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TDA8001

Description
Smart card interface
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size134KB,24 Pages
ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.)
Websitehttps://www.nxp.com/
Download Datasheet Parametric Compare View All

TDA8001 Overview

Smart card interface

TDA8001 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerPhilips Semiconductors (NXP Semiconductors N.V.)
package instructionDIP, DIP28,.6
Reach Compliance Codeunknow
JESD-30 codeR-PDIP-T28
JESD-609 codee0
Number of terminals28
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP28,.6
Package shapeRECTANGULAR
Package formIN-LINE
power supply5,12,25 V
Certification statusNot Qualified
Maximum slew rate55 mA
surface mountNO
technologyBIPOLAR
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR CIRCUIT
INTEGRATED CIRCUITS
DATA SHEET
TDA8001
Smart card interface
Product specification
Supersedes data of 1995 Feb 01
File under Integrated Circuits, IC02
1996 Dec 12

TDA8001 Related Products

TDA8001 TDA8001T TDA8001A TDA8001AT
Description Smart card interface Smart card interface Smart card interface Smart card interface
Is it Rohs certified? incompatible incompatible incompatible incompatible
Maker Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.)
package instruction DIP, DIP28,.6 SOP, SOP28,.4 DIP, DIP28,.6 SOP, SOP28,.4
Reach Compliance Code unknow unknow unknow unknow
JESD-30 code R-PDIP-T28 R-PDSO-G28 R-PDIP-T28 R-PDSO-G28
JESD-609 code e0 e0 e0 e0
Number of terminals 28 28 28 28
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP SOP DIP SOP
Encapsulate equivalent code DIP28,.6 SOP28,.4 DIP28,.6 SOP28,.4
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE SMALL OUTLINE IN-LINE SMALL OUTLINE
power supply 5,12,25 V 5,12,25 V 5,12 V 5,12 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum slew rate 55 mA 55 mA 55 mA 55 mA
surface mount NO YES NO YES
technology BIPOLAR BIPOLAR BIPOLAR BIPOLAR
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE GULL WING THROUGH-HOLE GULL WING
Terminal pitch 2.54 mm 1.27 mm 2.54 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL
uPs/uCs/peripheral integrated circuit type MICROPROCESSOR CIRCUIT MICROPROCESSOR CIRCUIT MICROPROCESSOR CIRCUIT MICROPROCESSOR CIRCUIT

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