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IDT72T51543L6BBI

Description
FIFO, 64KX18, 3.7ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256
Categorystorage    storage   
File Size533KB,57 Pages
ManufacturerIDT (Integrated Device Technology)
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IDT72T51543L6BBI Overview

FIFO, 64KX18, 3.7ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256

IDT72T51543L6BBI Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerIDT (Integrated Device Technology)
Parts packaging codeBGA
package instruction17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256
Contacts256
Reach Compliance Code_compli
ECCN codeEAR99
Maximum access time3.7 ns
period time6 ns
JESD-30 codeS-PBGA-B256
JESD-609 codee0
length17 mm
memory density1179648 bi
memory width18
Humidity sensitivity level3
Number of functions1
Number of terminals256
word count65536 words
character code64000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize64KX18
ExportableYES
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Package shapeSQUARE
Package formGRID ARRAY
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)225
Certification statusNot Qualified
Maximum seat height3.5 mm
Maximum supply voltage (Vsup)2.625 V
Minimum supply voltage (Vsup)2.375 V
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature20
width17 mm

IDT72T51543L6BBI Preview

ADVANCE INFORMATION
2.5V MULTI-QUEUE FLOW-CONTROL DEVICES
(32 QUEUES) 18 BIT WIDE CONFIGURATION
IDT72T51543
1,179,648 bits and 2,359,296 bits
IDT72T51553
FEATURES:
Choose from among the following memory density options:
IDT72T51543
Total Available Memory = 1,179,648 bits
IDT72T51553
Total Available Memory = 2,359,296 bits
Configurable from 1 to 32 Queues
Queues may be configured at master reset from the pool of
Total Available Memory in blocks of 512 x 18 or 1,024 x 9
Independent Read and Write access per queue
User programmable via serial port
User selectable I/O: 2.5V LVTTL, 1.5V HSTL, 1.8V eHSTL
Default multi-queue device configurations
– IDT72T51543 : 2,048 x 18 x 32Q
– IDT72T51553 : 4,096 x 18 x 32Q
100% Bus Utilization, Read and Write on every clock cycle
200 MHz High speed operation (5ns cycle time)
3.6ns access time
Echo Read Enable & Echo Read Clock Outputs
Individual, Active queue flags (OV,
FF, PAE, PAF)
8 bit parallel flag status on both read and write ports
Shows
PAE
and
PAF
status of 8 Queues
Direct or polled operation of flag status bus
Global Bus Matching - (All Queues have same Input Bus Width
and Output Bus Width)
User Selectable Bus Matching Options:
– x18in to x18out
– x9in to x18out
– x18in to x9out
– x9in to x9out
FWFT mode of operation on read port
Partial Reset, clears data in single Queue
Expansion of up to 8 multi-queue devices in parallel is available
Power Down Input provides additional power savings in HSTL
and eHSTL modes.
JTAG Functionality (Boundary Scan)
Available in a 256-pin PBGA, 1mm pitch, 17mm x 17mm
HIGH Performance submicron CMOS technology
Industrial temperature range (-40°C to +85°C) is available
FUNCTIONAL BLOCK DIAGRAM
MULTI-QUEUE FLOW-CONTROL DEVICE
WADEN
FSTR
WRADD
8
READ CONTROL
Q0
RADEN
ESTR
RDADD
8
WRITE CONTROL
Q1
WEN
WCLK
REN
RCLK
EREN
ERCLK
OE
Q2
Din
Qout
x9, x18
DATA IN
FF
PAF
x9, x18
DATA OUT
READ FLAGS
OV
PAE
PAEn
8
WRITE FLAGS
PAFn
8
Q31
5999 drw01
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
1
2003
Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice.
NOVEMBER 2003
DSC-5999/3
IDT72T51543/72T51553 2.5V, MULTI-QUEUE FLOW-CONTROL DEVICES
(32 QUEUES) 18 BIT WIDE CONFIGURATION 1,179,648 and 2,359,296 bits
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
DESCRIPTION:
The IDT72T51543/72T51553 multi-queue flow-control devices are single
chip within which anywhere between 1 and 32 discrete FIFO queues can be
setup. All queues within the device have a common data input bus, (write port)
and a common data output bus, (read port). Data written into the write port is
directed to a respective queue via an internal de-multiplex operation, ad-
dressed by the user. Data read from the read port is accessed from a respective
queue via an internal multiplex operation, addressed by the user. Data writes
and reads can be performed at high speeds up to 200MHz, with access times
of 3.6ns. Data write and read operations are totally independent of each other,
a queue maybe selected on the write port and a different queue on the read
port or both ports may select the same queue simultaneously.
