Unique stress-free labor-saving locking-tab design ensures reliable device-to-heat-sink surface contact for TO-220 components. The 235 Series
maximizes surface area providing more effective cooling of components mounted either horizontally or vertically. Components insert quickly and
easily without the use of installation tools by depressing heat sink sides, reducing process time and assembly costs. A mounting hole is available
for hardware mounting when desired. Models are available with or without solderable tab options. Specify solderable tab options by the addition
of suffix 01, 05, or 10 to the standard part number (i.e. 235-85AB-01). Material: Aluminum, black anodized.
1.00
(25.4)
235-85AB
.50
(12.7)
MECHANICAL DIMENSIONS
.850
(21.6)
235 SERIES
HEAT SINK TEMPERATURE
RISE ABOVE AMBIENT AIR (
˚
C)
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
AIR VELOCITY (LFM)
100
80
60
40
20
0
0
1
2
3
4
5
10
8
6
4
2
0
THERMAL RESISTANCE
SINK TO AMBIENT (
˚
C/WATT)
THERMAL RESISTANCE
SINK TO AMBIENT (
˚
C/WATT)
THERMAL RESISTANCE
CASE TO AMBIENT (
˚
C/WATT)
0
200
400
600
800
1000
.500
(12.7)
.850
(21.6)
.125
(3.2)
1.00 REF
(25.4)
.500
(4.1)
(12.7)
.250
(6.4)
235-85AB-05
.032
(0.8)
.850
(21.6)
.050
(1.3)
235-85AB-01
.063
(1.5)
.375
(9.5)
.160
.032 (TAB01)
(0.8)
.020 (TAB10)
(0.5)
235-85AB-10
.500 MIN
(12.7)
.050
(1.3)
POWER DISSIPATION (WATTS)
.165
(4.2)
Dimensions: in. (mm)
SUGGESTED TAB HOLE=
ø.075 (1.9) (PLATED)
WITH ø.100 (2.5) (PAD)
243 SERIES
Standard
P/N
243-1PAB
243-3PAB
Labor-Saving Clip-On Heat Sinks
Height Above
PC Board
1.000 in. (25.4)
.800 in. (20.3)
Footprint Dimensions
.800 in. (20.3) x .270 in. (6.9)
.800 in. (20.3) x .270 in. (6.9)
Mounting
Solderable
Configuration Tab Option
Vert./Horiz.
No Tab
Vert./Horiz.
No Tab
Mounting
Style
Clip
Clip
TO-220
Thermal Performance at Typical Load
Natural Convection Forced Convection
50°C@ 2W
4.5°C/W @ 400 LFM
78°C@ 2W
8.2°C/W @ 400 LFM
Rapid component alignment and installation of TO-220 components is achieved with the 243 Series Clip-On design while ensuring reliable device-
to-heat-sink surface contact for maximum thermal efficiency. Components insert quickly and easily without the use of installation tools, reducing
process time and assembly costs. Material: Aluminum, pre-anodized black.
MECHANICAL DIMENSIONS
.800
(20.3)
A
.100
(2.5)
.310
(7.9)
.50
(12.7)
SECTION A-A
.270
(6.9)
.068
(1.7)
243 SERIES
CASE TEMPERATURE
RISE ABOVE AMBIENT AIR (
˚
C)
100
80
60
40
20
0
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
AIR VELOCITY (LFM)
0
200
400
600
800
1000
20
16
12
243-3PAB
243-1PAB
MIN.FLAT
A
.50 REF.
(12.7)
B
A
.440
(11.2)
243-3PAB
243-1PAB
VIEW B-B
8
4
5
0
PART NUMBER
243-1PAB
243-3PAB
DIM A
1.000 (25.4)
.800 (20.3)
Dimensions: in. (mm)
0
1
2
3
4
POWER DISSIPATION (WATTS)
239 SERIES
Snap-Down Self-Locking Heat Sinks
TO-220
PATENT PENDING
Standard
Height Above
Mounting
Solderable
Mounting
Thermal Performance at Typical Load
P/N
PC Board
Footprint Dimensions
Configuration Tab Option
Style
Natural Convection Forced Convection
239-75AB
.750 in. (19.1) 1.120 in. (28.4) x .435 in. (11.0) Vert./Horiz.
