274-1AB-02 datasheet, PDF - EEWORLD Datasheet

BOARD LEVEL

HEAT SINKS

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

216 SERIES

Standard

P/N

216-40CT

216-40CTT

216-40CTR

Surface Mount Heat Sinks

Height Above

PC Board

.390 in. (9.9)

Footprint Dimensions

.600 in. (15.2) x .740 in. (18.8)

Package

Format

Bulk

Tube

Tape & Reel

Package

Quantity

1

25

250

D

2

PAK, TO-220, SOL-20

Thermal Performance at Typical Load

Natural Convection

Forced Convection

55°C @ 1W

16.0°C/W @ 200 LFM

55°C @ 1W

16.0°C/W @ 200 LFM

55°C @ 1W

16.0°C/W @ 200 LFM

PATENT 361317

Increase the power dissipation level of D

2

PAK, TO-220, SOL-20 and other surface mount power components while maintaining the benefits of

high-speed, automated pick and place assembly technology. The patented 216 Series heat sink is mounted astride the component and solder

reflowed to the PCB using standard board assembly equipment (Fuji, Philips, etc.) and processes. This creates a very low thermal resistance path

from the component tab to the heat sink and in turn to the ambient air which lowers junction temperatures for reliable operation. Available in bulk,

tube or tape & reel packaging which meet EIA Standards and ESD protection requirements. Material: Copper, tin-lead plated.

216-40CTR

A

RECOMMENDED COPPER FOOTPRINT

USE MAX

COPPER

TO ALLOW

MAX

CONDUCTION

TO HEAT SINK

.660

(16.8)

.640

(16.3)

.660

(16.8)

.640

(16.3)

COPPER FOOTPRINT

FOR HEAT SINK

MIN COPPER

FOR HEAT

SINK

1.260

(32.0)

.390

(9.9)

REF:

JEDEC TO-263 D

2

PAK

JEDEC TO-220AB

JEDEC TO-261AA

JEDEC MO-184

JEDEC MS-013

JEDEC MS-025

MECHANICAL DIMENSIONS

.740

(18.8)

6 LAYER BOARD, D

2

PAK

125°C LEAD, 40°C AMBIENT

AIR VELOCITY (LFM)

POWER DISSIPATION, W

7

6

5

4

3

2

1

AIR PERPENDICULAR TO FINS

AIR PARALLEL TO FINS

NO HEAT SINK

0

100

200

300

400

500

216-40CT

TAPE

DETAILS

.600

(15.2)

.626

(15.9)

A

.060

(1.5)

SECTION

A-A

.640

(16.3)

.215

(5.5)

.600

(15.2)

.020

(0.5)

.600

(15.2)

.390

(9.9)

.215

(5.5)

.020

(0.5)

.768

(19.5)

.945

(24.0)

REEL

DETAILS

13.000

(330.2)

.409

(10.4)

.215

(5.5)

216-40CTT

NOTES:

1. ESD MATERIAL WITH PLUGS

2. LENGTH OF TUBE: 16.25 INCHES

3. QUANTITY PER TUBE: 25 PIECES

TUBE DETAILS

.390

(9.9)

.640

(16.3)

.265

(6.7)

1.28

(32.5)

.470

(11.9)

NOTES:

1. ESD MATERIAL

2. EIA STANDARD, EIA-481-3

3. LENGTH OF REEL: APPROXIMATELY 6 METERS

4. QUANTITY PER REEL: 250 PIECES

NATURAL CONVECTION

6 LAYER BOARD, D

2

PAK

125°C LEAD, 40°C AMBIENT

POWER, W

TEMPERATURE RISE,

°C

100

80

60

40

20

0

HS, 2 IN. BOARD

HS, 4 IN. BOARD

THERMAL PERFORMANCE

DATA

6 LAYER BOARD, D

2

PAK

AIR VELOCITY (LFM)

0

100

200

300

400

500

THERMAL RESISTANCE, C/W

30

25

20

15

10

0

.840

(21.3)

.350

(8.9)

.025

(0.6)

NO HS, 2 IN. BOARD

NO HS, 4 IN. BOARD

AIR PERPENDICULAR TO FINS

AIR PARALLEL TO FINS

Dimensions: in. (mm)

230 and 234 SERIES

Standard

P/N

230-75AB

230-75AB-01

230-75AB-05

230-75AB-10

234-75AB

234-75AB-01

234-75AB-05

Compact, Wavesolderable Low-Profile Self-Locking Heat Sinks

Footprint Dimensions

.570 in. (14.5) x .500 in. (12.7)

.750 in. (19.1) x .570 in. (14.5)

.570 in. (14.5) x .500 in. (12.7)

.790 in. (20.0) x .570 in. (14.5)

Mounting

Solderable

Configuration Tab Option

Vert./Horiz.

No Tab

Vertical

01

Horizontal

05

Vertical

10

Vert./Horiz.