The device provides Full flag and Output Valid flag status for the queue
selected for write and read operations respectively. Also a Programmable
Almost Full and Programmable Almost Empty flag for each queue is provided.
Two 8 bit programmable flag busses are available, providing status of queues
not selected for write or read operations. When 8 or less queues are configured
in the device these flag busses provide an individual flag per queue, when
more than 8 queues are used, either a Polled or Direct mode of bus operation
provides the flag busses with all queues status.
Bus Matching is available on this device, either port can be 9 bits or 18 bits
wide. When Bus Matching is used the device ensures the logical transfer of
data throughput in a Little Endian manner.
The user has full flexibility configuring queues within the device, being able
to program the total number of queues between 1 and 32, the individual queue
depths being independent of each other. The programmable flag positions are
also user programmable. All programming is done via a dedicated serial port.
If the user does not wish to program the multi-queue device, a default option is
available that configures the device in a predetermined manner.
Both Master Reset and Partial Reset pins are provided on this device. A Master
Reset latches in all configuration setup pins and must be performed before
programming of the device can take place. A Partial Reset will reset the read and
write pointers of an individual queue, provided that the queue is selected on both
the write port and read port at the time of partial reset.
Echo Read Enable,
EREN
and Echo Read Clock, ERCLK outputs are
provided. These are outputs from the read port of the queue that are required
for high speed data communication, to provide tighter synchronization between
the data being transmitted from the Qn outputs and the data being received by
the input device. Data read from the read port is available on the output bus with
respect to
EREN
and ERCLK, this is very useful when data is being read at high
speed.
The multi-queue flow-control device has the capability of operating its IO in
either 2.5V LVTTL, 1.5V HSTL or 1.8V eHSTL mode. The type of IO is selected
via the IOSEL input. The core supply voltage (V
CC
) to the multi-queue is always
2.5V, however the output levels can be set independently via a separate supply,
V
DDQ
.
The devices also provide additional power savings via a Power Down Input.
This input disables the write port data inputs when no write operations are
required.
A JTAG test port is provided, here the multi-queue device has a fully functional
Boundary Scan feature, compliant with IEEE 1149.1 Standard Test Access Port
and Boundary Scan Architecture.
See Figure 1,
Multi-Queue Flow-Control Device Block Diagram
for an outline
of the functional blocks within the device.
2
IDT72T51543/72T51553 2.5V, MULTI-QUEUE FLOW-CONTROL DEVICES
(32 QUEUES) 18 BIT WIDE CONFIGURATION 1,179,648 and 2,359,296 bits