No Tab
Clip/Mtg Hole
38°C @ 2W
6°C/W @ 400 LFM
239-75AB-03
.750 in. (19.1) 1.120 in. (28.4) x .435 in. (11.0)
Vertical
03
Clip/Mtg Hole
38°C @ 2W
6°C/W @ 400 LFM
239-75AB-04
.750 in. (19.1) 1.120 in. (28.4) x .435 in. (11.0)
Vertical
04
Clip/Mtg Hole
38°C @ 2W
6°C/W @ 400 LFM
Snap-down heat sinks for TO-220 devices mounted either vertically or horizontally. Integral self-locking-fin features eliminate the need for installation
tools or other hardware typically required for installation or removal of components. A hole is available for hardware mounting when desired. Unique
fin design aligns the component and securely retains it when “Snapped” into the heat sink for reliable component operation. Specify solderable tab
options by the addition of suffix 03 or 04 to the standard part number (i.e. 239-75AB-03). Material: Aluminum, black anodized.
239 SERIES
A
SECTION A-A
ø.150
(3.8)
.435
(11.1)
MECHANICAL DIMENSIONS
ø.150
(3.8)
239-75AB
.435
(11.1)
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
AIR VELOCITY (LFM)
HEAT SINK TEMPERATURE
RISE ABOVE AMBIENT AIR (
˚
C)
100
80
60
40
20
0
0
1
2
3
4
POWER DISSIPATION (WATTS)
5
0
200
400
600
800
1000
20
16
12
8
4
0
.750
(19.1)
A
.49
(22.9)
.275
(7.0)
.530
(13.5)
1.120
(28.4)
.435
(11.0)
TAB 03
239-75AB-03
TAB 04
239-75AB-04
SUGGESTED TAB HOLE =
ø.075 (1.9) (PLATED)
WITH ø.100 (2.5) (PAD)
.062
(1.6)
.125 .375
(3.2) (9.5)
.020
(0.5)
Dimensions: in. (mm)
Wakefield Engineering, Inc.
60 Audubon Road, Wakefield, MA 01880 USA
Tel: (617) 245-5900 • Fax: (617) 246-0874
4
Refer to
Full Line Catalog
for additional
Board-Level Heat Sinks and
Thermal Accessory Products
BOARD LEVEL
HEAT SINKS
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
273 SERIES
Low-Cost, Low-Height Wavesolderable Heat Sinks
TO-218, TO-220
Standard
Height Above
Mounting
Solderable
Mounting
Thermal Performance at Typical Load
P/N
PC Board
Footprint Dimensions
Configuration Tab Option
Style
Natural Convection Forced Convection
273-AB
.375 in. (9.5) .750 in. (19.1) x .750 (19.1) Vertical/Horizontal
No Tab
Mtg Hole
49°C @ 2W
7.2°C/W @ 400 LFM
273-AB-01
.375 in. (9.5) .750 in. (19.1) x .750 (19.1)
Vertical
01
Mtg Hole
49°C @ 2W
7.2°C/W @ 400 LFM
273-AB-02
.375 in. (9.5) .750 in. (19.1) x .750 (19.1)
Vertical
02
Mtg Hole
49°C @ 2W
7.2°C/W @ 400 LFM
This low-cost, low-profile wavesolderable heat sink occupies minimum space and is ideal for use with many low-power semiconductors in a variety
of applications. The heat sink can be mounted vertically or horizontally on printed circuit boards. Specify solderable tab options by the addition of
suffix 01 or 02 to the standard part number (i.e. 273-AB-01). Material: Aluminum, black anodized.