No Tab

Vertical

01

Horizontal

05

TO-220

PATENT PENDING

Height Above

PC Board

.750 in. (19.1)

.500 in. (12.7)

.875 in. (22.2)

.790 in. (20.0)

.500 in. (12.7)

Mounting

Thermal Performance at Typical Load

Style

Natural Convection Forced Convection

Clip/Mtg Hole

57°C @ 2W

7.5°C/W @ 400 LFM

Clip/Mtg Hole

57°C @ 2W

7.5°C/W @ 400 LFM

Clip/Mtg Hole

57°C @ 2W

7.5°C/W @ 400 LFM

Clip/Mtg Hole

57°C @ 2W

7.5°C/W @ 400 LFM

Clip/Mtg Hole

57°C @ 2W

7.5°C/W @ 400 LFM

Clip/Mtg Hole

57°C @ 2W

7.5°C/W @ 400 LFM

Clip/Mtg Hole

57°C @ 2W

7.5°C/W @ 400 LFM

Compact, slim, labor-saving heat sinks with integral self locking features for TO-220 semiconductors. Their unique design (patent pending) ensures

uniform force applied to the component for effective and maximum thermal contact in horizontal or vertical mounting positions while eliminating

the need for fastening hardware. A mounting hole is available for hardware mounting when desired. The 230 and 234 Series can be used

interchangeably. The 234 Series has standoffs on the base of the heat sink. Specify solderable tab options by the addition of suffix 01, 05, or 10

to the standard part number (i.e. 230-75AB-01). Material: Aluminum, black anodized.

MECHANICAL DIMENSIONS

.500

(12.7)

.570 MAX

(14.5)

.125

(3.2)

.500

(12.7)

.750

(19.1)

.050

(1.3)

230-75AB

.500

(12.7)

.570 MAX

(14.5)

.500

(12.7)

.250

(6.4)

.063

(1.6)

234-75AB-01

.090

(2.3)

.210

(5.3)

230-75AB-01

230-75AB-10

230 AND 234 SERIES

.570 MAX

(14.5)

230

and

234

SERIES

.375

(9.5)

.020 TAB 10

(0.5)

.032 TAB 01

(0.8)

.050

(1.3)

.500 MIN

(12.7)

230-75AB-05

.750

(19.1)

230 SERIES

SUGGESTED TAB HOLE=

ø.075 (1.9) (PLATED)

WITH ø.100 (2.5) PAD

NATURAL AND FORCED

CONVECTION CHARACTERISTICS

HEAT SINK TEMPERATURE

RISE ABOVE AMBIENT AIR (

˚

C)

.032

(0.8)

AIR VELOCITY (LFM)

100

80

60

40

20

0

1

2

3

4

5

230/234

10

8

6

4

2

0

234-75AB

.720 .790

(18.3) (20.1)

234-75AB-05

2x.100

(2.5)

234 SERIES

SUGGESTED TAB HOLE=

ø.075 (1.9) (PLATED)

WITH ø.100 (2.5) PAD

.370

(9.4)

230/234

.540

(13.7)

.720 .790

(18.3) (20.1)

.430

(10.9)

.032

(0.8)

.165

(4.2)

2x.125

(3.2)

Dimensions: in. (mm)

.032

(0.8)

.050

(1.3)

.500

(12.7)

POWER DISSIPATION (WATTS)

Wakefield Engineering, Inc.

60 Audubon Road, Wakefield, MA 01880 USA

Tel: (617) 245-5900 • Fax: (617) 246-0874

2

Refer to

Full Line Catalog

for additional

Board-Level Heat Sinks and

Thermal Accessory Products

THERMAL RESISTANCE

SINK TO AMBIENT (

˚

C/WATT)

.165

(4.2)

0

200

400

600

800

1000

BOARD LEVEL

HEAT SINKS

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

233 and 236 SERIES

Self-Locking Wavesolderable Heat Sinks

TO-220

PATENT PENDING

Standard

Height Above

Mounting

Solderable

Mounting

Thermal Performance at Typical Load

P/N

PC Board

Footprint Dimensions

Configuration Tab Option

Style

Natural Convection Forced Convection

233-60AB

.600 in. (15.2)

.570 in. (14.5) x .500 in. (12.7)

Vert./Horiz.

No Tab

Clip/Mtg Hole

58°C @ 2W

11°C/W @ 400 LFM

233-60AB-01

.600 in. (15.2)

.570 in. (14.5) x .500 in. (12.7)

Vertical

01

Clip/Mtg Hole

58°C @ 2W

11°C/W @ 400 LFM

233-60AB-05

.500 in. (12.7)

.600 in. (15.2) x .570 in. (14.5)

Horizontal

05

Clip/Mtg Hole

58°C @ 2W

11°C/W @ 400 LFM

233-60AB-10

.725 in. (18.4)

.570 in. (14.5) x .500 in. (12.7)

Vertical

10

Clip/Mtg Hole

58°C @ 2W

11°C/W @ 400 LFM

236-150AB

1.500 in. (38.1)

.570 in. (14.5) x .500 in. (12.7)

Vert./Horiz.

No Tab

Clip/Mtg Hole

40°C @ 2W

4.8°C/W @ 400 LFM

236-150AB-01 1.500 in. (38.1)

.570 in. (14.5) x .500 in. (12.7)

Vertical

01

Clip/Mtg Hole

40°C @ 2W

4.8°C/W @ 400 LFM

236-150AB-05

.500 in. (12.7) 1.500 in. (38.1) x .570 in. (14.5)

Horizontal

05

Clip/Mtg Hole

40°C @ 2W

4.8°C/W @ 400 LFM

236-150AB-10 1.625 in. (41.3)

.570 in. (14.5) x .500 in. (12.7)

Vertical

10

Clip/Mtg Hole

40°C @ 2W

4.8°C/W @ 400 LFM

Compact labor-saving heat sinks with integral self-locking features ensure uniform force applied to the component for maximum thermal contact.

No installation tools required. Specify solderable tab options by the addition of suffix 01, 05, or 10 to the standard part number (i.e. 233-60AB-01).

Material: Aluminum, black anodized.

