* Code C, MIL-C-22992, Left-Hand Thread. Connector designations depicted thus [ ] are for reference only and are not to be used in part number development.
BACKSHELL INTERFACE STANDARDS (See pages 15-17 for more information)
DESIG. SPEC.
SERIES
DESIG. SPEC.
SERIES
A
MIL-DTL-5015 MS3400
A
PATT 602
MIL-DTL-26482 2
B
MIL-DTL-5015 MS3100
AS81703
3
C
MIL-C-22992 MS173XX
MIL-DTL-83723 I & III
D
MIL-DTL-26482 1
40M39569
E
MIL-DTL-26500 Aluminum
DEF 5326-3
F
MIL-DTL-38999 I & II
EN 2997, 3646
40M38277
ESC 10, 11
PAN 6433-1
LN 29504
PATT 614
NFC93422 HE302
PATT 616
PAN 6432-1, -2
NFC93422
HE308, 9
DESIG. SPEC.
SERIES
G
MIL-C-28840
H
MIL-DTL-38999 III & IV
EN3645
J
MIL-C-81511 1, 2, 3 & 4
VG95329
K
MIL-DTL-83723 II
DESIG. SPEC.
L
EN3372
JN 1003
LN 29729
NFC93422
PAN 6433-2
PATT 615
VG 96912
S
PATT 105
PATT 603
PATT 608
SERIES
HE306
13
How
to Order
CONNECTOR DESIGNATOR
A THREAD*
REFERENCE
7/16 – 28 UNEF
M12 x 1 – 6H
1/2 – 20 UNF
1/2 – 28 UNEF
9/16 – 24 UNEF
M15 x 1 – 6H
5/8 – 24 UNEF
5/8 – 28 UN
11/16 – 24 UNEF
M18 x 1 – 6H
3/4 – 20 UNEF
13/16 – 20 UNEF
M22 x 1 – 6H
7/8 – 20 UNEF
7/8 – 28 UN
15/16 – 20 UNEF
M25 x 1 – 6H
1 – 20 UNEF
1 - 28 UN
1 1/16 – 18 UNEF
M28 x 1 – 6H
1 1/8 – 18 UNEF
1 1/8 – 28 UN
1 3/16 – 18 UNEF
M31 x 1 – 6H
1 1/4 – 18 UNEF
1 1.4 – 28 UN
1 5/16 – 18 UNEF
M34 x 1 - 6H
1 3/8 – 18 UNEF
1 3/8 – 28 UN
1 7/16 – 18 UNEF
M37 x 1 – 6H
1 1/2 – 18 UNEF
1 1/2 – 28 UN
1 9/16 – UNEF
1 5/8 – UNEF
1 3/4 – 18 UNS
1 7/8 – 16 UN
2 – 18 UNS
2 1/16 – 16 UNS
2 1/8 – 16 UN
2 1/4 – 16 UN
2 5/16 – 16 UNS
2 3/8 – 16 UN
2 1/2 – 16 UN
2 5/8 – 16 UN
2 3/4 – 16 UN
2 7/8 – 16 UN
3 – 16 UN
3 1/16 – 16 UN
B
DIA MAX
.590 (15.)