MECHANICAL DIMENSIONS
.150 DIA THRU
(3.8)
.050
(1.3)
.250
(6.4)
.525
(13.3)
.375
(9.5)
.750
(19.1)
.050
(1.3)
273-AB-01
.032
(0.8)
.050
(1.3)
273-AB-02
.032
(0.8)
273 SERIES
HEAT SINK TEMPERATURE
RISE ABOVE AMBIENT AIR (
˚
C)
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
AIR VELOCITY (LFM)
THERMAL RESISTANCE
SINK TO AMBIENT (
˚
C/WATT)
THERMAL RESISTANCE
SINK TO AMBIENT (
˚
C/WATT)
THERMAL RESISTANCE
SINK TO AMBIENT (
˚
C/WATT)
100 0
90
80
70
60
50
40
30
20
10
0
200
400
600
800
1000 20
.750
(19.1)
.375
(9.5)
273-AB
Note:
1. Suggested Tab Hole = ø.075 (1.9) (Plated) with ø.100 (2.5) pad
0
Dimensions: in. (mm)
18
16
14
SERIES 273 AB
12
10
8
6
4
2
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
POWER DISSIPATION (WATTS)
274 SERIES
Low-Cost, Low-Height Wavesolderable Heat Sinks
TO-220
Standard
Height Above
Mounting
Solderable
Mounting
Thermal Performance at Typical Load
P/N
PC Board “A”
Footprint Dimensions
Configuration Tab Option
Style
Natural Convection Forced Convection
274-1AB
.375 in. (9.5)
.520 in. (13.2) x .750 in. (19.1) Vertical/Horizontal
No Tab
Mtg Hole
56°C @ 2W
8.0°C/W @ 400 LFM
274-1AB-01
.375 in. (9.5)
.520 in. (13.2) x .750 in. (19.1)
Vertical
01
Mtg Hole
56°C @ 2W
8.0°C/W @ 400 LFM
274-1AB-02
.375 in. (9.5)
.520 in. (13.2) x .750 in. (19.1)
Vertical
02
Mtg Hole
56°C @ 2W
8.0°C/W @ 400 LFM
274-2AB
.500 in. (12.7)
.520 in. (13.2) x .750 in. (19.1) Vertical/Horizontal
No Tab
Mtg Hole
50°C @ 2W
7.0°C/W @ 400 LFM
274-2AB-01
.500 in. (12.7)
.520 in. (13.2) x .750 in. (19.1)
Vertical
01
Mtg Hole
50°C @ 2W
7.0°C/W @ 400 LFM
274-2AB-02
.500 in. (12.7)
.520 in. (13.2) x .750 in. (19.1)
Vertical
02
Mtg Hole
50°C @ 2W
7.0°C/W @ 400 LFM
274-3AB
.250 in. (6.4)
.520 in. (13.2) x .750 in. (19.1) Vertical/Horizontal
No Tab
Mtg Hole
62°C @ 2W
9.0°C/W @ 400 LFM
274-3AB-01
.250 in. (6.4)
.520 in. (13.2) x .750 in. (19.1)
Vertical
01
Mtg Hole
62°C @ 2W
9.0°C/W @ 400 LFM
274-3AB-02
.250 in. (6.4)
.520 in. (13.2) x .750 in. (19.1)
Vertical
02
Mtg Hole
62°C @ 2W
9.0°C/W @ 400 LFM
Similar to the 273 Series, the 274 Series has a narrower footprint width for use on densely populated circuit boards. Use these types when space is at
a premium and low cost is needed. Specify solderable tab options by the addition of suffix 01 or 02 to the standard part number (i.e. 274-1AB-01).
Material: Aluminum, black anodized.
