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30070-53

Description
Geode™ GXm Processor Integrated x86 Solution with MMX Support
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size2MB,247 Pages
ManufacturerNational Semiconductor(TI )
Websitehttp://www.ti.com
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30070-53 Overview

Geode™ GXm Processor Integrated x86 Solution with MMX Support

30070-53 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
package instructionSPGA, SPGA320,37X37
Reach Compliance Codeunknow
ECCN code3A991.A.2
Other featuresALSO REQUIRES 3.3V SUPPLY
Address bus width32
bit size32
boundary scanYES
maximum clock frequency33.61 MHz
External data bus width32
FormatFLOATING POINT
Integrated cacheYES
JESD-30 codeS-CPGA-P320
JESD-609 codee0
length49.595 mm
low power modeYES
Number of terminals320
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeSPGA
Encapsulate equivalent codeSPGA320,37X37
Package shapeSQUARE
Package formGRID ARRAY, SHRINK PITCH
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply2.9,3.3 V
Certification statusNot Qualified
Maximum seat height3.07 mm
speed266 MHz
Maximum slew rate3100 mA
Maximum supply voltage3.05 V
Minimum supply voltage2.76 V
Nominal supply voltage2.9 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formPIN/PEG
Terminal pitch1.27 mm
Terminal locationPERPENDICULAR
Maximum time at peak reflow temperatureNOT SPECIFIED
width49.595 mm
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR
Base Number Matches1

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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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