BD105-04B-2-0300-0250-0250-NE datasheet, PDF

Datasheet> All Categories > The connector> The connector> BD105-04B-2-0300-0250-0250-NE

BD105-04B-2-0300-0250-0250-NE: DescriptionBoard Connector; CategoryThe connector The connector; File Size348KB，1 Pages; ManufacturerGlobal Connector Technology; Environmental Compliance

Download Datasheet Parametric View All

BD105-04B-2-0300-0250-0250-NE Overview

Board Connector

BD105-04B-2-0300-0250-0250-NE Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Global Connector Technology
Reach Compliance Code	compli
ECCN code	EAR99
Connector type	BOARD CONNECTOR
Contact to complete cooperation	GOLD FLASH
Contact completed and terminated	TIN
Contact material	COPPER ALLOY
JESD-609 code	e3
Manufacturer's serial number	BD105

Preview

Download Datasheet

View All

Global Connector Technology Ltd. - BD105: 1.27mm PITCH ELEVATED PIN HEADER, SINGLE ROW, SURFACE MOUNT, VERTICAL

SPECIFICATIONS

规格:

CURRENT RATING

电流额定值：

1 AMP

No. of Contacts

INSULATOR RESISTANCE

绝缘电阻值：

1000 MEGOHMS MIN.

03 to 33

DIELECTRIC WITHSTANDING

耐电压：

AC 300 V

Contact Plating

CONTACT RESISTANCE

接触电阻值：

20m

Ω

Max.

A = Gold Flash All Over

OPERATING TEMPERATURE

工½温度：

-40°C TO +105°C

B = Selective Gold Flash Contact Area/

CONTACT MATERIAL

端子物料：

COPPER ALLOY

Tin On Tail

INSULATOR MATERIAL

绝缘½物料

C = Tin All Over

STANDARD

标准物料

: POLYESTER

聚酯

, LCP, UL 94-V0

G = 10µ" Gold Contact Area/Tin On Tail

OPTIONS

可选物料

: POLYAMIDE

聚醯胺

, NYLON 6T, UL 94-V0

I = 30µ" Gold Contact Area/Tin On Tail

SOLDERING PROCESS

可焊性

Standard = Gold Flash All Over

LCP (STANDARD

标准物料

) -

IR REFLOW

回流焊

: 260°C for 10 sec.

WAVE

波峰焊

: 250°C for 5-10 sec

MANUAL SOLDER

人工焊接

: 350°C for 3-5 sec

NYLON 6T (OPTION

可选物料

) -

IR REFLOW

回流焊

: 260°C for 10 sec.

WAVE

波峰焊

: 230°C for 5-10 sec.

MANUAL SOLDER

人工焊接

: 350°C for 3-5sec

MATES WITH

配套之母座

(SUBJECT TO PIN LENGTH

在端子长度适合的条件下

BD074

BD075

BD080

BD090

DETAIL

REV

DATE

LYH

DRAWING

RELEASE

28/12/07

STANDARD INSULATOR

MATERIAL & PACKING

OPTIONS CHANGED

PACKING OPTIONS SOLDER TEMP & MATES

WITH INFO. UPDATED

CHANGED

27/04/09

20/05/09

G CE

N N

D E

N SC

E E

P L

Ordering Grid

BD105

XX X

XXXX

Type

1 = R1 Type

2 = R2 Type

Packing Options

B = Tape and Reel with Cap (Standard)

D = Tube (Standard - where height exceeds 25mm)

E = Tube with Cap

Insulator Material

L = LCP (Standard)

N = Nylon 6T

Dimension C (1/100mm)

(Post Height)

Standard - 3.00mm = 0300

or specify Dimension C

e.g. 2.50mm = 0250

Tol +/- 0.2mm

Dimension D (1/100mm)

(Stack Height)

Standard - 4.60mm = 0460

Please Specify Dimension D

e.g. 2.5mm = 0250

Tol +/- 0.2mm

Part Number:-

Dimension E (1/100mm)

(Footprint Width)

Standard - 4.50mm = 0450

or specify Dimension E

e.g. 2.50mm = 0250

Tol +/- 0.2mm

Tolerances

(Except as noted)

Date:-

Dimensions in mm

BD105

28 DEC 07

27/07/09

DIMENSION

AMMENDED

27/08/09

AJO

BD105

X PCN

15/05/14

X.°±5°

.X°±2°

X.X ± 0.20

X.XX ± 0.15 .XX°±1°

X.XXX ± 0.10 .XXX°±0.5°

X. ± 0.30

Third Angle Projection

Description:-

Sheet No.

