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TDA8001AT

Description
Smart card interface
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size134KB,24 Pages
ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.)
Websitehttps://www.nxp.com/
Download Datasheet Parametric Compare View All

TDA8001AT Overview

Smart card interface

TDA8001AT Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerPhilips Semiconductors (NXP Semiconductors N.V.)
package instructionSOP, SOP28,.4
Reach Compliance Codeunknow
JESD-30 codeR-PDSO-G28
JESD-609 codee0
Number of terminals28
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP28,.4
Package shapeRECTANGULAR
Package formSMALL OUTLINE
power supply5,12 V
Certification statusNot Qualified
Maximum slew rate55 mA
surface mountYES
technologyBIPOLAR
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR CIRCUIT
INTEGRATED CIRCUITS
DATA SHEET
TDA8001
Smart card interface
Product specification
Supersedes data of 1995 Feb 01
File under Integrated Circuits, IC02
1996 Dec 12

TDA8001AT Related Products

TDA8001AT TDA8001T TDA8001A TDA8001
Description Smart card interface Smart card interface Smart card interface Smart card interface
Is it Rohs certified? incompatible incompatible incompatible incompatible
Maker Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.)
package instruction SOP, SOP28,.4 SOP, SOP28,.4 DIP, DIP28,.6 DIP, DIP28,.6
Reach Compliance Code unknow unknow unknow unknow
JESD-30 code R-PDSO-G28 R-PDSO-G28 R-PDIP-T28 R-PDIP-T28
JESD-609 code e0 e0 e0 e0
Number of terminals 28 28 28 28
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOP SOP DIP DIP
Encapsulate equivalent code SOP28,.4 SOP28,.4 DIP28,.6 DIP28,.6
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE SMALL OUTLINE IN-LINE IN-LINE
power supply 5,12 V 5,12,25 V 5,12 V 5,12,25 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum slew rate 55 mA 55 mA 55 mA 55 mA
surface mount YES YES NO NO
technology BIPOLAR BIPOLAR BIPOLAR BIPOLAR
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form GULL WING GULL WING THROUGH-HOLE THROUGH-HOLE
Terminal pitch 1.27 mm 1.27 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL
uPs/uCs/peripheral integrated circuit type MICROPROCESSOR CIRCUIT MICROPROCESSOR CIRCUIT MICROPROCESSOR CIRCUIT MICROPROCESSOR CIRCUIT
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