IDT71V2576S183BG datasheet, PDF

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IDT71V2576S183BG: DescriptionCache SRAM, 128KX36, 3.3ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, BGA-119; Categorystorage storage; File Size1MB，18 Pages; ManufacturerIDT (Integrated Device Technology)

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IDT71V2576S183BG Overview

Cache SRAM, 128KX36, 3.3ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, BGA-119

IDT71V2576S183BG Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Objectid	1484454927
Parts packaging code	BGA
package instruction	14 X 22 MM, PLASTIC, BGA-119
Contacts	119
Reach Compliance Code	not_compliant
ECCN code	3A991.B.2.A
Maximum access time	3.3 ns
Maximum clock frequency (fCLK)	183 MHz
I/O type	COMMON
JESD-30 code	R-PBGA-B119
JESD-609 code	e0
length	22 mm
memory density	4718592 bit
Memory IC Type	CACHE SRAM
memory width	36
Humidity sensitivity level	3
Number of functions	1
Number of terminals	119
word count	131072 words
character code	128000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	128KX36
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA119,7X17,50
Package shape	RECTANGULAR
Package form	GRID ARRAY
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	2.5,3.3 V
Certification status	Not Qualified
Maximum seat height	3.5 mm
Minimum standby current	3.14 V
Maximum supply voltage (Vsup)	3.465 V
Minimum supply voltage (Vsup)	3.135 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn63Pb37)
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	14 mm

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	IDT71V2576S183BG	71V2576S200PF	71V2578S166BG	71V2578S166PF	71V2578S183PF	71V2578S200BG	71V2576S166PF	71V2576S183PF	71V2576S183BG
Description	Cache SRAM, 128KX36, 3.3ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, BGA-119	TQFP-100, Tray	PBGA-119, Tray	TQFP-100, Tray	TQFP-100, Tray	PBGA-119, Tray	TQFP-100, Tray	TQFP-100, Tray	PBGA-119, Tray
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	BGA	TQFP	PBGA	TQFP	TQFP	PBGA	TQFP	TQFP	PBGA
package instruction	14 X 22 MM, PLASTIC, BGA-119	PLASTIC, TQFP-100	BGA-119	PLASTIC, TQFP-100	PLASTIC, TQFP-100	BGA-119	PLASTIC, TQFP-100	PLASTIC, TQFP-100	BGA-119
Contacts	119	100	119	100	100	119	100	100	119
Reach Compliance Code	not_compliant	not_compliant	_compli	_compli	_compli	_compli	_compli	_compli	not_compliant
Maximum access time	3.3 ns	3.1 ns	3.5 ns	3.5 ns	3.3 ns	3.1 ns	3.5 ns	3.3 ns	3.3 ns
Maximum clock frequency (fCLK)	183 MHz	200 MHz	166 MHz	166 MHz	183 MHz	200 MHz	166 MHz	183 MHz	183 MHz
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-PBGA-B119	R-PQFP-G100	S-PBGA-B119	R-PQFP-G100	R-PQFP-G100	S-PBGA-B119	R-PQFP-G100	R-PQFP-G100	S-PBGA-B119
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0	e0
memory density	4718592 bit	4718592 bit	4718592 bi	4718592 bi	4718592 bi	4718592 bi	4718592 bi	4718592 bi	4718592 bit
Memory IC Type	CACHE SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	36	36	18	18	18	18	36	36	36
Humidity sensitivity level	3	3	3	3	3	3	3	3	3
Number of functions	1	1	1	1	1	1	1	1	1
Number of terminals	119	100	119	100	100	119	100	100	119
word count	131072 words	131072 words	262144 words	262144 words	262144 words	262144 words	131072 words	131072 words	131072 words
character code	128000	128000	256000	256000	256000	256000	128000	128000	128000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	128KX36	128KX36	256KX18	256KX18	256KX18	256KX18	128KX36	128KX36	128KX36
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	QFP	BGA	QFP	QFP	BGA	QFP	QFP	BGA
Encapsulate equivalent code	BGA119,7X17,50	QFP100,.63X.87	BGA119,7X17,50	QFP100,.63X.87	QFP100,.63X.87	BGA119,7X17,50	QFP100,.63X.87	QFP100,.63X.87	BGA119,7X17,50
Package shape	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	SQUARE
Package form	GRID ARRAY	FLATPACK	GRID ARRAY	FLATPACK	FLATPACK	GRID ARRAY	FLATPACK	FLATPACK	GRID ARRAY
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	225	225	225	225	225	225	225	225
power supply	2.5,3.3 V	2.5,3.3 V	2.5,3.3 V	2.5,3.3 V	2.5,3.3 V	2.5,3.3 V	2.5,3.3 V	2.5,3.3 V	2.5,3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Minimum standby current	3.14 V	3.14 V	3.14 V	3.14 V	3.14 V	3.14 V	3.14 V	3.14 V	3.14 V
Maximum supply voltage (Vsup)	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V
Minimum supply voltage (Vsup)	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn63Pb37)	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn63Pb37)	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn63Pb37)	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn63Pb37)
Terminal form	BALL	GULL WING	BALL	GULL WING	GULL WING	BALL	GULL WING	GULL WING	BALL
Terminal pitch	1.27 mm	0.635 mm	1.27 mm	0.635 mm	0.635 mm	1.27 mm	0.635 mm	0.635 mm	1.27 mm
Terminal location	BOTTOM	QUAD	BOTTOM	QUAD	QUAD	BOTTOM	QUAD	QUAD	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Brand Name	-	Integrated Device Technology	Integrated Device Technology	Integrated Device Technology	Integrated Device Technology	Integrated Device Technology	Integrated Device Technology	Integrated Device Technology	Integrated Device Technology
Is it lead-free?	-	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Maker	-	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	-
Manufacturer packaging code	-	PK100	BG119	PK100	PK100	BG119	PK100	PK100	BG119
Other features	-	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE
Maximum standby current	-	0.02 A	0.02 A	0.02 A	-	0.02 A	0.02 A	-	-
Maximum slew rate	-	0.36 mA	0.32 mA	0.32 mA	-	0.36 mA	0.32 mA	-	-

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