1/1

1.27mm PITCH ELEVATED PIN HEADER, SINGLE ROW

SURFACE MOUNT, VERTICAL

www.globalconnectortechnology.com

Material

Drawn by

LYH

See Note

E & OE

THIS DRAWING IS CONFIDENTIAL AND MUST NOT BE

COPIED OR DISCLOSED WITHOUT WRITTEN CONSENT

Scale

NTS

Revision

Recommended Resources

NE555PWM pulse width modulation circuit

FM radio circuit of DA-101 chip

High performance automatic balancing charger circuit

Circuit diagram of multiple op amps working in parallel

Computer motherboard circuit diagram 815 4_21

What are the issues with connecting STM32's I/O logic levels to other IC's logic levels?: Generally, the logic level of the main control IC is 3.3V and 0V. If the peripheral IC needs to be controlled, some of them need to use low-power devices, that is, 3.3V powered devices. However, since...; heater stm32/stm8

6Related research on lowpan wireless network platform: I have always wanted to play around with IEEE-802.15.4 chips. I played around with Zigbee many years ago, but basically I just modified the official code to build a mesh network. I didn't continue to ...; lyzhangxiang RF/Wirelessly

invalid data received: When using signaltap, I get an error message "Invalid data received". What is the reason? Can anyone explain it to me? How can I solve it?...; 白丁 FPGA/CPLD

Where can I find an introduction to embedded LINUX? (audio or video): Where can I find an introduction to embedded LINUX? (audio or video)...; XATYS Linux and Android

Does anyone have the "Operational Amplifier Application Technical Manual"?: This book is too expensive. I don't have money to buy it. I can only ask you guys to upload a PDF for me to see. Thank you....; qrhrrong Analog electronics

Modelsim simulates the problem of dividing frequency by 2?: testbench:reg inclk0; reg rst;wire c0; //wire c1; // assign statements (if any)din10 i1 ( // port map - connection between master ports and signals/registers.c0(c0), //.c1(c1), .inclk0(inclk0), .rst(r...; maxcio FPGA/CPLD

Shortcut: S0 S1 S2 S3 S4 S5 S6 S7 S8 S9 SA SB SC SD SE SF SG SH SI SJ SK SL SM SN SO SP SQ SR SS ST SU SV SW SX SY SZ T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 TA TB TC TD TE TF TG TH TI TJ TK TL TM TN TO TP TQ TR TS TT TU TV TW TX TY TZ U0 U1 U2 U3 U4 U6 U7 U8 UA UB UC UD UE UF UG UH UI UJ UK UL UM UN UP UQ UR US UT UU UV UW UX UZ V0 V1 V2 V3 V4 V5 V6 V7 V8 V9 VA VB VC VD VE VF VG VH VI VJ VK VL VM VN VO VP VQ VR VS VT VU VV VW VX VY VZ W0 W1 W2 W3 W4 W5 W6 W7 W8 W9 WA WB WC WD WE WF WG WH WI WJ WK WL WM WN WO WP WR WS WT WU WV WW WY X0 X1 X2 X3 X4 X5 X7 X8 X9 XA XB XC XD XE XF XG XH XK XL XM XN XO XP XQ XR XS XT XU XV XW XX XY XZ Y0 Y1 Y2 Y4 Y5 Y6 Y9 YA YB YC YD YE YF YG YH YK YL YM YN YP YQ YR YS YT YX Z0 Z1 Z2 Z3 Z4 Z5 Z6 Z8 ZA ZB ZC ZD ZE ZF ZG ZH ZJ ZL ZM ZN ZP ZR ZS ZT ZU ZV ZW ZX ZY

Popular Components