.650 (16.5)
.650 (16.5)
.650 (16.5)
.720 (18.3)
.770 (19.6)
.770 (19.6)
.770 (19.6)
.840 (21.3)
.890 (22.6)
.970 (24.6)
.970 (24.6)
1.030 (26.2)
1.090 (27.7)
1.030 (26.2)
1.090 (27.7)
1.150 (29.2)
1.220 (29.2)
1.150 (29.2)
1.220 (31.0)
1.280 (32.5)
1.340 (34.0)
1.280 (32.5)
1.340 (34.0)
1.410 (35.8)
1.470 (37.3)
1.410 (35.8)
1.470 (37.3
1.530 (38.9)
1.590 (40.4)
1.530 (38.9)
1.590 (40.4)
1.660 (42.2)
1.660 (42.2)
1.660 (42.2)
C
DIA MAX
.650 (16.5)
.770 (19.6)
.650 (16.5)
.770 (19.6)
.770 (19.6)
.820 (20.8)
.770 (19.6)
.890 (22.6)
.890 (22.6)
.940 (23.9)
.940 (23.9)
1.020 (29.2)
1.070 (26.2)
1.020 (25.9)
1.150 (29.2)
1.150 (29.2)
1.210 (30.7)
1.210 (30.7)
1.360 (34.5)
1.230 (31.2)
1.360 (34.5)
1.360 (34.5)
1.480 (37.6)
1.360 (34.5
1.480 (37.6)
1.530 (38.9)
1.600 (40.6)
1.480 (37.6)
1.600 (40.6)
D
DIA MAX
.770 (19.6)
E
DIA MAX
.690 (17.5)
.940 (24.8)
.690 (17.5)
How
to Order
GLENAIR
SYMBOL
A
B
C*
G*
J
LF
M
N
NC
NF
T
U
ZU**
ZN
*
**
W
N
A
M85049 SYMBOL
REFERENCE ONLY
FINISH
Cadmium Plate, Bright
Anodize, Black
Hard Coat, Anodic
Electroless Nickel
Cadmium Plate, Black
Cadmium Plate, Black
Reference Information
Standard Materials and Finishes
TABLE II - STANDARD FINISHES
SPECIFICATION(S)
AMS-QQ-P-416, Type I, Class 2
AMS-QQ-P-416, Type II, Class 3
AMS-A-8625, Type II, Class 2
AMS-A-8625, Type III, Class 1
Cadmium Plate, Olive Drab
Iridite, Gold Over Cadmium Plate Over MIL-C-5541, Class 3 AMS-QQ-P-416, Type II,
Electroless Nickel
Class 3 over AMS-C-26074, Class 4, Grade B
Cadmium Plate, Bright Over
Electroless Nickel
Cadmium Plate, Olive Drab Over
Electroless Nickel
Zinc Cobalt, Dark Olive Drab
Cadmium Plate, Olive Drab Over
Electroless Nickel
Cadmium Plate, Bright Over
Electroless Nickel
1000 Hour Corrosion Resistance
AMS-C-26074, Class 4, Grade B
AMS-QQ-P-416, Type II, Class 3 over Electroless Nickel
AMS-C-26074
96 Hour Corrosion Resistance
1000 Hour Corrosion Resistance
AMS-QQ-P-416, Type I, Class 3
ASTMB 733-90, SC2, Type I, Class 5, MIL-C-26074***
AMS-QQ-P-416, Type II, Class 3
AMS-QQ-P-416, Type II, Class 3
ASTMB 841-91, Over Electroless Nickel 1000 Hour Salt
Spray
Zinc-Nickel Alloy, Olive Drab
Anodize finish; not suitable for EMI Shielding or grounding applications.
Applicable to corrosion resisting steel backshells and accessories. Consult factory for other available finishes.
The following standard materials are used for the majority of Glenair
backshells and connector accessories. However, backshell compo-
nents are not limited to those items listed, but are representative of
the elements used in Glenair's general accessory products. Contact
Glenair for applicable specifications on items not listed below.
STANDARD MATERIALS - BACKSHELLS AND ACCESSORIES
COMPONENT
Machined components: such as backshell bodies, fabricated elbows, protective covers,
rotatable couplers, dummy stowage receptacles, lock nuts, G-spring support rings,
EMI ground rings, grommet followers, etc.
Die cast components: such as angular backshells, strain relief backshells, strain relief
bodies, strain relief saddles, special EMI ground rings, etc.
Backshells or strain reliefs: available in optional corrosion resisting steel; and
hardware: such as screws, washers, rivets, wire rope, sash chain, band straps, etc.
Elastomeric seals: such as O-rings, cable jacket seals, grommets, etc.