NATURAL AND FORCED

CONVECTION CHARACTERISTICS

AIR VELOCITY (LFM)

HEAT SINK TEMPERATURE

RISE ABOVE AMBIENT AIR ( C)

.500

(12.7)

MECHANICAL DIMENSIONS

233 AND 236 SERIES

.500

(12.7)

.500

(12.7)

.500 TYP

(12.7)

.570 MAX

(14.5)

2xø.150

(3.8)

.032 TAB 01

(0.8)

233-60AB-01

236-150AB-01

.250

(6.4)

.020 TAB 10

(0.5)

233-60AB-10

236-150AB-10

.125

(3.2)

.160

(4.1)

.570 MAX

(14.5)

“A”

100

80

60

40

20

0

15

12

233

236

233

236

9

6

3

5

0

.050

(1.3)

.032

(0.8)

.165

(4.2)

1.500

(38.1)

.570 MAX

(14.5)

.500 TYP

(12.7)

.600

(15.2)

236-150AB

233-60AB

.500 MIN

(12.7)

SERIES NUMBER

233-60AB

236-150AB

233-60AB-05

236-150AB-05

LENGTH “A”

.600 (15.2)

1.500 (38.1)

0

1

2

3

4

POWER DISSIPATION (WATTS)

SUGGESTED TAB HOLE =

Ø.075 (1.9) (PLATED)

WITH Ø.100 (2.5) PAD

.375

(9.5)

,050

(1.3)

.063

(1.5)

Dimensions: in. (mm)

275 and 231 SERIES

Compact, Stress-Free Labor-Saving Locking-Tab Heat Sinks

TO-220

PATENT 5381041

Standard

Height Above

Mounting

Solderable

Mounting

Thermal Performance at Typical Load

PC Board

2

Footprint Dimensions

Configuration Tab Option

1

Style

Natural Convection Forced Convection

P/N Ref

1

275-75AB

.750 in. (19.1) .835 in. (21.2) x .400 in. (10.2) Vert./Horiz.

No Tab

Clip/Mtg Hole

44°C @ 2W

7.9°C/W @ 400 LFM

275-75AB-01

.750 in. (19.1) .835 in. (21.2) x .400 in. (10.2)

Vertical

01

Clip/Mtg Hole

44°C @ 2W

7.9°C/W @ 400 LFM

275-75AB-10

.875 in. (22.2) .835 in. (21.2) x .400 in. (10.2)

Vertical

10

Clip/Mtg Hole

44°C @ 2W

7.9°C/W @ 400 LFM

231-69PAB

.690 in. (17.5) .835 in. (21.2) x .400 in. (10.2) Vert./Horiz.

No Tab

Clip/Mtg Hole

45°C @ 2W

8°C/W @ 400 LFM

231-69PAB-13H

.400 in. (10.2) .690 in. (17.5) x .835 in. (21.2) Horizontal

13H

Clip/Mtg Hole

45°C @ 2W

8°C/W @ 400 LFM

231-69PAB-XXX

.690 in. (17.5) .835 in. (21.2) x .400 in. (10.2)

Vertical

13V,14V,15V Clip/Mtg Hole

45°C @ 2W

8°C/W @ 400 LFM

231-75PAB

.750 in. (19.1) .835 in. (21.2) x .400 in. (10.2) Vert./Horiz.

No Tab

Clip/Mtg Hole

43°C @ 2W

7.9°C/W @ 400 LFM

231-75PAB-13H

.400 in. (10.2) .750 in. (19.1) x .835 in. (21.2) Horizontal

13H

Clip/Mtg Hole

43°C @ 2W

7.9°C/W @ 400 LFM

231-75PAB-XXX

.750 in. (19.1) .835 in. (21.2) x .400 in. (10.2)

Vertical

13V,14V,15V Clip/Mtg Hole

43°C @ 2W

7.9°C/W @ 400 LFM

231-137PAB

1.375 in. (34.9) .835 in. (21.2) x .400 in. (10.2) Vert./Horiz.

No Tab

Clip/Mtg Hole

32°C @ 2W

5.9°C/W @ 400 LFM

231-137PAB-13H .400 in. (10.2) 1.375 in. (34.9) x .835 in. (21.2) Horizontal

13H

Clip/Mtg Hole

32°C @ 2W

5.9°C/W @ 400 LFM

231-137PAB-XXX 1.375 in. (34.9) .835 in. (21.2) x .400 in. (10.2)

Vertical

13V,14V,15V Clip/Mtg Hole

32°C @ 2W

5.9°C/W @ 400 LFM

Unique stress-free labor-saving locking-tab design ensures reliable device-to-heat-sink surface contact while providing rapid component

installation and removal without tools (See also 235 Series).

Note

1

:

Specify solderable tab options by the addition of suffix 01, 10, 13H, 13V, 14V

or 15V to the standard part number (i.e. 231-75PAB-14V).

Note

2

:

Add .125 in. (3.2) for TAB 15V. Material: Aluminum, pre-anodized black.