Din
x9, x18
D0 - D17
WCLK
WEN
INPUT
DEMUX
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
WRADD
WADEN
8
Write Control
Logic
Write Pointers
JTAG
Logic
TMS
TDI
TDO
TCK
TRST
FSTR
PAFn
FSYNC
FXO
FXI
FF
PAF
SI
SO
SCLK
SENI
SENO
FM
IW
OW
MAST
8
PAF
General Flag
Monitor
Upto 32
FIFO
Queues
Active Q
Flags
2.3 Mbit
Dual Port
Memory
OV
PAE
Active Q
Flags
Serial
Multi-Queue
Programming
PAE
General Flag
Monitor
8
PAEn
ESTR
ESYNC
EXI
EXO
Read Pointers
Reset
Logic
8
Read Control
Logic
RDADD
RADEN
NULL-Q
REN
ID0
ID1
ID2
DF
DFM
PRS
MRS
Device ID
3 Bit
PAE/ PAF
Offset
RCLK
OUTPUT
MUX
OUTPUT
REGISTER
EREN
ERCLK
5999 drw02
IOSEL
Vref
PD
IO Level Control
&
Power Down
OE
Q0 - Q17
Qout x9, x18
Figure 1. Multi-Queue Flow-Control Device Block Diagram
3
IDT72T51543/72T51553 2.5V, MULTI-QUEUE FLOW-CONTROL DEVICES
(32 QUEUES) 18 BIT WIDE CONFIGURATION 1,179,648 and 2,359,296 bits
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
PIN CONFIGURATION
A1 BALL PAD CORNER
A
D14
D13
D12
D10
D7
D4
D1
TCK
TDO
ID1
Q3
Q6
Q9
Q12
Q14
Q15
B
D15
D16
D11
D9
D6
D3
D0
TMS
TDI
ID0
Q2
Q5
Q8
Q11
Q13
DNC
C
D17
GND
GND
D8
D5
D2
TRST
IOSEL
ID2
Q0
Q1
Q4
Q7
Q10
Q17
DNC
D
GND
GND
E
GND
GND
F
GND
GND
G
GND
GND
H
GND
GND
J
GND
NULL-Q
K
PD
GND
L
SI
DFM
M
SENO
SENI
N
P
R
T
WRADD7
FXI
WRADD1 WRADD0
WRADD4 WRADD3 WRADD2
WRADD6 WRADD5 FSYNC
E N
C
N IO
A T
V A
D M
A R
O
F
IN
GND
V
DDQ
V
DDQ
V
CC
V
CC
GND
GND
V
CC
V
CC
V
DDQ
V
DDQ
DNC
DNC
GND
V
DDQ
V
CC
GND
GND
GND
GND
GND
GND
V
CC
V
DDQ
DNC
DNC
GND
V
CC
V
CC
GND
GND
GND
GND
GND
GND
V
CC
V
CC
DNC
DNC
GND
V
CC
GND
GND
GND
GND
GND
GND
GND
GND
V
CC
DNC
DNC
GND
V
CC
GND
GND
GND
GND
GND
GND
GND
GND
V
CC
GND
DNC
V
REF
V
CC
V
CC
GND
GND
GND
GND
GND
GND
V
CC
V
CC
GND
MAST
DF
V
DDQ
V
CC
GND
GND
GND
GND
GND
GND
V
CC
V
DDQ
GND
IW
SO
V
DDQ
V
DDQ
V
CC
V
CC
GND
GND
V
CC
V
CC
V
DDQ
V
DDQ
OE
SCLK
V
DDQ
V
DDQ
V
DDQ
V
CC
V
CC
V
CC
V
CC
V
DDQ
V
DDQ
V
DDQ
WADEN
PAF3
PAF6
PAF7
FF
OV
PAE
PAE7
PAE6
PAE3
FSTR
PAF2
PAF5
PAF4
PAF
DNC
ERCLK
EREN
PAE5
PAE2
RADEN
ESTR
FXO
PAF0
PAF1
WEN
WCLK
PRS
MRS
RCLK
REN
PAE4
PAE1
PAE0
EXO
GND
V
DDQ
V
DDQ
V
DDQ
V
CC
V
CC
V
CC
V
CC
V
DDQ
V
DDQ
V
DDQ
Q16
DNC
DNC
DNC
DNC
DNC
DNC
DNC
FM
OW
RDADD0 RDADD1
RDADD2 RDADD3 RDADD4
RDADD5 RDADD6 RDADD7
ESYNC
EXI
1
NOTE:
1. DNC - Do Not Connect.
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
5999 drw03
PBGA (BB256-1, order code: BB)
TOP VIEW
4
IDT72T51543/72T51553 2.5V, MULTI-QUEUE FLOW-CONTROL DEVICES
(32 QUEUES) 18 BIT WIDE CONFIGURATION 1,179,648 and 2,359,296 bits
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
DETAILED DESCRIPTION
MULTI-QUEUE STRUCTURE
The IDT multi-queue flow-control device has a single data input port and
single data output port with up to 32 FIFO queues in parallel buffering between
the two ports. The user can setup between 1 and 32 queues within the device.
These queues can be configured to utilize the total available memory, providing
the user with full flexibility and ability to configure the queues to be various depths,
independent of one another.
