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TDA8000T

Description
Smart card interface
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size143KB,24 Pages
ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.)
Websitehttps://www.nxp.com/
Download Datasheet Parametric Compare View All

TDA8000T Overview

Smart card interface

TDA8000T Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerPhilips Semiconductors (NXP Semiconductors N.V.)
package instructionSOP, SOP28,.4
Reach Compliance Codeunknow
JESD-30 codeR-PDSO-G28
JESD-609 codee0
Number of terminals28
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP28,.4
Package shapeRECTANGULAR
Package formSMALL OUTLINE
power supply5,12 V
Certification statusNot Qualified
Maximum slew rate38 mA
surface mountYES
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR CIRCUIT
INTEGRATED CIRCUITS
DATA SHEET
TDA8000; TDA8000T
Smart card interface
Product specification
Supersedes data of 1995 Feb 01
File under Integrated Circuits, IC02
1996 Dec 12

TDA8000T Related Products

TDA8000T TDA8000
Description Smart card interface Smart card interface
Is it Rohs certified? incompatible incompatible
Maker Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.)
package instruction SOP, SOP28,.4 DIP, DIP28,.6
Reach Compliance Code unknow unknow
JESD-30 code R-PDSO-G28 R-PDIP-T28
JESD-609 code e0 e0
Number of terminals 28 28
Maximum operating temperature 70 °C 70 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOP DIP
Encapsulate equivalent code SOP28,.4 DIP28,.6
Package shape RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE IN-LINE
power supply 5,12 V 5,12 V
Certification status Not Qualified Not Qualified
Maximum slew rate 38 mA 38 mA
surface mount YES NO
Temperature level COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form GULL WING THROUGH-HOLE
Terminal pitch 1.27 mm 2.54 mm
Terminal location DUAL DUAL
uPs/uCs/peripheral integrated circuit type MICROPROCESSOR CIRCUIT MICROPROCESSOR CIRCUIT
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