Dimple on 231-69, 275-75 Series only

Lance not

available

on 231-69

and 275-

75 Series

MECHANICAL DIMENSIONS

Dimple not

available on

275-75 Series

.020 (0.5)

275

SERIES

.025 (0.6)

231

SERIES

275 AND 231 SERIES

HEAT SINK TEMPERATURE

RISE ABOVE AMBIENT AIR (

˚

C)

.855

(21.7)

NATURAL AND FORCED

CONVECTION CHARACTERISTICS

AIR VELOCITY (LFM)

100

80

60

40

20

0

1

2

231-75PAB

20

16

12

8

4

275-75AB

“A”

.835

(21.2)

ø.150

(3.8)

.020

TAB 13H

(0.5)

.855

(21.7)

HORIZONTAL MOUNT

TABS 13V, 14V, 15V

SUGGESTED TAB HOLES

FOR ALL PART NUMBERS

(VERTICAL AND HORIZONTAL MOUNTING)=

Ø.075 (1.9) (PLATED) WITH Ø.100 (2.5) PAD

231-75PAB

275-75AB

.835 REF

(21.2)

All Versions No Tab

.400 REF

(10.2)

TAB

14V

.375

(9.5)

TAB

13V

,125

(3.2)

.020 (0.5)

(TABS 13V, 14V, 15V)

VERTICAL MOUNT

.400 REF

(10.2)

3

4

5

0

POWER DISSIPATION (WATTS)

.125 REF

(3.2)

.250

(6.4)

.062 REF

(1.6)

.125 (3.2)

.185 (4.7)

TAB 15V

.125

(3.2)

SERIES NO.

231-69PAB

.400 REF

(10.2)

.062 REF

(1.6)

231-75PAB

275-75AB

231-137PAB

DIM “A”

.690 (17.5)

.750 (19.1)

1.375 (34.9)

DIM “B”

.345 (8.8)

.375 (9.5)

——

.688 (17.5)

.050

(1.3)

TAB 01

.063

(1.5)

.125

(3.2)

NATURAL AND FORCED

CONVECTION CHARACTERISTICS

AIR VELOCITY (LFM)

HEAT SINK TEMPERATURE

RISE ABOVE AMBIENT AIR (

˚

C)

.375

(9.5)

100

80

60

40

20

0

20

16

12

.375

(9.5)

.062 REF

(1.6)

.185

(4.7)

.032 (TAB01)

(0.8)

.020 (TAB10)

(0.5)

231-69PAB

TAB 10

TABS 01 AND 10

SUGGESTED TAB HOLE=

ø.075 (1.9) (PLATED)

WITH ø.100 (2.5) (PAD)

231-69PAB

231-137PAB

8

4

5

0

TAB 13H

“B”

0

1

2

3

4

POWER DISSIPATION (WATTS)

Dimensions: in. (mm)

Refer to

Full Line Catalog

for additional

Board-Level Heat Sinks and

Thermal Accessory Products

3

Wakefield Engineering, Inc.

60 Audubon Road, Wakefield, MA 01880 USA

Tel: (617) 245-5900 • Fax: (617) 246-0874

THERMAL RESISTANCE

SINK TO AMBIENT (

˚

C/WATT)

0

200

400

600

800

1000

THERMAL RESISTANCE

SINK TO AMBIENT (

˚

C/WATT)

0

200

400

600

800

1000

THERMAL RESISTANCE

SINK TO AMBIENT ( C/WATT)

0

200

400

600

800

1000

BOARD LEVEL

HEAT SINKS

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

235 SERIES

Standard

P/N

235-85AB

235-85AB-01

235-85AB-05

235-85AB-10

PATENT 5381041

Compact, Stress-Free Labor-Saving Locking-Tab Heat Sinks

Height Above

PC Board

.850 in. (21.6)

.500 in. (12.7)

.975 in. (24.8)

Mounting

Solderable

Footprint Dimensions

Configuration Tab Option

1.000 in. (25.4) x .500 in. (12.7) Vert./Horiz.

No Tab

1.000 in. (25.4) x .500 in. (12.7)

Vertical

01

.850 in. (21.6) x 1.000 in. (25.4) Horizontal

05

1.000 in. (25.4) x .500 in. (12.7)

Vertical

10

TO-220

Mounting

Thermal Performance at Typical Load

Style

Natural Convection Forced Convection

Clip/Mtg Hole

40°C @ 2W

6.8°C/W @ 400 LFM

Clip/Mtg Hole

40°C @ 2W

6.8°C/W @ 400 LFM

Clip/Mtg Hole

40°C @ 2W

6.8°C/W @ 400 LFM

Clip/Mtg Hole

40°C @ 2W

6.8°C/W @ 400 LFM

Unique stress-free labor-saving locking-tab design ensures reliable device-to-heat-sink surface contact for TO-220 components. The 235 Series

maximizes surface area providing more effective cooling of components mounted either horizontally or vertically. Components insert quickly and

easily without the use of installation tools by depressing heat sink sides, reducing process time and assembly costs. A mounting hole is available

for hardware mounting when desired. Models are available with or without solderable tab options. Specify solderable tab options by the addition

of suffix 01, 05, or 10 to the standard part number (i.e. 235-85AB-01). Material: Aluminum, black anodized.

1.00

(25.4)

235-85AB

.50

(12.7)

MECHANICAL DIMENSIONS

.850

(21.6)

235 SERIES

HEAT SINK TEMPERATURE

RISE ABOVE AMBIENT AIR (

˚

C)

NATURAL AND FORCED

CONVECTION CHARACTERISTICS

AIR VELOCITY (LFM)

100

80

60

40

20

0

1

2

3

4

5

10

8

6

4

2

0

THERMAL RESISTANCE

SINK TO AMBIENT (

˚

C/WATT)

THERMAL RESISTANCE

SINK TO AMBIENT (

˚

C/WATT)

THERMAL RESISTANCE

CASE TO AMBIENT (

˚

C/WATT)

0

200

400

600

800

1000

.500

(12.7)

.850

(21.6)

.125

(3.2)

1.00 REF

(25.4)

.500

(4.1)

(12.7)

.250

(6.4)

235-85AB-05

.032

(0.8)

.850

(21.6)

.050

(1.3)

235-85AB-01

.063

(1.5)

.375

(9.5)

.160

.032 (TAB01)

(0.8)

.020 (TAB10)

(0.5)

235-85AB-10

.500 MIN

(12.7)

.050

(1.3)

POWER DISSIPATION (WATTS)

.165

(4.2)

Dimensions: in. (mm)

SUGGESTED TAB HOLE=

ø.075 (1.9) (PLATED)

WITH ø.100 (2.5) (PAD)

243 SERIES

Standard

P/N

243-1PAB

243-3PAB

Labor-Saving Clip-On Heat Sinks

Height Above

PC Board

1.000 in. (25.4)

.800 in. (20.3)

Footprint Dimensions

.800 in. (20.3) x .270 in. (6.9)

Mounting

Solderable

Configuration Tab Option

Vert./Horiz.

