BZT52B2V4 - BZT52B43
Technical Data
Data Sheet N1732, Rev.-
Green Products
BZT52B2V4 - BZT52B43 ZENER DIODES
Features:
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Planar Die Construction
350mW Power Dissipation on Ceramic PCB
General Purpose, Medium Current
Ideally Suited for Automated Assembly Processes
Available in Lead Free Version
Mechanical Dimensions: In mm/ Inches
SOD - 123
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China - Germany - Korea - Singapore - United States
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http://www.smc-diodes.com - sales@ smc-diodes.com
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BZT52B2V4 - BZT52B43
Technical Data
Data Sheet N1732, Rev.-
Green Products
Ordering Information:
Device
BZT52B2V4 - BZT52B43
Package
SOD-123
(Pb-Free)
Shipping
3000pcs / reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specification.
Maximum Ratings
(T
a
=25℃, Unless otherwise specified)
Characteristic
Forward Voltage (Note 2) @I
F
=10mA
Power Dissipation(Note 1)
Symbol
V
F
P
D
R
θJA
T
J
T
STG
Value
0.9
350
357
150
-55 to +150
Unit
V
mW
°C/W
°C
°C
Thermal resistance junction to Ambient
Junction Temperature
Storage Temperature Range
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China - Germany - Korea - Singapore - United States
•
•
http://www.smc-diodes.com - sales@ smc-diodes.com
•
BZT52B2V4 - BZT52B43
Technical Data
Data Sheet N1732, Rev.-
Green Products
Electrical Characteristics
@TA=25°C unless otherwise specified
Notes: 1. Device mounted on ceramic PCB: 7.6mm x 9.4mm x 0.87mm with pad areas 25mm
2. Short duration test pulse used to minimize self-heating effect
3. f = 1kHz
2
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China - Germany - Korea - Singapore - United States
•
•
http://www.smc-diodes.com - sales@ smc-diodes.com
•
BZT52B2V4 - BZT52B43
Technical Data
Data Sheet N1732, Rev.-
Green Products
DISCLAIMER:
1- The information given herein, including the specifications and dimensions, is subject to change without prior notice to improve product
characteristics. Before ordering, purchasers are advised to contact the SMC - Sangdest Microelectronics (Nanjing) Co., Ltd sales
department for the latest version of the datasheet(s).
2- In cases where extremely high reliability is required (such as use in nuclear power control, aerospace and aviation, traffic equipment,
medical equipment , and safety equipment) , safety should be ensured by using semiconductor devices that feature assured safety or by
means of users’ fail-safe precautions or other arrangement .
3- In no event shall SMC - Sangdest Microelectronics (Nanjing) Co., Ltd be liable for any damages that may result from an accident or
any other cause during operation of the user’s units according to the datasheet(s). SMC - Sangdest Microelectronics (Nanjing) Co., Ltd
assumes no responsibility for any intellectual property claims or any other problems that may result from applications of information,
products or circuits described in the datasheets.
4- In no event shall SMC - Sangdest Microelectronics (Nanjing) Co., Ltd be liable for any failure in a semiconductor device or any
secondary damage resulting from use at a value exceeding the absolute maximum rating.
5- No license is granted by the datasheet(s) under any patents or other rights of any third party or SMC - Sangdest Microelectronics
(Nanjing) Co., Ltd.
6- The datasheet(s) may not be reproduced or duplicated, in any form, in whole or part, without the expressed written permission of SMC
- Sangdest Microelectronics (Nanjing) Co., Ltd.
7- The products (technologies) described in the datasheet(s) are not to be provided to any party whose purpose in their application will
hinder maintenance of international peace and safety nor are they to be applied to that purpose by their direct purchasers or any third
party. When exporting these products (technologies), the necessary procedures are to be taken in accordance with related laws and
regulations..
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