MEMORY ORGANIZATION/ ALLOCATION
The memory is organized into what is known as “blocks”, each block being
512 x 18 or 1,024 x 9 bits. When the user is configuring the number of queues
and individual queue sizes the user must allocate the memory to respective
queues, in units of blocks, that is, a single queue can be made up from 0 to m
blocks, where m is the total number of blocks available within a device. Also the
total size of any given queue must be in increments of 512 x 18 or 1,024 x 9.
For the IDT72T51543 and IDT72T51553 the Total Available Memory is 128
and 256 blocks respectively (a block being 512 x 18 or 1,024 x 9). If any port
is configured for x18 bus width, a block size is 512 x 18. If both the write and
read ports are configured for x9 bus width, a block size is 1,024 x 9. Queues
can be built from these blocks to make any size queue desired and any number
of queues desired.
BUS WIDTHS
The input port is common to all queues within the device, as is the output port.
The device provides the user with Bus Matching options such that the input port
and output port can be either x9 or x18 bits wide, the read and write port widths
being set independently of one another. Because the ports are common to all
queues the width of the queues is not individually set, so that the input width of
all queues are equal and the output width of all queues are equal.
WRITING TO & READING FROM THE MULTI-QUEUE
Data being written into the device via the input port is directed to a discrete
queue via the write queue select address inputs. Conversely, data being read
from the device read port is read from a queue selected via the read queue select
address inputs. Data can be simultaneously written into and read from the same
queue or different queues. Once a queue is selected for data writes or reads,
the writing and reading operation is performed in the same manner as a
conventional IDT synchronous FIFO, utilizing clocks and enables, there is a
single clock and enable per port. When a specific queue is addressed on the
write port, data placed on the data inputs is written to that queue sequentially
based on the rising edge of a write clock provided setup and hold times are met.
Conversely, data is read on to the output port after an access time from a rising
edge on a read clock.
The operation of the write port is comparable to the function of a conventional
FIFO operating in standard IDT mode. Write operations can be performed on
the write port provided that the queue currently selected is not full, a full flag output
provides status of the selected queue. The operation of the read port is
comparable to the function of a conventional FIFO operating in FWFT mode.
When a queue is selected on the output port, the next word in that queue will
automatically fall through to the output register. All subsequent words from that
queue require an enabled read cycle. Data cannot be read from a selected
queue if that queue is empty, the read port provides an Output Valid flag indicating
when data read out is valid. If the user switches to a queue that is empty, the
last word from the previous queue will remain on the output register.
As mentioned, the write port has a full flag, providing full status of the selected
queue. Along with the full flag a dedicated almost full flag is provided, this almost
5
full flag is similar to the almost full flag of a conventional IDT FIFO. The device
provides a user programmable almost full flag for all 32 queues and when a
respective queue is selected on the write port, the almost full flag provides status
for that queue. Conversely, the read port has an output valid flag, providing
status of the data being read from the queue selected on the read port. As well
as the output valid flag the device provides a dedicated almost empty flag. This
almost empty flag is similar to the almost empty flag of a conventional IDT FIFO.
The device provides a user programmable almost empty flag for all 32 queues
and when a respective queue is selected on the read port, the almost empty flag
provides status for that queue.
PROGRAMMABLE FLAG BUSSES
In addition to these dedicated flags, full & almost full on the write port and output
valid & almost empty on the read port, there are two flag status busses. An almost
full flag status bus is provided, this bus is 8 bits wide. Also, an almost empty flag
status bus is provided, again this bus is 8 bits wide. The purpose of these flag
busses is to provide the user with a means by which to monitor the data levels
within queues that may not be selected on the write or read port. As mentioned,
the device provides almost full and almost empty registers (programmable by
the user) for each of the 32 queues in the device.
In the IDT72T51543/72T51553 multi-queue flow-control devices the user
has the option of utilizing anywhere between 1 and 32 queues, therefore the
8 bit flag status busses are multiplexed between the 32 queues, a flag bus can
only provide status for 8 of the 32 queues at any moment, this is referred to as
a “Quadrant”, such that when the bus is providing status of queues 1 through
8, this is quadrant 1, when it is queues 9 through 16, this is quadrant 2 and so
on up to quadrant 4. If less than 32 queues are setup in the device, there are
still 4 quadrants, such that in “Polled” mode of operation the flag bus will still cycle
through 4 quadrants. If for example only 22 queues are setup, quadrants 1 and
2 will reflect status of queues 1 through 8 and 9 through 16 respectively.
