FIFO, 8KX9, 25ns, Asynchronous, CMOS, CDIP28, 0.300 INCH, SIDE BRAZED, THIN, CERAMIC, DIP-28
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | IDT (Integrated Device Technology) |
| Parts packaging code | DIP |
| package instruction | 0.300 INCH, SIDE BRAZED, THIN, CERAMIC, DIP-28 |
| Contacts | 28 |
| Reach Compliance Code | _compli |
| ECCN code | EAR99 |
| Maximum access time | 25 ns |
| Other features | RETRANSMIT |
| Maximum clock frequency (fCLK) | 28.5 MHz |
| period time | 35 ns |
| JESD-30 code | R-CDIP-T28 |
| JESD-609 code | e0 |
| memory density | 73728 bi |
| Memory IC Type | OTHER FIFO |
| memory width | 9 |
| Number of functions | 1 |
| Number of terminals | 28 |
| word count | 8192 words |
| character code | 8000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 8KX9 |
| Output characteristics | 3-STATE |
| Exportable | NO |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP28,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum standby current | 0.008 A |
| Maximum slew rate | 0.12 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
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