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Z87L0216ASC

Description
Baseband Circuit, CMOS, PQFP100, VQFP-100
CategoryWireless rf/communication    Telecom circuit   
File Size1MB,112 Pages
ManufacturerZilog, Inc.
Websitehttps://www.zilog.com/
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Z87L0216ASC Overview

Baseband Circuit, CMOS, PQFP100, VQFP-100

Z87L0216ASC Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerZilog, Inc.
Parts packaging codeQFP
package instructionLFQFP, QFP100,.63SQ,20
Contacts100
Reach Compliance Codeunknow
JESD-30 codeS-PQFP-G100
JESD-609 codee0
length14 mm
Number of functions1
Number of terminals100
Maximum operating temperature70 °C
Minimum operating temperature-20 °C
Package body materialPLASTIC/EPOXY
encapsulated codeLFQFP
Encapsulate equivalent codeQFP100,.63SQ,20
Package shapeSQUARE
Package formFLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)240
power supply3 V
Certification statusNot Qualified
Maximum seat height1.6 mm
Maximum slew rate0.025 mA
Nominal supply voltage3 V
surface mountYES
technologyCMOS
Telecom integrated circuit typesCORDLESS TELEPHONE BASEBAND CIRCUIT
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width14 mm
wireless avenue for communications
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Z87L0216ASC Related Products

Z87L0216ASC Z87L0216FSC Z87L0316ASC
Description Baseband Circuit, CMOS, PQFP100, VQFP-100 Baseband Circuit, CMOS, PQFP100, QFP-100 Baseband Circuit, CMOS, PQFP144, VQFP-144
Is it Rohs certified? incompatible incompatible incompatible
Maker Zilog, Inc. Zilog, Inc. Zilog, Inc.
Parts packaging code QFP QFP QFP
package instruction LFQFP, QFP100,.63SQ,20 QFP, LFQFP, QFP144,.87SQ,20
Contacts 100 100 144
Reach Compliance Code unknow unknown unknown
JESD-30 code S-PQFP-G100 R-PQFP-G100 S-PQFP-G144
length 14 mm 20 mm 20 mm
Number of functions 1 1 1
Number of terminals 100 100 144
Maximum operating temperature 70 °C 70 °C 70 °C
Minimum operating temperature -20 °C -20 °C -20 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LFQFP QFP LFQFP
Package shape SQUARE RECTANGULAR SQUARE
Package form FLATPACK, LOW PROFILE, FINE PITCH FLATPACK FLATPACK, LOW PROFILE, FINE PITCH
Certification status Not Qualified Not Qualified Not Qualified
Maximum seat height 1.6 mm 3.1 mm 1.6 mm
Nominal supply voltage 3 V 3 V 3 V
surface mount YES YES YES
technology CMOS CMOS CMOS
Telecom integrated circuit types CORDLESS TELEPHONE BASEBAND CIRCUIT CORDLESS TELEPHONE BASEBAND CIRCUIT CORDLESS TELEPHONE BASEBAND CIRCUIT
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form GULL WING GULL WING GULL WING
Terminal pitch 0.5 mm 0.65 mm 0.5 mm
Terminal location QUAD QUAD QUAD
width 14 mm 14 mm 20 mm
JESD-609 code e0 - e0
Encapsulate equivalent code QFP100,.63SQ,20 - QFP144,.87SQ,20
Peak Reflow Temperature (Celsius) 240 - 240
power supply 3 V - 3 V
Maximum slew rate 0.025 mA - 0.025 mA
Terminal surface Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb)
Maximum time at peak reflow temperature NOT SPECIFIED - NOT SPECIFIED

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