No Tab

Vert./Horiz.

No Tab

Mounting

Style

Clip

TO-220

Thermal Performance at Typical Load

Natural Convection Forced Convection

50°C@ 2W

4.5°C/W @ 400 LFM

78°C@ 2W

8.2°C/W @ 400 LFM

Rapid component alignment and installation of TO-220 components is achieved with the 243 Series Clip-On design while ensuring reliable device-

to-heat-sink surface contact for maximum thermal efficiency. Components insert quickly and easily without the use of installation tools, reducing

process time and assembly costs. Material: Aluminum, pre-anodized black.

MECHANICAL DIMENSIONS

.800

(20.3)

A

.100

(2.5)

.310

(7.9)

.50

(12.7)

SECTION A-A

.270

(6.9)

.068

(1.7)

243 SERIES

CASE TEMPERATURE

RISE ABOVE AMBIENT AIR (

˚

C)

100

80

60

40

20

0

NATURAL AND FORCED

CONVECTION CHARACTERISTICS

AIR VELOCITY (LFM)

0

200

400

600

800

1000

20

16

12

243-3PAB

243-1PAB

MIN.FLAT

A

.50 REF.

(12.7)

B

A

.440

(11.2)

243-3PAB

243-1PAB

VIEW B-B

8

4

5

0

PART NUMBER

243-1PAB

243-3PAB

DIM A

1.000 (25.4)

.800 (20.3)

Dimensions: in. (mm)

0

1

2

3

4

POWER DISSIPATION (WATTS)

239 SERIES

Snap-Down Self-Locking Heat Sinks

TO-220

PATENT PENDING

Standard

Height Above

Mounting

Solderable

Mounting

Thermal Performance at Typical Load

P/N

PC Board

Footprint Dimensions

Configuration Tab Option

Style

Natural Convection Forced Convection

239-75AB

.750 in. (19.1) 1.120 in. (28.4) x .435 in. (11.0) Vert./Horiz.

No Tab

Clip/Mtg Hole

38°C @ 2W

6°C/W @ 400 LFM

239-75AB-03

.750 in. (19.1) 1.120 in. (28.4) x .435 in. (11.0)

Vertical

03

Clip/Mtg Hole

38°C @ 2W

6°C/W @ 400 LFM

239-75AB-04

.750 in. (19.1) 1.120 in. (28.4) x .435 in. (11.0)

Vertical

04

Clip/Mtg Hole

38°C @ 2W

6°C/W @ 400 LFM

Snap-down heat sinks for TO-220 devices mounted either vertically or horizontally. Integral self-locking-fin features eliminate the need for installation

tools or other hardware typically required for installation or removal of components. A hole is available for hardware mounting when desired. Unique

fin design aligns the component and securely retains it when “Snapped” into the heat sink for reliable component operation. Specify solderable tab

options by the addition of suffix 03 or 04 to the standard part number (i.e. 239-75AB-03). Material: Aluminum, black anodized.

239 SERIES

A

SECTION A-A

ø.150

(3.8)

.435

(11.1)

MECHANICAL DIMENSIONS

ø.150

(3.8)

239-75AB

.435

(11.1)

NATURAL AND FORCED

CONVECTION CHARACTERISTICS

AIR VELOCITY (LFM)

HEAT SINK TEMPERATURE

RISE ABOVE AMBIENT AIR (

˚

C)

100

80

60

40

20

0

1

2

3

4

POWER DISSIPATION (WATTS)

5

0

200

400

600

800

1000

20

16

12

8

4

0

.750

(19.1)

A

.49

(22.9)

.275

(7.0)

.530

(13.5)

1.120

(28.4)

.435

(11.0)

TAB 03

239-75AB-03

TAB 04

239-75AB-04

SUGGESTED TAB HOLE =

ø.075 (1.9) (PLATED)

WITH ø.100 (2.5) (PAD)

.062

(1.6)

.125 .375

(3.2) (9.5)

.020

(0.5)

Dimensions: in. (mm)

Wakefield Engineering, Inc.

60 Audubon Road, Wakefield, MA 01880 USA

Tel: (617) 245-5900 • Fax: (617) 246-0874

4

Refer to

Full Line Catalog

for additional

Board-Level Heat Sinks and

Thermal Accessory Products

BOARD LEVEL

HEAT SINKS

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

273 SERIES

Low-Cost, Low-Height Wavesolderable Heat Sinks

TO-218, TO-220

Standard

Height Above

Mounting

Solderable

Mounting

Thermal Performance at Typical Load

P/N

PC Board

Footprint Dimensions

Configuration Tab Option

Style

Natural Convection Forced Convection

273-AB

.375 in. (9.5) .750 in. (19.1) x .750 (19.1) Vertical/Horizontal

No Tab

Mtg Hole

49°C @ 2W

7.2°C/W @ 400 LFM

273-AB-01

.375 in. (9.5) .750 in. (19.1) x .750 (19.1)

Vertical

01

Mtg Hole

49°C @ 2W

7.2°C/W @ 400 LFM

273-AB-02

.375 in. (9.5) .750 in. (19.1) x .750 (19.1)

Vertical

02

Mtg Hole

49°C @ 2W

7.2°C/W @ 400 LFM

This low-cost, low-profile wavesolderable heat sink occupies minimum space and is ideal for use with many low-power semiconductors in a variety

of applications. The heat sink can be mounted vertically or horizontally on printed circuit boards. Specify solderable tab options by the addition of

suffix 01 or 02 to the standard part number (i.e. 273-AB-01). Material: Aluminum, black anodized.