Anti-friction and thrust washers
Anti-rotation device
MATERIAL
Aluminum
SPECIFICATION
AMS-QQ-A-200
ASTMB221, 209
QQ-A-591
ASTMB85, 26
Corrosion Resisting Steel ASTMA582 (300 Series)
AMS-QQ-S-763
Silicone
ZZ-R-765, MIL-R-25988
Teflon
TFE
N/A
Corrosion Resistant
Material
Aluminum
BODY STRAP
Glenair offers an optional stainless steel body strap for
attaching protective covers as illustrated. To specify body
strap, add suffix letter C to the end of the part number. For
example 360AS001M1610M6C.
NOTES
On all length callouts, tolerance is ± .060 unless otherwise
specified.
Unless otherwise specified, the following other dimensional
tolerances will apply:
.xx = ± .03 (0.8)
.xxx = ± .015 (0.4)
Lengths = ± .060 (1.52)
Angles = ± 5°
Metric dimensions (mm) are indicated in parentheses
Channel 10 of ADC12 in msp430 is connected to the internal analog temperature sensor, which can measure the temperature of the msp430 chip and display the temperature on the 12864 LCD. The following i...
Optimization method description: The intrinsics provided by the C6000 compiler can quickly optimize C code. The leading underscore of an intrinsic indicates that it can be called just like a function,...
I use vxworks5.5, the hardware environment is pc104, and I have a digital IO board with isa bus. The physical base address of the board is 0x300. I have the following questions to ask experts: 1. Beca...
The training center of China Science and Technology Information Soft Technology Co., Ltd. (referred to as [b]China Science and Technology Information Soft[/b]) relies on the strong technical talent ad...
The core of a machine vision system is image acquisition and processing. All information comes from images, and image quality is crucial to the entire vision system. A good image can improve the st...[Details]
If the ultimate form of a car is a silicon-based life form, then in
the field of
intelligent driving
, it has gradually taken on the appearance of a "veteran driver." In
the field of
the ...[Details]
Is pure electric vehicles a false proposition for long-distance driving? At least from my personal perspective, based on current technological and infrastructure standards, I believe so. Below, I'l...[Details]
Topics: Bring Your Own Device (BYOD) trends; the impact of using employees' own mobile devices to control access to work facilities and equipment on information security; and ways to securely imple...[Details]
On August 22nd, Lantu Motors unveiled a new technology called "Lanhai Intelligent Hybrid" during a live broadcast of CCTV News' "Top Laboratory." The name sounds like another new term, but a closer...[Details]
One of the most core components of electric vehicles is the motor. The power supply provides electrical energy to the motor, which converts this electrical energy into mechanical energy, which in t...[Details]
SMT placement machines are important equipment in surface mount technology (Surface Mount Technology). Their performance has a decisive impact on the quality and efficiency of electronic manufactur...[Details]
Reflow soldering, as an electronics assembly process, has become a vital component of the electronics manufacturing industry. Choosing reflow soldering equipment is crucial for improving production...[Details]
On August 22, the Wall Street Journal reported on the 21st local time that the new US government does not plan to acquire equity in semiconductor wafer foundry giant TSMC and Micron, one of the thr...[Details]
According to Nikkei, a survey found that global electric vehicle battery supply is expected to reach more than three times the required quantity due to
cooling
demand for electric vehicles,...[Details]
Tiantai Robot's official Weibo account announced on the evening of August 20 that Tiantai Robot Co., Ltd., together with strategic partners including Shandong Future Robot Technology Co., Ltd., Sha...[Details]
China, August 21, 2025 – STMicroelectronics (NYSE: STM), a world-leading semiconductor company serving a wide range of electronics applications, has published its IFRS 2025 semi-annual financial re...[Details]
On August 21, it was reported that Intel's new generation of AI chip Jaguar Shores was recently exposed for the first time.
According to photos shared by Andreas Schilling, the Jaguar Shores t...[Details]
introduction
The rapid adoption of computers has led to a growing number of tasks being performed on them. People from all walks of life, especially programmers and writers, are spending incre...[Details]
High-definition media consumption is experiencing a dual growth: an increase in the number of consumers and a transition to higher-definition content. This growth is driven by increasingly widespre...[Details]