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IDT72T51436L7-5BB

Description
FIFO, 16KX36, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256
Categorystorage    storage   
File Size215KB,13 Pages
ManufacturerIDT (Integrated Device Technology)
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IDT72T51436L7-5BB Overview

FIFO, 16KX36, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256

IDT72T51436L7-5BB Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerIDT (Integrated Device Technology)
Parts packaging codeBGA
package instructionBGA,
Contacts256
Reach Compliance Code_compli
ECCN codeEAR99
period time7.5 ns
JESD-30 codeS-PBGA-B256
JESD-609 codee0
length17 mm
memory density589824 bi
memory width36
Humidity sensitivity level3
Number of functions1
Number of terminals256
word count16384 words
character code16000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize16KX36
ExportableYES
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Package shapeSQUARE
Package formGRID ARRAY
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)225
Certification statusNot Qualified
Maximum seat height3.5 mm
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature20
width17 mm
2.5V MULTI-QUEUE FIFO (16 QUEUES)
36 BIT WIDE CONFIGURATION
589,824 bits, 1,179,648 bits and
2,359,296 bits
ADVANCE INFORMATION
IDT72T51436
IDT72T51446
IDT72T51456
FEATURES:
Choose from among the following memory density options:
IDT72T51436
Total Available Memory = 589,824 bits
IDT72T51446
Total Available Memory = 1,179,648 bits
IDT72T51456
Total Available Memory = 2,359,296 bits
Configurable from 1 to 16 Queues
Queues may be configured at master reset from the pool of
Total Available Memory in blocks of 256 x 36
Independent Read and Write access per queue
User selectable I/O: 2.5V LVTTL, 1.5V HSTL, 1.8V eHSTL
User programmable via serial port
Default Multi-Queue device configurations
– IDT72T51436 : 1,024 x 36 x 16Q
– IDT72T51446 : 2,048 x 36 x 16Q
– IDT72T51456 : 4,096 x 36 x 16Q
100% Bus Utilization, Read and Write on every clock cycle
200 MHz High speed operation (5ns cycle time)
3.6ns access time
Echo Read Enable & Echo Read Clock Outputs
Individual, Active queue flags (OV,
FF, PAE, PAF, PR)
8 bit parallel flag status on both read and write ports
Shows
PAE
and
PAF
status of 8 Queues
Direct or polled operation of flag status bus
Global Bus Matching - (All Queues have same Input Bus Width
and Output Bus Width)
User Selectable Bus Matching Options:
– x36in to x36out
– x18in to x36out
– x9in to x36out
– x36in to x18out
– x36in to x9out
FWFT mode of operation on read port
Packet Ready mode of operation
Partial Reset, clears data in single Queue
Expansion of up to 8 Multi-Queue devices in parallel is available
Power Down Input provides additional power savings in HSTL
and eHSTL modes.
JTAG Functionality (Boundary Scan)
Available in a 256-pin PBGA, 1mm pitch, 17mm x 17mm
HIGH Performance submicron CMOS technology
Industrial temperature range (-40°C to +85°C) is available
DATA PATH FLOW DIAGRAM
MULTI-QUEUE FIFO
WADEN
FSTR
WRADD
7
Q0
READ CONTROL
8
RADEN
ESTR
RDADD
REN
RCLK
WRITE CONTROL
Q1
WEN
WCLK
EREN
ERCLK
OE
Q2
Din
Qout
x36
DATA IN
FF
PAF
PAFn
x36
DATA OUT
READ FLAGS
OV
PR
PAE
PAEn
8
WRITE FLAGS
Qmax
8
PRn
6000 drw01
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
1
©2001
Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice.
OCTOBER 2, 2001
DSC-6000/-

IDT72T51436L7-5BB Related Products

IDT72T51436L7-5BB 2SC4375 2SC4460 IDT72T51456L7-5BBI IDT72T51436L7-5BBI IDT72T51456L7-5BB
Description FIFO, 16KX36, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 SOT-89-3L Plastic-Encapsulate Transistors Silicon NPN transistor in a TO-3P Plastic Package. FIFO, 64KX36, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 FIFO, 16KX36, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 FIFO, 64KX36, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256
Is it lead-free? Contains lead - - Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible - - incompatible incompatible incompatible
Maker IDT (Integrated Device Technology) - - IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Parts packaging code BGA - - BGA BGA BGA
package instruction BGA, - - BGA, BGA, BGA,
Contacts 256 - - 256 256 256
Reach Compliance Code _compli - - not_compliant not_compliant not_compliant
ECCN code EAR99 - - EAR99 EAR99 EAR99
period time 7.5 ns - - 7.5 ns 7.5 ns 7.5 ns
JESD-30 code S-PBGA-B256 - - S-PBGA-B256 S-PBGA-B256 S-PBGA-B256
JESD-609 code e0 - - e0 e0 e0
length 17 mm - - 17 mm 17 mm 17 mm
memory density 589824 bi - - 2359296 bit 589824 bit 2359296 bit
memory width 36 - - 36 36 36
Humidity sensitivity level 3 - - 3 3 3
Number of functions 1 - - 1 1 1
Number of terminals 256 - - 256 256 256
word count 16384 words - - 65536 words 16384 words 65536 words
character code 16000 - - 64000 16000 64000
Operating mode SYNCHRONOUS - - SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C - - 85 °C 85 °C 70 °C
organize 16KX36 - - 64KX36 16KX36 64KX36
Exportable YES - - YES YES YES
Package body material PLASTIC/EPOXY - - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA - - BGA BGA BGA
Package shape SQUARE - - SQUARE SQUARE SQUARE
Package form GRID ARRAY - - GRID ARRAY GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL - - PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 225 - - 225 225 225
Certification status Not Qualified - - Not Qualified Not Qualified Not Qualified
Maximum seat height 3.5 mm - - 3.5 mm 3.5 mm 3.5 mm
Nominal supply voltage (Vsup) 2.5 V - - 2.5 V 2.5 V 2.5 V
surface mount YES - - YES YES YES
technology CMOS - - CMOS CMOS CMOS
Temperature level COMMERCIAL - - INDUSTRIAL INDUSTRIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) - - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form BALL - - BALL BALL BALL
Terminal pitch 1 mm - - 1 mm 1 mm 1 mm
Terminal location BOTTOM - - BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature 20 - - 20 20 20
width 17 mm - - 17 mm 17 mm 17 mm
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