TACmicrochip
The world’s smallest surface mount
Tantalum capacitor, small enough to
create space providing room for ideas
to grow.
TACmicrochip is a major breakthrough
in miniaturization without reduction in
performance.
It offers you the highest energy store
in an 0603 or 0805 case size; enhanced
high frequency operation through unique
ESR performance with temperature and
voltage stability.
L
CASE DIMENSIONS:
millimeters (inches)
Code
L
POLARITY BAND NOT
TO EXCEED CENTER LINE
EIA
Code
0603
0805
W +0.20 (0.008)
-0.10 (0.004)
0.85 (0.033)
1.35 (0.053)
L +0.25 (0.010)
-0.15 (0.006)
1.6 (0.063)
2.0 (0.079)
H +0.20 (0.008)
-0.10 (0.004)
0.85 (0.033)
1.35 (0.053)
t (min.)
0.15 (0.006)
0.15 (0.006)
D (min.)
0.70 (0.028)
0.90 (0.035)
R
NOTE:
Terminations are plated 100% Su.
H
t
D
W
STANDARD CAPACITANCE RANGE (LETTER DENOTES CASE SIZE)
Capacitance
µF
0.47
0.68
1.0
1.5
2.2
3.3
4.7
6.8
10.0
15.0
22.0
33.0
47.0
68.0
2.0V
Rated voltage to 85°C
3.0V
4.0V
6.3V
10V
L
L
L
L
L
L/R
L/R
R
R
R
16V
L
L
L
L
R
R
R
L
L
L
L
L
R
/R
R
R
R
L
L
L
L
L
L/R
R
/R
/R
L
L
L
L
L
R
L/R
/R
R
L
•
= In Development
18
TACmicrochip
HOW TO ORDER
TAC
L
225
M
003
R
**
Type
TACmicrochip
Case Code
0603=L
0805=R
Capacitance Code
pF code: 1st two
digits represent
significant figures,
3rd digit represents
multiplier (number of
zeros to follow)
Tolerance
K=±10%
M=±20%
Rated DC Voltage
002=2Vdc
003=3Vdc
004=4Vdc
006=6.3Vdc
010=10Vdc
016=16Vdc
Packaging
Additional
X=8mm 4-1/4"
characters may be
Tape & Reel
add for special
requirements
R=7" Tape & Reel
(see page 49)
RATINGS AND PART NUMBER REFERENCE
0603 / CASE CODE L
AVX
Style
Case Capacitance
Size
µF@120Hz
Leakage
µA
(Max)
DF
%
Max
ESR
Max
@100kHz
0805 / CASE CODE R
AVX
Style
Case Capacitance
Size
µF@120Hz
Leakage
µA
(Max)
DF
%
Max
ESR
Max
@100kHz
2 v @ 85°C
TACL335*002#
TACL475*002#
TACL685*002#
0603
0603
0603
3.3
4.7
6.8
0.5
0.5
0.5
6
6
6
10
10
10
TACR226*002#
TACR336*002#
TACR476*002#
0805
0805
0805
2 v @ 85°C
22
33
47
0.5
0.7
1.0
8
8
10
6
6
6
3 v @ 85°C
TACL225*003#
TACL335*003#
TACL475*003#
TACL685*003#
TACL106*003#
0603
0603
0603
0603
0603
2.2
3.3
4.7
6.8
10
0.5
0.5
0.5
0.5
0.5
6
6
6
10
10
10
10
10
10
10
TACR156*003#
TACR226*003#
TACR336*003#
TACR476*003#
0805
0805
0805
0805
3 v @ 85°C
15
22
33
47
0.5
0.7
1.0
1.5
8
8
8
10
6
6
6
6
4 v @ 85°C
TACL155*004#
TACL225*004#
TACL335*004#
TACL475*004#
TACL685*004#
0603
0603
0603
0603
0603
1.5
2.2
3.3
4.7
6.8
0.5
0.5
0.5
0.5
0.5
6
6
6
6
6
10
10
10
10
10
4 v @ 85°C
TACR106*004#
TACR156*004#
TACR226*004#
TACR336*004#
0805
0805
0805
0805
10
15
22
33
0.5
0.6
0.9
1.3
8
8
8
10
6
6
6
6
6.3 v @ 85°C
TACR685*006#
TACR106*006#
TACR156*006#
0805
0805
0805
6.8
10
15
0.5
0.6
0.9
8
8
8
6
6
6
6.3 v @ 85°C
TACL105*006#
TACL155*006#
TACL225*006#
TACL335*006#
TACL475*006#
TACL106*006#
0603
0603
0603
0603
0603
0603
1.0
1.5
2.2
3.3
4.7
10
0.5
0.5
0.5
0.5
0.5
0.6
6
6
6
6
6
10
10
10
10
10
10
6
10 v @ 85°C
TACR475*010#
TACR685*010#
TACR106*010#
TACR156*010#
0805
0805
0805
0805
4.7
6.8
10
15
0.5
0.7
1.0
1.5
8
8
8
8
6
6
6
6
10 v @ 85°C
TACL474*010#
TACL684*010#
TACL105*010#
TACL155*010#
TACL225*010#
TACL335*010#
0603
0603
0603
0603
0603
0603
0.47
0.68
1.0
1.5
2.2
3.3
0.5
0.5
0.5
0.5
0.5
0.5
6
6
6
6
6
6
12
10
10
10
10
10
For parametric information on development codes, please contact your
local AVX sales office.
