FIFO, 512X9, 20ns, Asynchronous, CMOS, PQCC32, PLASTIC, LCC-32
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | IDT (Integrated Device Technology) |
| Parts packaging code | QFJ |
| package instruction | QCCJ, |
| Contacts | 32 |
| Reach Compliance Code | compli |
| ECCN code | EAR99 |
| Maximum access time | 20 ns |
| Other features | SINGLE ARRAY; BYPASS XCVR |
| period time | 30 ns |
| JESD-30 code | R-PQCC-J32 |
| JESD-609 code | e0 |
| memory density | 4608 bi |
| memory width | 9 |
| Humidity sensitivity level | 1 |
| Number of functions | 1 |
| Number of terminals | 32 |
| word count | 512 words |
| character code | 512 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 512X9 |
| Exportable | NO |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QCCJ |
| Package shape | RECTANGULAR |
| Package form | CHIP CARRIER |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | 225 |
| Certification status | Not Qualified |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | TIN LEAD |
| Terminal form | J BEND |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | 20 |
京公网安备 11010802033920号
EEWORLD
