FIFO, 256KX9, 5ns, Synchronous, PQFP80, PLASTIC, TQFP-80
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | IDT (Integrated Device Technology) |
| Parts packaging code | QFP |
| package instruction | PLASTIC, TQFP-80 |
| Contacts | 80 |
| Reach Compliance Code | compli |
| ECCN code | EAR99 |
| Maximum access time | 5 ns |
| Other features | CAN ALSO BE CONFIGURED AS 131,072X18 |
| period time | 7.5 ns |
| JESD-30 code | S-PQFP-G80 |
| JESD-609 code | e0 |
| length | 14 mm |
| memory density | 2359296 bi |
| memory width | 9 |
| Humidity sensitivity level | 3 |
| Number of functions | 1 |
| Number of terminals | 80 |
| word count | 262144 words |
| character code | 256000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 256KX9 |
| Exportable | YES |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | LQFP |
| Package shape | SQUARE |
| Package form | FLATPACK, LOW PROFILE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | 240 |
| Certification status | Not Qualified |
| Maximum seat height | 1.6 mm |
| Maximum supply voltage (Vsup) | 3.45 V |
| Minimum supply voltage (Vsup) | 3.15 V |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | TIN LEAD |
| Terminal form | GULL WING |
| Terminal pitch | 0.65 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | 20 |
| width | 14 mm |
| IDT72V103L7.5PF | IDT72V113L7.5PF | IDT72V103L10PF | IDT72V113L15PF | IDT72V113L10PF | IDT72V103L15PF | |
|---|---|---|---|---|---|---|
| Description | FIFO, 256KX9, 5ns, Synchronous, PQFP80, PLASTIC, TQFP-80 | FIFO, 512KX9, 5ns, Synchronous, PQFP80, PLASTIC, TQFP-80 | FIFO, 256KX9, 6.5ns, Synchronous, PQFP80, PLASTIC, TQFP-80 | FIFO, 512KX9, 10ns, Synchronous, PQFP80, PLASTIC, TQFP-80 | FIFO, 512KX9, 6.5ns, Synchronous, PQFP80, PLASTIC, TQFP-80 | FIFO, 256KX9, 10ns, Synchronous, PQFP80, PLASTIC, TQFP-80 |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| Parts packaging code | QFP | QFP | QFP | QFP | QFP | QFP |
| package instruction | PLASTIC, TQFP-80 | PLASTIC, TQFP-80 | PLASTIC, TQFP-80 | PLASTIC, TQFP-80 | PLASTIC, TQFP-80 | PLASTIC, TQFP-80 |
| Contacts | 80 | 80 | 80 | 80 | 80 | 80 |
| Reach Compliance Code | compli | compliant | compliant | compliant | compliant | compli |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum access time | 5 ns | 5 ns | 6.5 ns | 10 ns | 6.5 ns | 10 ns |
| Other features | CAN ALSO BE CONFIGURED AS 131,072X18 | CAN ALSO BE CONFIGURED AS 262,144X18 | CAN ALSO BE CONFIGURED AS 131,072X18 | CAN ALSO BE CONFIGURED AS 262,144X18 | CAN ALSO BE CONFIGURED AS 262,144X18 | CAN ALSO BE CONFIGURED AS 131,072X18 |
| period time | 7.5 ns | 7.5 ns | 10 ns | 15 ns | 10 ns | 15 ns |
| JESD-30 code | S-PQFP-G80 | S-PQFP-G80 | S-PQFP-G80 | S-PQFP-G80 | S-PQFP-G80 | S-PQFP-G80 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
| length | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm |
| memory density | 2359296 bi | 4718592 bit | 2359296 bit | 4718592 bit | 4718592 bit | 2359296 bi |
| memory width | 9 | 9 | 9 | 9 | 9 | 9 |
| Humidity sensitivity level | 3 | 3 | 3 | 3 | 3 | 3 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 80 | 80 | 80 | 80 | 80 | 80 |
| word count | 262144 words | 524288 words | 262144 words | 524288 words | 524288 words | 262144 words |
| character code | 256000 | 512000 | 256000 | 512000 | 512000 | 256000 |
| Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 256KX9 | 512KX9 | 256KX9 | 512KX9 | 512KX9 | 256KX9 |
| Exportable | YES | YES | YES | YES | YES | YES |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | LQFP | LQFP | LQFP | LQFP | LQFP | LQFP |
| Package shape | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| Package form | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | 240 | 240 | 240 | 240 | 240 | 240 |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm |
| Maximum supply voltage (Vsup) | 3.45 V | 3.45 V | 3.45 V | 3.45 V | 3.45 V | 3.45 V |
| Minimum supply voltage (Vsup) | 3.15 V | 3.15 V | 3.15 V | 3.15 V | 3.15 V | 3.15 V |
| Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| surface mount | YES | YES | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
| Terminal form | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| Terminal pitch | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm |
| Terminal location | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
| Maximum time at peak reflow temperature | 20 | 20 | 20 | 20 | 20 | 20 |
| width | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm |
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