MECHANICAL DIMENSIONS

.150 DIA THRU

(3.8)

.050

(1.3)

.250

(6.4)

.525

(13.3)

.375

(9.5)

.750

(19.1)

.050

(1.3)

273-AB-01

.032

(0.8)

.050

(1.3)

273-AB-02

.032

(0.8)

273 SERIES

HEAT SINK TEMPERATURE

RISE ABOVE AMBIENT AIR (

˚

C)

NATURAL AND FORCED

CONVECTION CHARACTERISTICS

AIR VELOCITY (LFM)

THERMAL RESISTANCE

SINK TO AMBIENT (

˚

C/WATT)

THERMAL RESISTANCE

SINK TO AMBIENT (

˚

C/WATT)

THERMAL RESISTANCE

SINK TO AMBIENT (

˚

C/WATT)

100 0

90

80

70

60

50

40

30

20

10

0

200

400

600

800

1000 20

.750

(19.1)

.375

(9.5)

273-AB

Note:

1. Suggested Tab Hole = ø.075 (1.9) (Plated) with ø.100 (2.5) pad

0

Dimensions: in. (mm)

18

16

14

SERIES 273 AB

12

10

8

6

4

2

0

0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

POWER DISSIPATION (WATTS)

274 SERIES

Low-Cost, Low-Height Wavesolderable Heat Sinks

TO-220

Standard

Height Above

Mounting

Solderable

Mounting

Thermal Performance at Typical Load

P/N

PC Board “A”

Footprint Dimensions

Configuration Tab Option

Style

Natural Convection Forced Convection

274-1AB

.375 in. (9.5)

.520 in. (13.2) x .750 in. (19.1) Vertical/Horizontal

No Tab

Mtg Hole

56°C @ 2W

8.0°C/W @ 400 LFM

274-1AB-01

.375 in. (9.5)

.520 in. (13.2) x .750 in. (19.1)

Vertical

01

Mtg Hole

56°C @ 2W

8.0°C/W @ 400 LFM

274-1AB-02

.375 in. (9.5)

.520 in. (13.2) x .750 in. (19.1)

Vertical

02

Mtg Hole

56°C @ 2W

8.0°C/W @ 400 LFM

274-2AB

.500 in. (12.7)

.520 in. (13.2) x .750 in. (19.1) Vertical/Horizontal

No Tab

Mtg Hole

50°C @ 2W

7.0°C/W @ 400 LFM

274-2AB-01

.500 in. (12.7)

.520 in. (13.2) x .750 in. (19.1)

Vertical

01

Mtg Hole

50°C @ 2W

7.0°C/W @ 400 LFM

274-2AB-02

.500 in. (12.7)

.520 in. (13.2) x .750 in. (19.1)

Vertical

02

Mtg Hole

50°C @ 2W

7.0°C/W @ 400 LFM

274-3AB

.250 in. (6.4)

.520 in. (13.2) x .750 in. (19.1) Vertical/Horizontal

No Tab

Mtg Hole

62°C @ 2W

9.0°C/W @ 400 LFM

274-3AB-01

.250 in. (6.4)

.520 in. (13.2) x .750 in. (19.1)

Vertical

01

Mtg Hole

62°C @ 2W

9.0°C/W @ 400 LFM

274-3AB-02

.250 in. (6.4)

.520 in. (13.2) x .750 in. (19.1)

Vertical

02

Mtg Hole

62°C @ 2W

9.0°C/W @ 400 LFM

Similar to the 273 Series, the 274 Series has a narrower footprint width for use on densely populated circuit boards. Use these types when space is at

a premium and low cost is needed. Specify solderable tab options by the addition of suffix 01 or 02 to the standard part number (i.e. 274-1AB-01).

Material: Aluminum, black anodized.

MECHANICAL DIMENSIONS

.520

(13.2)

274 SERIES

274-XAB-01

NATURAL AND FORCED

CONVECTION CHARACTERISTICS

AIR VELOCITY (LFM)

HEAT SINK TEMPERATURE

RISE ABOVE AMBIENT AIR (

˚

C)

274-XAB-02

.150 DIA THRU

(3.8)

.750

(19.1)

100

80

60

40

20

0

200

400

600

274 1AB

800

1000 20

.750

(19.1)

.525

(13.3)

.050

(1.3)

274-XAB

“A”

.050

(1.3)

.250

(6.4)

.032

(0.8)

.050

(1.3)

.375

(9.5)

.032

(0.8)

Ø.075 (1.9) (plated) Ø.100 (2.5) pad

PCB recommended hole/pad size

0

Dimensions: in. (mm)

18

16

14

274 2AB

12

10

8

274 1AB

6

274 2AB

4

2

0

0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

POWER DISSIPATION (WATTS)

240 SERIES

Labor-Saving Twisted Fin Heat Sinks

Solderable

Tab Option

22

TO-220

Mounting

Thermal Performance at Typical Load

Style

Natural Convection Forced Convection

Clip/Mtg Hole

55°C @ 4W

5.3°C/W @ 400 LFM

Clip/Mtg Slot

55°C @ 4W

5.3°C/W @ 400 LFM

Standard

Height Above

Mounting

P/N

PC Board

Footprint Dimensions

Configuration

240-118ABH-22 1.180 in. (30.0) 1.000 in. (25.4) x .500 in. (12.7)

Vertical

240-118ABS-22 1.180 in. (30.0) 1.000 in. (25.4) x .500 in. (12.7)

Vertical

Twisted fin design for efficient cooling of vertically mounted TO-220 devices occupies minimum board space. Heat sinks are available with a

mounting hole or mounting slot and optional labor-saving clip attachments.

