|
IDT73200L12L |
IDT73201L15LB |
IDT73200L15LB |
IDT73200L20LB |
IDT73201L20LB |
IDT73201L12L |
IDT73200L15L |
IDT73201L15L |
| Description |
Pipeline Register, 16-Bit, CMOS, CQCC52, LCC-52 |
Pipeline Register, 16-Bit, CMOS, CQCC52, LCC-52 |
Pipeline Register, 16-Bit, CMOS, CQCC52, LCC-52 |
Pipeline Register, 16-Bit, CMOS, CQCC52, LCC-52 |
Pipeline Register, 16-Bit, CMOS, CQCC52, LCC-52 |
Pipeline Register, 16-Bit, CMOS, CQCC52, LCC-52 |
Pipeline Register, 16-Bit, CMOS, CQCC52, LCC-52 |
Pipeline Register, 16-Bit, CMOS, CQCC52, LCC-52 |
| Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
| Parts packaging code |
LCC |
LCC |
LCC |
LCC |
LCC |
LCC |
LCC |
LCC |
| package instruction |
LCC-52 |
LCC-52 |
LCC-52 |
LCC-52 |
LCC-52 |
LCC-52 |
LCC-52 |
LCC-52 |
| Contacts |
52 |
52 |
52 |
52 |
52 |
52 |
52 |
52 |
| Reach Compliance Code |
_compli |
not_compliant |
not_compliant |
not_compliant |
not_compliant |
not_compliant |
not_compliant |
not_compliant |
| ECCN code |
3A001.A.3 |
3A001.A.2.C |
3A001.A.2.C |
3A001.A.2.C |
3A001.A.2.C |
3A001.A.3 |
3A001.A.3 |
3A001.A.3 |
| boundary scan |
NO |
NO |
NO |
NO |
NO |
NO |
NO |
NO |
| maximum clock frequency |
83.33 MHz |
66.67 MHz |
66.67 MHz |
50 MHz |
50 MHz |
83.33 MHz |
66.67 MHz |
66.67 MHz |
| External data bus width |
16 |
16 |
16 |
16 |
16 |
16 |
16 |
16 |
| JESD-30 code |
S-CQCC-N52 |
S-CQCC-N52 |
S-CQCC-N52 |
S-CQCC-N52 |
S-CQCC-N52 |
S-CQCC-N52 |
S-CQCC-N52 |
S-CQCC-N52 |
| JESD-609 code |
e0 |
e0 |
e0 |
e0 |
e0 |
e0 |
e0 |
e0 |
| length |
19.05 mm |
19.05 mm |
19.05 mm |
19.05 mm |
19.05 mm |
19.05 mm |
19.05 mm |
19.05 mm |
| low power mode |
NO |
NO |
NO |
NO |
NO |
NO |
NO |
NO |
| Number of terminals |
52 |
52 |
52 |
52 |
52 |
52 |
52 |
52 |
| Maximum operating temperature |
70 °C |
125 °C |
125 °C |
125 °C |
125 °C |
70 °C |
70 °C |
70 °C |
| Output data bus width |
16 |
16 |
16 |
16 |
16 |
16 |
16 |
16 |
| Package body material |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
| encapsulated code |
QCCN |
QCCN |
QCCN |
QCCN |
QCCN |
QCCN |
QCCN |
QCCN |
| Encapsulate equivalent code |
LCC52,.75SQ |
LCC52,.75SQ |
LCC52,.75SQ |
LCC52,.75SQ |
LCC52,.75SQ |
LCC52,.75SQ |
LCC52,.75SQ |
LCC52,.75SQ |
| Package shape |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
| Package form |
CHIP CARRIER |
CHIP CARRIER |
CHIP CARRIER |
CHIP CARRIER |
CHIP CARRIER |
CHIP CARRIER |
CHIP CARRIER |
CHIP CARRIER |
| Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| power supply |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
| Maximum seat height |
2.2098 mm |
2.2098 mm |
2.2098 mm |
2.2098 mm |
2.2098 mm |
2.2098 mm |
2.2098 mm |
2.2098 mm |
| Maximum slew rate |
60 mA |
80 mA |
80 mA |
80 mA |
80 mA |
60 mA |
60 mA |
60 mA |
| Maximum supply voltage |
5.25 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.25 V |
5.25 V |
5.25 V |
| Minimum supply voltage |
4.75 V |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
4.75 V |
4.75 V |
4.75 V |
| Nominal supply voltage |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
| surface mount |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
| technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
| Temperature level |
COMMERCIAL |
MILITARY |
MILITARY |
MILITARY |
MILITARY |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
| Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
| Terminal form |
NO LEAD |
NO LEAD |
NO LEAD |
NO LEAD |
NO LEAD |
NO LEAD |
NO LEAD |
NO LEAD |
| Terminal pitch |
1.27 mm |
1.27 mm |
1.27 mm |
1.27 mm |
1.27 mm |
1.27 mm |
1.27 mm |
1.27 mm |
| Terminal location |
QUAD |
QUAD |
QUAD |
QUAD |
QUAD |
QUAD |
QUAD |
QUAD |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| width |
19.05 mm |
19.05 mm |
19.05 mm |
19.05 mm |
19.05 mm |
19.05 mm |
19.05 mm |
19.05 mm |
| uPs/uCs/peripheral integrated circuit type |
DSP PERIPHERAL, PIPELINE REGISTER |
DSP PERIPHERAL, PIPELINE REGISTER |
DSP PERIPHERAL, PIPELINE REGISTER |
DSP PERIPHERAL, PIPELINE REGISTER |
DSP PERIPHERAL, PIPELINE REGISTER |
DSP PERIPHERAL, PIPELINE REGISTER |
DSP PERIPHERAL, PIPELINE REGISTER |
DSP PERIPHERAL, PIPELINE REGISTER |
| Maker |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
- |
- |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |