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TDK-73M2901CL

Description
V.22 BIS SINGLE CHIP MODEM
File Size284KB,18 Pages
ManufacturerTDK Corporation
Websitehttp://www.tdk.com
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TDK-73M2901CL Overview

V.22 BIS SINGLE CHIP MODEM

®
TDK SEMICONDUCTOR CORP.
73M2901CL
V.22bis Single Chip Modem
May 2002
DESCRIPTION
The 73M2901CL is a single-chip modem that
combines all the controller (DTE) and data pump
functions necessary to implement an intelligent
V.22bis data modem.
It is adequately suited for embedded applications
where a data return channel is needed through the
telephone network such as Set top Box, Point of
Sale Terminal, Automatic Teller machine, Hand Held
Communication Device and Smart Card Reader.
This device is based on TDK Semiconductor’s
implementation of the industry standard 8032
microcontroller core with a proprietary Multiply/
ACcumulate (MAC) coprocessor; Sigma-Delta A/D
and D/A converters (CODEC); and an analog DAA
drivers. The ROM and RAM necessary to operate
the modem are contained on the device.
Additionally, the 73M2901CL provides an on-chip
oscillator and hybrid.
FEATURES
True one chip solution for embedded systems
Low power
As low as 9.5mA operating with standby and
power down mode available
Power supply operation from 3.6V to 2.7V
Data speed:
V.22bis – 2400bps
V.22/Bell212 – 1200bps
V.21/Bell103 – 300bps
V.23 – 1200/75bps (with PAVI turnaround)
Bell202 – 1200bps
Bell202/V23 4-wire operations
International Call Progress support
FCC68, CTR21, JATE, etc.
Worldwide Caller ID capability
Type I and II support
EIA 716 compliant
DTMF generation and detection
On chip hybrid driver
Blacklisting capability
Line-In-Use and Parallel Pick-Up (911) detection
capability
Manufacturing Self Test capability
Packaging:
32 pin PLCC / 32 pin TQFP / 44 pin LQFP
BLOCK DIAGRAM

TDK-73M2901CL Related Products

TDK-73M2901CL 73M2901CL 73M2901CLIGV 73M2901CLIGT 73M2901CLIH
Description V.22 BIS SINGLE CHIP MODEM V.22 BIS SINGLE CHIP MODEM V.22 BIS SINGLE CHIP MODEM V.22 BIS SINGLE CHIP MODEM V.22 BIS SINGLE CHIP MODEM
Maker - - TDK Corporation TDK Corporation TDK Corporation
Parts packaging code - - QFP QFP QFJ
package instruction - - TQFP, TQFP32,.35SQ,32 LQFP, QFP44,.47SQ,32 QCCJ, LDCC32,.5X.6
Contacts - - 32 44 32
Reach Compliance Code - - unknown unknown unknown
data rate - - 2.4 Mbps 2.4 Mbps 2.4 Mbps
JESD-30 code - - S-PQFP-G32 S-PQFP-G44 R-PQCC-J32
length - - 8 mm 10 mm 13.97 mm
Number of functions - - 1 1 1
Number of terminals - - 32 44 32
Maximum operating temperature - - 85 °C 85 °C 85 °C
Minimum operating temperature - - -40 °C -40 °C -40 °C
Package body material - - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code - - TQFP LQFP QCCJ
Encapsulate equivalent code - - TQFP32,.35SQ,32 QFP44,.47SQ,32 LDCC32,.5X.6
Package shape - - SQUARE SQUARE RECTANGULAR
Package form - - FLATPACK, THIN PROFILE FLATPACK, LOW PROFILE CHIP CARRIER
power supply - - 3/3.3 V 3/3.3 V 3/3.3 V
Certification status - - Not Qualified Not Qualified Not Qualified
Maximum seat height - - 1.2 mm 1.6 mm 3.55 mm
Maximum slew rate - - 0.0155 mA 0.0155 mA 0.0155 mA
Nominal supply voltage - - 3 V 3 V 3 V
surface mount - - YES YES YES
Telecom integrated circuit types - - MODEM MODEM MODEM
Temperature level - - INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form - - GULL WING GULL WING J BEND
Terminal pitch - - 0.8 mm 0.8 mm 1.27 mm
Terminal location - - QUAD QUAD QUAD
width - - 8 mm 10 mm 11.43 mm
Base Number Matches - - 1 1 1
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