Order SpeedClips

TM

285SC or 330SC separately

for rapid component

installation, lowering manufacturing costs . Standard solderable tab option is specified by the addition of suffix 22 to the standard part number (i.e.

240-118ABH-22 or 240-118ABS-22). Material: Aluminum, black anodized.

1.000

(25.4)

ø.125

(3.2)

.400

(10.2)

.700

(17.8)

240-118ABS-22

.280

(7.1)

.950

(24.1)

240-118ABH-22

.065 x .150

(1.7) (3.8)

2 SLOTS

.150 TAB 22

(3.8)

.700

(17.8)

.150

(3.8)

.375

(9.5)

MECHANICAL DIMENSIONS

.500

(12.7)

SEE

DETAIL A

.040

(1.0)

2x .070

(1.8)

.300

(7.6)

2x.060

(1.5)

.680

(17.3)

NATURAL AND FORCED

CONVECTION CHARACTERISTICS

AIR VELOCITY (LFM)

HEAT SINK TEMPERATURE

RISE ABOVE AMBIENT AIR (

˚

C)

100

80

60

40

20

0

2

4

6

8

POWER DISSIPATION (WATTS)

0

200

400

600

800

1000

10

8

6

4

2

0

10

1.180

(30.0)

TAB HOLES

.950

(24.1)

.032 2 PL

(0.8)

.560

(14.2)

.400

(10.2)

ø.100 PLATED

(2.5)

.075

(1.9)

240 SERIES

STAINLESS STEEL 330SC 4#

SPRING STEEL 285SC 10#

Dimensions: in. (mm)

Order SpeedClips™ Separately

Refer to

Full Line Catalog

for additional

Board-Level Heat Sinks and

Thermal Accessory Products

5

Wakefield Engineering, Inc.

60 Audubon Road, Wakefield, MA 01880 USA

Tel: (617) 245-5900 • Fax: (617) 246-0874

BOARD LEVEL

HEAT SINKS

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

242 SERIES

Standard

P/N

242-125AB-22

Low-Height, Low-Profile Twisted Fin Heat Sinks

Height Above

PC Board

1.285 in. (32.6)

Footprint Dimensions

.875 in. (22.2) x .250 in. (6.4)

Mounting

Solderable

Configuration Tab Option

Vertical

22

Mounting

Style

Mtg Hole

TO-220

Thermal Performance at Typical Load

Natural Convection Forced Convection

48°C @ 2W

6.2°C/W @ 400 LFM

Efficient, low-profile twisted fin heat sinks for vertical mounting of TO-220 devices. Its slim design minimizes PC board space occupied and the

alternating twisted fins increase air turbulence for improved cooling. Standard models include wavesolderable tinned tabs for direct PC board

mounting. Specify part number 242-125AB-22. Material: Aluminum, black anodized.

.450

(11.4)

FLAT

ø.125

(3.2)

MECHANICAL DIMENSIONS

P.C. BOARD MTG. SUR-

FACE

.250

(6.4)

242 SERIES

HEAT SINK TEMPERATURE

RISE ABOVE AMBIENT AIR (

˚

C)

NATURAL AND FORCED

CONVECTION CHARACTERISTICS

AIR VELOCITY (LFM)

100

80

60

40

20

0

1

2

3

4

POWER DISSIPATION (WATTS)

5

20

16

12

8

4

0

THERMAL RESISTANCE

SINK TO AMBIENT (

˚

C/WATT)

10

8

6

4

2

0

2

4

6

8

POWER DISSIPATION (WATTS)

TAB HOLES

ø.130 PLATED

(3.3)

0

200

400

600

800

1000

1.250

(31.8)

.770

(19.6)

242-125AB-22

ø.100 PLATED

(2.5)

.185

(4.7)

2x.075

(1.9)

.700

(17.8)

.875

(22.2)

.032

(0.8)

PARTIAL VIEW

ONLY NEAR SIDE FINS SHOWN

.150

(3.8)

.700

(17.8)

TAB HOLES

Dimensions: in. (mm)

232 and 238 SERIES

Standard

P/N

232-200AB

232-200AB-23

238-200AB

238-200AB-23

Staggered Fin Heat Sinks for Vertical Mounting

Footprint Dimensions

1.380 in. (35.1) x .500 in. (12.7)

TO-202, TO-220

Height Above

PC Board

2.000 in. (50.8)

Mounting

Tab Options Mounting

Thermal Performance at Typical Load

Configuration

Type

Style

Natural Convection Forced Convection

Vertical

2, Twisted Clip/Mtg Hole

48°C @ 4W

3.3°C/W @ 400 LFM

Vertical

2, Solderable Clip/Mtg Hole

48°C @ 4W

3.3°C/W @ 400 LFM

Vertical

2, Twisted

Mtg Slot

48°C @ 4W

3.3°C/W @ 400 LFM

Vertical

2, Solderable

Mtg Slot

48°C @ 4W

3.3°C/W @ 400 LFM

Staggered fin design for efficient cooling of TO-202 (Series 238) and TO-220 (Series 232) semiconductor devices. Models mount vertically and are

available with two solderable tabs (232-200AB-23 or 238-200AB-23) or two twisted tabs (232-200AB or 238-200AB).

