71V2578S166PF datasheet, PDF - EEWORLD Datasheet

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71V2578S166PF: DescriptionTQFP-100, Tray; Categorystorage storage; File Size1MB，18 Pages; ManufacturerIDT (Integrated Device Technology)

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71V2578S166PF Overview

TQFP-100, Tray

71V2578S166PF Parametric

Parameter Name	Attribute value
Brand Name	Integrated Device Technology
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	IDT (Integrated Device Technology)
Parts packaging code	TQFP
package instruction	PLASTIC, TQFP-100
Contacts	100
Manufacturer packaging code	PK100
Reach Compliance Code	_compli
Maximum access time	3.5 ns
Other features	PIPELINED ARCHITECTURE
Maximum clock frequency (fCLK)	166 MHz
I/O type	COMMON
JESD-30 code	R-PQFP-G100
JESD-609 code	e0
memory density	4718592 bi
Memory IC Type	STANDARD SRAM
memory width	18
Humidity sensitivity level	3
Number of functions	1
Number of terminals	100
word count	262144 words
character code	256000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	256KX18
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	QFP
Encapsulate equivalent code	QFP100,.63X.87
Package shape	RECTANGULAR
Package form	FLATPACK
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	225
power supply	2.5,3.3 V
Certification status	Not Qualified
Maximum standby current	0.02 A
Minimum standby current	3.14 V
Maximum slew rate	0.32 mA
Maximum supply voltage (Vsup)	3.465 V
Minimum supply voltage (Vsup)	3.135 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn85Pb15)
Terminal form	GULL WING
Terminal pitch	0.635 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED

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	71V2578S166PF	71V2576S200PF	71V2578S166BG	71V2578S183PF	71V2578S200BG	71V2576S166PF	71V2576S183PF	IDT71V2576S183BG	71V2576S183BG
Description	TQFP-100, Tray	TQFP-100, Tray	PBGA-119, Tray	TQFP-100, Tray	PBGA-119, Tray	TQFP-100, Tray	TQFP-100, Tray	Cache SRAM, 128KX36, 3.3ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, BGA-119	PBGA-119, Tray
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	TQFP	TQFP	PBGA	TQFP	PBGA	TQFP	TQFP	BGA	PBGA
package instruction	PLASTIC, TQFP-100	PLASTIC, TQFP-100	BGA-119	PLASTIC, TQFP-100	BGA-119	PLASTIC, TQFP-100	PLASTIC, TQFP-100	14 X 22 MM, PLASTIC, BGA-119	BGA-119
Contacts	100	100	119	100	119	100	100	119	119
Reach Compliance Code	_compli	not_compliant	_compli	_compli	_compli	_compli	_compli	not_compliant	not_compliant
Maximum access time	3.5 ns	3.1 ns	3.5 ns	3.3 ns	3.1 ns	3.5 ns	3.3 ns	3.3 ns	3.3 ns
Maximum clock frequency (fCLK)	166 MHz	200 MHz	166 MHz	183 MHz	200 MHz	166 MHz	183 MHz	183 MHz	183 MHz
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-PQFP-G100	R-PQFP-G100	S-PBGA-B119	R-PQFP-G100	S-PBGA-B119	R-PQFP-G100	R-PQFP-G100	R-PBGA-B119	S-PBGA-B119
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0	e0
memory density	4718592 bi	4718592 bit	4718592 bi	4718592 bi	4718592 bi	4718592 bi	4718592 bi	4718592 bit	4718592 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	CACHE SRAM	STANDARD SRAM
memory width	18	36	18	18	18	36	36	36	36
Humidity sensitivity level	3	3	3	3	3	3	3	3	3
Number of functions	1	1	1	1	1	1	1	1	1
Number of terminals	100	100	119	100	119	100	100	119	119
word count	262144 words	131072 words	262144 words	262144 words	262144 words	131072 words	131072 words	131072 words	131072 words
character code	256000	128000	256000	256000	256000	128000	128000	128000	128000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	256KX18	128KX36	256KX18	256KX18	256KX18	128KX36	128KX36	128KX36	128KX36
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	QFP	QFP	BGA	QFP	BGA	QFP	QFP	BGA	BGA
Encapsulate equivalent code	QFP100,.63X.87	QFP100,.63X.87	BGA119,7X17,50	QFP100,.63X.87	BGA119,7X17,50	QFP100,.63X.87	QFP100,.63X.87	BGA119,7X17,50	BGA119,7X17,50
Package shape	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE
Package form	FLATPACK	FLATPACK	GRID ARRAY	FLATPACK	GRID ARRAY	FLATPACK	FLATPACK	GRID ARRAY	GRID ARRAY
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	225	225	225	225	225	225	225	NOT SPECIFIED	225
power supply	2.5,3.3 V	2.5,3.3 V	2.5,3.3 V	2.5,3.3 V	2.5,3.3 V	2.5,3.3 V	2.5,3.3 V	2.5,3.3 V	2.5,3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Minimum standby current	3.14 V	3.14 V	3.14 V	3.14 V	3.14 V	3.14 V	3.14 V	3.14 V	3.14 V
Maximum supply voltage (Vsup)	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V
Minimum supply voltage (Vsup)	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn63Pb37)	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn63Pb37)	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn63Pb37)	Tin/Lead (Sn63Pb37)
Terminal form	GULL WING	GULL WING	BALL	GULL WING	BALL	GULL WING	GULL WING	BALL	BALL
Terminal pitch	0.635 mm	0.635 mm	1.27 mm	0.635 mm	1.27 mm	0.635 mm	0.635 mm	1.27 mm	1.27 mm
Terminal location	QUAD	QUAD	BOTTOM	QUAD	BOTTOM	QUAD	QUAD	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Brand Name	Integrated Device Technology	Integrated Device Technology	Integrated Device Technology	Integrated Device Technology	Integrated Device Technology	Integrated Device Technology	Integrated Device Technology	-	Integrated Device Technology
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	-	Contains lead
Maker	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	-	-
Manufacturer packaging code	PK100	PK100	BG119	PK100	BG119	PK100	PK100	-	BG119
Other features	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	-	PIPELINED ARCHITECTURE
Maximum standby current	0.02 A	0.02 A	0.02 A	-	0.02 A	0.02 A	-	-	-
Maximum slew rate	0.32 mA	0.36 mA	0.32 mA	-	0.36 mA	0.32 mA	-	-	-

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