16 v @ 85°C
TACL105*016#
0603
1.0
0.5
6
10
All technical data relates to an ambient temperature of +25°C. Capacitance and
DF are measured at 120Hz, 0.5V RMS with a maximum DC bias of 2.2 volts.
DCL is measured at rated voltage after 5 minutes.
* Insert K for ±10% and M for ±20%
# Insert R for 7" reel and S for 13" reel
NOTE: AVX reserves the right to supply a higher voltage rating or tighter
tolerance part in the same case size, to the same reliability standards.
19
Introduction
AVX Tantalum
APPLICATIONS
2-16 Volt
Low ESR
Low Profile Case
0603 available
Low Failure Rate
High Volumetric Efficiency
Temperature Stability
Stable over Time
50 Volt @ 85°C
33 Volt @ 125°C
Automotive Range
High Reliability
Temperature Stability
QS9000 Approved
Up to 150°C
2-35 Volt
Low ESR
Low Profile Case
0603 available
Low Failure Rate
High Volumetric Efficiency
Temperature Stability
Stable over Time
QUALITY STATEMENTS
AVX’s focus is CUSTOMER satisfaction - customer satisfac-
tion in the broadest sense: product quality, technical support,
product availability and all at a competitive price.
In pursuance of the established goals of our corporate wide
QV2000 program, it is the stated objective of AVX Tantalum
to supply our customers with a world class service in the
manufacturing and supplying of electronic components
which will result in an adequate return on investment.
This world class service shall be defined as consistently
supplying product and services of the highest quality and
reliability.
This should encompass, but not be restricted to all aspects
of the customer supply chain.
In addition any new or changed products, processes or
services will be qualified to established standards of quality
and reliability.
The objectives and guidelines listed above shall be achieved
by the following codes of practice:
1.
Continual objective evaluation of customer needs and
expectations for the future and the leverage of all AVX
resources to meet this challenge.
2.
By continually fostering and promoting culture of continu-
ous improvement through ongoing training and empowered
participation of employees at all levels of the company.
3.
By Continuous Process Improvement using sound engi-
neering principles to enhance existing equipment, material
and processes. This includes the application of the
science of S.P.C. focused on improving the Process
Capability Index, Cpk.
All AVX Tantalum manufacturing locations are approved to
ISO9001/ISO9002 and QS9000 - Automotive Quality
System Requirements.
2
Introduction
AVX Tantalum
AVX Paignton is the Divisional Headquarters for the Tantalum
division which has manufacturing locations in Paignton in the
UK, Biddeford in Maine, USA, Juarez in Mexico, Lanskroun
in the Czech Republic and El Salvador.
The Division takes its name from the raw material used to
make its main products, Tantalum Capacitors. Tantalum is
an element extracted from ores found alongside tin and
niobium deposits; the major sources of supply are Canada,
Brazil and Australasia.
So for high volume tantalum capacitors with leading edge
technology call us first -
AVX your global partner.
TECHNOLOGY TRENDS
The amount of capacitance possible in a tantalum capacitor
is directly related to the type of tantalum powder used to
manufacture the anode.
The graph following shows how the (capacitance) x (voltage)
per gram (CV/g) has steadily increased over time, thus allow-
ing the production of larger and larger capacitances with the
same physical volume. CV/g is the measure used to define
the volumetric efficiency of a powder, a high CV/g means a
higher capacitance from the same volume.