Order SpeedClips™ 285SC

or 330SC separately

(232 Series only) for rapid component installation, lowering manufacturing costs. Material: Aluminum, black anodized.

MECHANICAL DIMENSIONS

232 SERIES

232-200AB

ø.125 PL

(3.2)

Optional

SpeedClip

™

Mounting

2.000

(50.8)

Optional

SpeedClip

™

Mounting

.382

(9.7)

.097

(2.5)

.375

(9.5)

238-200AB

.125

(3.2)

238-200AB-23

232-200AB-23

238 SERIES

232 AND 238 SERIES

HEAT SINK TEMPERATURE

RISE ABOVE AMBIENT AIR (

˚

C)

.500

(12.7)

NATURAL AND FORCED

CONVECTION CHARACTERISTICS

AIR VELOCITY (LFM)

100

80

60

40

20

0

THERMAL RESISTANCE

SINK TO AMBIENT (

˚

C/WATT)

THERMAL RESISTANCE

SINK TO AMBIENT (

˚

C/WATT)

0

200

400

600

800

1000

2.000

(50.8)

1.000

.720 (25.4)

(18.3)

.187

(4.8)

.700

(17.8)

.187

(4.8)

.097

(2.5)

1.000

(25.4)

.100 REF

(2.5)

.187

(4.8)

.100 REF

.440

(2.5)

(11.2)

.440

1.000

(11.2)

(25.4)

1.000

(25.4)

.050

(1.3)

.150

(3.8)

.032 REF

(0.8)

0

10

Stainless

Steel

330SC 4#

Spring

Steel

285SC 10#

.650 FLAT

(16.5)

Order SpeedClips™ Separately

Dimensions: in. (mm)

1.380

(35.1)

1.000

(25.4)

251 SERIES

Slim-Profile Heat Sinks With Integral Clips

15 Lead Multiwatt

Standard

Height Above

Mounting

Solderable Mounting

Thermal Performance at Typical Load

P/N

PC Board

Footprint Dimensions

Configuration Tab Option

Style

Natural Convection Forced Convection

251-62AB

.620 in. (15.7)

.910 in. (23.1) x .380 in. (9.7) Vertical/Horizontal No Tab

Clip

66°C @ 3W

6.6°C/W @ 400 LFM

251-80AB

.845 in. (21.5)

.910 in. (23.1) x .380 in. (9.7) Vertical/Horizontal No Tab

Clip

64°C @ 3W

6.4°C/W @ 400 LFM

251-80AB-19

.875 in. (22.2)

.910 in. (23.1) x .380 in. (9.7)

Vertical

19

Clip

64°C @ 3W

6.4°C/W @ 400 LFM

Lightweight, slim-profile heat sinks with integral self-locking clips occupy minimum board real estate and reduce assembly costs. Their small

footprint is ideal for a variety of low-power multiwatt component applications. Models are available in heights of .620 in. (15.7) and .845 in.

(21.5). Specify solderable tab option for the 251-80AB (only) by the addition of suffix 19 to the standard part number (i.e. 251-80AB-19).

Material: Aluminum, black anodized.

MECHANICAL DIMENSIONS

251 SERIES

HEAT SINK TEMPERATURE

RISE ABOVE AMBIENT AIR (

˚

C)

NATURAL AND FORCED

CONVECTION CHARACTERISTICS

AIR VELOCITY (LFM)

100

80

60

40

20

0

251-80AB

251-62AB

.460

(11.7)

.620

(15.8)

0

200

400

600

800

1000

.640

(16.3)

.800

(20.3)

20

16

12

8

4

.045

(1.1)

.120

(3.1)

.200

(5.1)

251-62AB

251-80AB

.910

(23.1)

251-62AB

.380

(9.7)

251-80AB

2x.060

(1.5)

.875

(22.2)

.150

(3.8)

.112

(2.8)

251-80AB-19

.032

(0.8)

.875

(22.2)

.050

(1.3)

.187

(4.8)

Suggested Tab Holes

ø.075 (1.9) (Plated)

with ø.100 (2.5) PAD

2x.170

(4.3)

Dimensions: in. (mm)

1

2

3

4

POWER DISSIPATION (WATTS)

5

0

Wakefield Engineering, Inc.

60 Audubon Road, Wakefield, MA 01880 USA

Tel: (617) 245-5900 • Fax: (617) 246-0874

6

Refer to

Full Line Catalog

for additional

Board-Level Heat Sinks and

Thermal Accessory Products

Parameter Name	Attribute value
Maker	Wakefield-Vette
Reach Compliance Code	compli

	274-1AB-02	239-75AB-03	275-75AB-01	626-25ABP	235-85AB-05	235-85AB-10	273-AB-02	274-2AB-02	238-200AB-23
Description	Heat Sink	Heat Sink	Heat Sink	Heat Sink	Heat Sink	Heat Sink	Heat Sink	Heat Sink	Heat Sink
Reach Compliance Code	compli	compliant	compliant	compliant	compli	compli	compli	compli	compliant
Maker	Wakefield-Vette	Wakefield-Vette	Wakefield-Vette	-	Wakefield-Vette	Wakefield-Vette	Wakefield-Vette	Wakefield-Vette	Wakefield-Vette

274-1AB-02

274-1AB-02 Overview

274-1AB-02 Parametric

Preview

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