Quadrant 3 will reflect the status of queues 17 through 22 on the least significant
6 bits, the most significant 2 bits of the flag bus are don’t care and the 4th quadrant
outputs will be don’t care also.
The flag busses are available in two user selectable modes of operation,
“Polled” or “Direct”. When operating in polled mode a flag bus provides status
of each quadrant sequentially, that is, on each rising edge of a clock the flag bus
is updated to show the status of each quadrant in order. The rising edge of the
write clock will update the almost full bus and a rising edge on the read clock will
update the almost empty bus. The mode of operation is always the same for both
the almost full and almost empty flag busses. When operating in direct mode, the
quadrant on the flag bus is selected by the user. So the user can actually address
the quadrant to be placed on the flag status busses, these flag busses operate
independently of one another. Addressing of the almost full flag bus is done via
the write port and addressing of the almost empty flag bus is done via the read port.
EXPANSION
Expansion of multi-queue devices is also possible, up to 8 devices can be
connected in a parallel fashion providing the possibility of both depth expansion
or queue expansion. Depth Expansion means expanding the depths of
individual queues. Queue expansion means increasing the total number of
queues available. Depth expansion is possible by virtue of the fact that more
memory blocks within a multi-queue device can be allocated to increase the
depth of a queue. For example, depth expansion of 8 devices provides the
possibility of 8 queues of 64K x 18 deep within the IDT72T51543, and 128k x
18 deep within the IDT72T51553, each queue being setup within a single device
utilizing all memory blocks available to produce a single queue. This is the
deepest queue that can setup within a device.

IDT72T51543L6BBI Related Products

IDT72T51543L6BBI IDT72T51543L6BB IDT72T51543L5BB IDT72T51553L6BB IDT72T51553L6BBI IDT72T51553L5BB
Description FIFO, 64KX18, 3.7ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 FIFO, 64KX18, 3.7ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 FIFO, 64KX18, 3.6ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 FIFO, 128KX18, 3.7ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 FIFO, 128KX18, 3.7ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 FIFO, 128KX18, 3.6ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256
Is it lead-free? Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Parts packaging code BGA BGA BGA BGA BGA BGA
package instruction 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256
Contacts 256 256 256 256 256 256
Reach Compliance Code _compli not_compliant not_compliant _compli _compli _compli
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 3.7 ns 3.7 ns 3.6 ns 3.7 ns 3.7 ns 3.6 ns
period time 6 ns 6 ns 5 ns 6 ns 6 ns 5 ns
JESD-30 code S-PBGA-B256 S-PBGA-B256 S-PBGA-B256 S-PBGA-B256 S-PBGA-B256 S-PBGA-B256
JESD-609 code e0 e0 e0 e0 e0 e0
length 17 mm 17 mm 17 mm 17 mm 17 mm 17 mm
memory density 1179648 bi 1179648 bit 1179648 bit 2359296 bi 2359296 bi 2359296 bi
memory width 18 18 18 18 18 18
Humidity sensitivity level 3 3 3 3 3 3
Number of functions 1 1 1 1 1 1
Number of terminals 256 256 256 256 256 256
word count 65536 words 65536 words 65536 words 131072 words 131072 words 131072 words
character code 64000 64000 64000 128000 128000 128000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C 70 °C 70 °C 70 °C 85 °C 70 °C
organize 64KX18 64KX18 64KX18 128KX18 128KX18 128KX18
Exportable YES YES YES YES YES YES
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA BGA BGA BGA BGA
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 225 225 225 225 225 225
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 3.5 mm 3.5 mm 3.5 mm 3.5 mm 3.5 mm 3.5 mm
Maximum supply voltage (Vsup) 2.625 V 2.625 V 2.625 V 2.625 V 2.625 V 2.625 V
Minimum supply voltage (Vsup) 2.375 V 2.375 V 2.375 V 2.375 V 2.375 V 2.375 V
Nominal supply voltage (Vsup) 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V
surface mount YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form BALL BALL BALL BALL BALL BALL
Terminal pitch 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature 20 20 20 20 20 20
width 17 mm 17 mm 17 mm 17 mm 17 mm 17 mm

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