These improvements in the powder have been achieved
through close development with the material suppliers.
AVX Tantalum is committed to driving the available technology
forwards as is clearly identified by the new TACmicrochip
technology and the standard codes under development.
If you have any specific requirements, please contact your
local AVX sales office for details on how AVX Tantalum can
assist you in addressing your future requirements.
Tantalum Powder CV/gm
80
70
60
50
40
30
20
10
0
1975
CV/g ('000s)
1980
1985
1990
Year
1995
2000
WORKING WITH THE CUSTOMER
- ONE STOP SHOPPING
In line with our desire to become the number one supplier in
the world for passive and interconnection components, AVX
is constantly looking forward and innovating.
It is not good enough to market the best products; the
customer must have access to a service system which suits
their needs and benefits their business.
The AVX ‘one stop shopping’ concept is already beneficial
in meeting the needs of major OEMs while worldwide
partnerships with only the premier division of distributors aids
the smaller user.
Helping to market the breadth and depth of our electronic
component line card and support our customers are a
dedicated team of commercial sales people, applications
engineers and product marketing managers. Their qualifica-
tions are hopefully always appropriate to your commercial
need, but as higher levels of technical expertise are required,
access directly to the appropriate department is seamless
and transparent.
Total quality starts and finishes with our customer service,
and where cost and quality are perceived as given quantities
the AVX service invariably has us selected as the preferred
supplier.
Facilities are equipped with instant worldwide computer and
telecommunication links connected to every sales and pro-
duction site worldwide. That ensures that our customers
delivery requirements are consistently met wherever in the
world they may be.
3
Technical Summary and
Application Guidelines
INTRODUCTION
Tantalum capacitors are manufactured from a powder of
pure tantalum metal. The typical particle size is between 2
and 10 µm.
Figure below shows typical powders. Note the very great
difference in particle size between the powder CVs.
Rearranging this equation gives:
A
=
Cd
o r
4000µFV
20000µFV
Figure 1.
50000µFV
thus for a 220µF 10V capacitor the surface area is 550
square centimeters, or nearly twice the size of this page.
The dielectric is then formed over all the tantalum surfaces
by the electrochemical process of anodization. To achieve
this, the “pellet” is dipped into a very weak solution of phos-
phoric acid.
The dielectric thickness is controlled by the voltage applied
during the forming process. Initially the power supply is kept
in a constant current mode until the correct thickness of
dielectric has been reached (that is the voltage reaches the
‘forming voltage’), it then switches to constant voltage mode
and the current decays to close to zero.
The powder is compressed under high pressure around a
Tantalum wire (known as the Riser Wire) to form a “pellet”.
The riser wire is the anode connection to the capacitor.
This is subsequently vacuum sintered at high temperature
(typically 1400 - 1800°C). This helps to drive off any impuri-
ties within the powder by migration to the surface.
During sintering the powder becomes a sponge like
structure with all the particles interconnected in a huge
lattice.
This structure is of high mechanical strength and density, but
is also highly porous giving a large internal surface area
(see Figure 2).
The larger the surface area the larger the capacitance. Thus
high CV (capacitance/voltage product) powders, which have
a low average particle size, are used for low voltage, high
capacitance parts.
By choosing which powder is used to produce each capac-
itance/voltage rating the surface area can be controlled.
The following example uses a 220µF 10V capacitor to
illustrate the point.
A
C
=
o r
d
Figure 2. Sintered Tantalum
The chemical equations describing the process are as
follows:
Anode:
Cathode:
2 Ta
→
2 Ta
5+
+ 10
e
2 Ta
5+
+ 10 OH-
→
Ta
2
O
5
+ 5 H
2
O
10 H
2
O – 10
e
→
5H
2
↑
+ 10 OH-
where
o
is the dielectric constant of free space
(8.855 x 10
-12
Farads/m)
r
is the relative dielectric constant for Tantalum
Pentoxide (27)
d is the dielectric thickness in meters
C is the capacitance in Farads
A is the surface area in meters
The oxide forms on the surface of the Tantalum but it also
grows into the metal. For each unit of oxide two thirds grows
out and one third grows in. It is for this reason that there is a
limit on the maximum voltage rating of Tantalum capacitors
with present technology powders (see Figure 3).
The dielectric operates under high electrical stress. Consider
a 220µF 10V part:
Formation voltage = Formation Ratio x Working Voltage
= 3.5 x 10
= 35 Volts
and
35
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