The packaging and testing market will reach US$25.5 billion in 2008(China Electronics News)Zhou Yanwu, Research Director of Shuiqingmuhua 2006-6-20 According to forecasts, the global IC packaging a...
Solder, soldering irons, components and PCB boards all contain lead. It is not good for children to be exposed to too much. I learned a lesson when I was a child....
Recently, I debugged the Daytime example that comes with DriverStudio. The program only responds to the packet receiving operation, and the code debugging passed. Now I want to send a packet, so I add...
We are looking for experienced people to cooperate with us on the testing machine project, which is related to pressure detection, servo motor, motion control, etc. The requirements for cooperation ar...
According to foreign media reports, Ford Motor has applied to the U.S. Patent and Social Security Administration (USPTO) for a patent for a remote vehicle control system that may be used in future ...[Details]
From being a global leader to losing the market, Korean battery manufacturers have always wanted to regain the lost market and dignity, but facing Chinese battery manufacturers represented by CAT...[Details]
The problem of dynamic sealing of equipment always exists with the operation of the equipment. Today, we have specially sorted out the various commonly used sealing forms, usage scope and character...[Details]
Flip-chip and ball grid array (BGA) are two widely used packaging technologies in the electronics industry. Each has its own advantages and limitations, and in some cases, they can complement each ...[Details]
As more and more consumers purchase new energy vehicles, the safety of electric vehicles has become a major concern. This has been particularly prominent following a series of electric vehicle fire...[Details]
The mass production process of the new generation of cockpit platform has started, and the smart cockpit market has entered a new bonus cycle of technology iteration and platform upgrade.
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In mobile technology, sensors are the primary input for measured signals and form a component of a sensor system. They include sensitive and transducer elements connected to carriers and circuits. ...[Details]
Recently,
Xpeng Motors and Xinlian Integrated Circuit jointly announced the mass production of China's first hybrid silicon carbide product.
Designed and developed by Xpeng Motors and joint...[Details]
On August 25th, SK Hynix announced that it has completed development and entered mass production of its 321-layer, 2Tb QLC NAND flash memory product. This achievement marks the world's first applic...[Details]
On August 22nd, Lantu Motors unveiled a new technology called "Lanhai Intelligent Hybrid" during a live broadcast of CCTV News' "Top Laboratory." The name sounds like another new term, but a closer...[Details]
According to foreign media reports, BMW has just been granted a patent for a screen that could cover the entire roof. BMW hopes to transform at least a portion of the vehicle's headliner into a dis...[Details]
Core point: The automotive industry chain and the humanoid robot industry have collaborative advantages in hardware, software, and scenarios. Upstream and downstream companies in the automotive ind...[Details]
On August 22, the National Energy Administration released the latest data, showing that by the end of July 2025, China's total number of electric vehicle charging infrastructure will reach 16.696 m...[Details]
For autonomous vehicles to safely navigate the road, they must identify far more complex objects than just traffic lights, pedestrians, and other familiar objects. Among these obstacles is a crucia...[Details]
In June 2014, the Ministry of Industry and Information Technology issued 4G FD-LTE licenses to China Unicom and China Telecom. Together with the 4G TD-LTE licenses issued to China Mobile, China Uni...[Details]