MECHANICAL DIMENSIONS
.520
(13.2)
274 SERIES
274-XAB-01
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
AIR VELOCITY (LFM)
HEAT SINK TEMPERATURE
RISE ABOVE AMBIENT AIR (
˚
C)
274-XAB-02
.150 DIA THRU
(3.8)
.750
(19.1)
100
80
60
40
20
0
0
200
400
600
274 1AB
800
1000 20
.750
(19.1)
.525
(13.3)
.050
(1.3)
274-XAB
“A”
.050
(1.3)
.250
(6.4)
.032
(0.8)
.050
(1.3)
.375
(9.5)
.032
(0.8)
Ø.075 (1.9) (plated) Ø.100 (2.5) pad
PCB recommended hole/pad size
0
Dimensions: in. (mm)
18
16
14
274 2AB
12
10
8
274 1AB
6
274 2AB
4
2
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
POWER DISSIPATION (WATTS)
240 SERIES
Labor-Saving Twisted Fin Heat Sinks
Solderable
Tab Option
22
22
TO-220
Mounting
Thermal Performance at Typical Load
Style
Natural Convection Forced Convection
Clip/Mtg Hole
55°C @ 4W
5.3°C/W @ 400 LFM
Clip/Mtg Slot
55°C @ 4W
5.3°C/W @ 400 LFM
Standard
Height Above
Mounting
P/N
PC Board
Footprint Dimensions
Configuration
240-118ABH-22 1.180 in. (30.0) 1.000 in. (25.4) x .500 in. (12.7)
Vertical
240-118ABS-22 1.180 in. (30.0) 1.000 in. (25.4) x .500 in. (12.7)
Vertical
Twisted fin design for efficient cooling of vertically mounted TO-220 devices occupies minimum board space. Heat sinks are available with a
mounting hole or mounting slot and optional labor-saving clip attachments.
Order SpeedClips
TM
285SC or 330SC separately
for rapid component
installation, lowering manufacturing costs . Standard solderable tab option is specified by the addition of suffix 22 to the standard part number (i.e.
240-118ABH-22 or 240-118ABS-22). Material: Aluminum, black anodized.
1.000
(25.4)
ø.125
(3.2)
.400
(10.2)
.700
(17.8)
240-118ABS-22
.280
(7.1)
.950
(24.1)
240-118ABH-22
.065 x .150
(1.7) (3.8)
2 SLOTS
.150 TAB 22
(3.8)
.700
(17.8)
.150
(3.8)
.375
(9.5)
MECHANICAL DIMENSIONS
.500
(12.7)
SEE
DETAIL A
DETAIL A
.040
(1.0)
2x .070
(1.8)
.300
(7.6)
2x.060
(1.5)
.680
(17.3)
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
AIR VELOCITY (LFM)
HEAT SINK TEMPERATURE
RISE ABOVE AMBIENT AIR (
˚
C)
100
80
60
40
20
0
0
2
4
6
8
POWER DISSIPATION (WATTS)
0
200
400
600
800
1000
10
8
6
4
2
0
10
1.180
(30.0)
TAB HOLES
.950
(24.1)
.032 2 PL
(0.8)
.560
(14.2)
.400
(10.2)
ø.100 PLATED
(2.5)
.075
(1.9)
240 SERIES
STAINLESS STEEL 330SC 4#
SPRING STEEL 285SC 10#
Dimensions: in. (mm)
Order SpeedClips™ Separately
Refer to
Full Line Catalog
for additional
Board-Level Heat Sinks and
Thermal Accessory Products
5
Wakefield Engineering, Inc.
60 Audubon Road, Wakefield, MA 01880 USA
Tel: (617) 245-5900 • Fax: (617) 246-0874
BOARD LEVEL
HEAT SINKS
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
242 SERIES
Standard
P/N
242-125AB-22
Low-Height, Low-Profile Twisted Fin Heat Sinks
Height Above
PC Board
1.285 in. (32.6)
Footprint Dimensions
.875 in. (22.2) x .250 in. (6.4)
Mounting
Solderable
Configuration Tab Option
Vertical
22
Mounting
Style
Mtg Hole
TO-220
Thermal Performance at Typical Load
Natural Convection Forced Convection
48°C @ 2W
6.2°C/W @ 400 LFM
Efficient, low-profile twisted fin heat sinks for vertical mounting of TO-220 devices. Its slim design minimizes PC board space occupied and the
alternating twisted fins increase air turbulence for improved cooling. Standard models include wavesolderable tinned tabs for direct PC board
mounting. Specify part number 242-125AB-22. Material: Aluminum, black anodized.
