °C |
| Package body material | CERAMIC | PLASTIC/EPOXY | - | CERAMIC |
| encapsulated code | QCCN | QCCJ | - | QCCN |
| Package shape | SQUARE | SQUARE | - | SQUARE |
| Package form | CHIP CARRIER | CHIP CARRIER | - | CHIP CARRIER |
| Certification status | Not Qualified | Not Qualified | - | Not Qualified |
| surface mount | YES | YES | - | YES |
| Maximum connection time | 150 ns | 250 ns | - | 150 ns |
| technology | CMOS | CMOS | - | CMOS |
| Temperature level | MILITARY | INDUSTRIAL | - | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | TIN LEAD | - | Tin/Lead (Sn/Pb) |
| Terminal form | NO LEAD | J BEND | - | NO LEAD |
| Terminal pitch | 1.27 mm | 1.27 mm | - | 1.27 mm |
| Terminal location | QUAD | QUAD | - | QUAD |