.450
(11.4)
FLAT
ø.125
(3.2)
MECHANICAL DIMENSIONS
P.C. BOARD MTG. SUR-
FACE
.250
(6.4)
242 SERIES
HEAT SINK TEMPERATURE
RISE ABOVE AMBIENT AIR (
˚
C)
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
AIR VELOCITY (LFM)
100
80
60
40
20
0
0
1
2
3
4
POWER DISSIPATION (WATTS)
5
20
16
12
8
4
0
THERMAL RESISTANCE
SINK TO AMBIENT (
˚
C/WATT)
10
8
6
4
2
0
2
4
6
8
POWER DISSIPATION (WATTS)
TAB HOLES
ø.130 PLATED
(3.3)
0
200
400
600
800
1000
1.250
(31.8)
.770
(19.6)
242-125AB-22
ø.100 PLATED
(2.5)
.185
(4.7)
2x.075
(1.9)
.700
(17.8)
.875
(22.2)
.032
(0.8)
PARTIAL VIEW
ONLY NEAR SIDE FINS SHOWN
.150
(3.8)
.700
(17.8)
TAB HOLES
Dimensions: in. (mm)
232 and 238 SERIES
Standard
P/N
232-200AB
232-200AB-23
238-200AB
238-200AB-23
Staggered Fin Heat Sinks for Vertical Mounting
Footprint Dimensions
1.380 in. (35.1) x .500 in. (12.7)
1.380 in. (35.1) x .500 in. (12.7)
1.380 in. (35.1) x .500 in. (12.7)
1.380 in. (35.1) x .500 in. (12.7)
TO-202, TO-220
Height Above
PC Board
2.000 in. (50.8)
2.000 in. (50.8)
2.000 in. (50.8)
2.000 in. (50.8)
Mounting
Tab Options Mounting
Thermal Performance at Typical Load
Configuration
Type
Style
Natural Convection Forced Convection
Vertical
2, Twisted Clip/Mtg Hole
48°C @ 4W
3.3°C/W @ 400 LFM
Vertical
2, Solderable Clip/Mtg Hole
48°C @ 4W
3.3°C/W @ 400 LFM
Vertical
2, Twisted
Mtg Slot
48°C @ 4W
3.3°C/W @ 400 LFM
Vertical
2, Solderable
Mtg Slot
48°C @ 4W
3.3°C/W @ 400 LFM
Staggered fin design for efficient cooling of TO-202 (Series 238) and TO-220 (Series 232) semiconductor devices. Models mount vertically and are
available with two solderable tabs (232-200AB-23 or 238-200AB-23) or two twisted tabs (232-200AB or 238-200AB).
Order SpeedClips™ 285SC
or 330SC separately
(232 Series only) for rapid component installation, lowering manufacturing costs. Material: Aluminum, black anodized.
MECHANICAL DIMENSIONS
232 SERIES
232-200AB
ø.125 PL
(3.2)
Optional
SpeedClip
™
Mounting
2.000
(50.8)
Optional
SpeedClip
™
Mounting
.382
(9.7)
.097
(2.5)
.375
(9.5)
238-200AB
.125
(3.2)
238-200AB-23
232-200AB-23
238 SERIES
232 AND 238 SERIES
HEAT SINK TEMPERATURE
RISE ABOVE AMBIENT AIR (
˚
C)
.500
(12.7)
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
AIR VELOCITY (LFM)
100
80
60
40
20
0
THERMAL RESISTANCE
SINK TO AMBIENT (
˚
C/WATT)
THERMAL RESISTANCE
SINK TO AMBIENT (
˚
C/WATT)
0
200
400
600
800
1000
2.000
(50.8)
1.000
.720 (25.4)
(18.3)
.187
(4.8)
.700
(17.8)
.187
(4.8)
.097
(2.5)
1.000
(25.4)
.100 REF
(2.5)
.187
(4.8)
.100 REF
.440
(2.5)
(11.2)
.440
1.000
(11.2)
(25.4)
1.000
(25.4)
.050
(1.3)
.150
(3.8)
.032 REF
(0.8)
0
10
Stainless
Steel
330SC 4#
Spring
Steel
285SC 10#
.650 FLAT
(16.5)
Order SpeedClips™ Separately
Dimensions: in. (mm)
1.380
(35.1)
1.000
(25.4)
251 SERIES
Slim-Profile Heat Sinks With Integral Clips
15 Lead Multiwatt
Standard
Height Above
Mounting
Solderable Mounting
Thermal Performance at Typical Load
P/N
PC Board
Footprint Dimensions
Configuration Tab Option
Style
Natural Convection Forced Convection
251-62AB
.620 in. (15.7)
.910 in. (23.1) x .380 in. (9.7) Vertical/Horizontal No Tab
Clip
66°C @ 3W
6.6°C/W @ 400 LFM
251-80AB
.845 in. (21.5)
.910 in. (23.1) x .380 in. (9.7) Vertical/Horizontal No Tab
Clip
64°C @ 3W
6.4°C/W @ 400 LFM
251-80AB-19
.875 in. (22.2)
.910 in. (23.1) x .380 in. (9.7)
Vertical
19
Clip
64°C @ 3W
6.4°C/W @ 400 LFM
Lightweight, slim-profile heat sinks with integral self-locking clips occupy minimum board real estate and reduce assembly costs. Their small
footprint is ideal for a variety of low-power multiwatt component applications. Models are available in heights of .620 in. (15.7) and .845 in.
(21.5). Specify solderable tab option for the 251-80AB (only) by the addition of suffix 19 to the standard part number (i.e. 251-80AB-19).
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Keysight Technologies reported strong third-quarter results, with revenue and earnings per share exceeding expectations and steady order growth. The company, driven by strong growth across multiple...[Details]
Reasons for the wear of the roller press reducer shaft:
1. Since the expansion sleeve is subjected to a large torque, the mating surfaces of the shaft and the sleeve move relative to each other...[Details]
In industrial production, many different controllers are often used, such as those for pressure, flow, electrical parameters, temperature, and sound. However, due to the limitations of the on-site ...[Details]
Naxin Micro releases the NS800RT737x high-performance real-time control MCU (DSP), enabling core control in the industrial and energy sectors.
In power electronics and electric drive...[Details]
The consumer electronics, appliance, industrial, and automotive markets are experiencing increasing demand for sophisticated motor control solutions. Depending on the application, a variety of moto...[Details]
The basic structure of the power grid dispatching automation system includes three parts: control center, master station system, plant terminal (RTU) and information channel. According to the diffe...[Details]
Silicon carbide (SiC) power switching devices are becoming a popular choice for industrial battery applications due to their ability to achieve faster switching speeds and superior low-loss operati...[Details]
1. The significance of reactive power compensation
In industrial enterprises, a large number of electrical equipment are inductive loads, such as motors, welding machines, and electric furnace...[Details]
The reducer is a crucial mechanical device. If you know anything about industrial machinery, you've undoubtedly heard of it. As a transmission device, it plays a crucial role in many industrial app...[Details]
A PLC (Programmable Logic Controller) is a computer control system widely used in the field of automated control. It can be programmed to control various mechanical equipment and industrial product...[Details]
1. Signal Type of Vibration Sensor
The signal type of a vibration sensor depends mainly on its operating principle and measurement parameters. The following are some common signal types:
...[Details]
Embedded System
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