HYS72D32000GU-7.5 datasheet, PDF

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HYS72D32000GU-7.5: DescriptionDDR DRAM Module, 32MX72, 0.75ns, CMOS, DIMM-184; Categorystorage storage; File Size212KB，21 Pages; ManufacturerInfineon; Websitehttp://www.infineon.com/

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HYS72D32000GU-7.5 Overview

DDR DRAM Module, 32MX72, 0.75ns, CMOS, DIMM-184

HYS72D32000GU-7.5 Parametric

Parameter Name	Attribute value
Maker	Infineon
Parts packaging code	DIMM
package instruction	,
Contacts	184
Reach Compliance Code	unknow
ECCN code	EAR99
access mode	SINGLE BANK PAGE BURST
Maximum access time	0.75 ns
Other features	AUTO/SELF REFRESH
JESD-30 code	R-XDMA-N184
memory density	2415919104 bi
Memory IC Type	DDR DRAM MODULE
memory width	72
Number of functions	1
Number of ports	1
Number of terminals	184
word count	33554432 words
character code	32000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	32MX72
Package body material	UNSPECIFIED
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
Certification status	Not Qualified
self refresh	YES
Maximum supply voltage (Vsup)	2.7 V
Minimum supply voltage (Vsup)	2.3 V
Nominal supply voltage (Vsup)	2.5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	NO LEAD
Terminal location	DUAL

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HYS64/72D32000GU / HYS64/72D64020GU

Unbuffered DDR-I SDRAM-Modules

2.5 V 184-pin Unbuffered DDR-I SDRAM Modules

256MB & 512MB Modules

Preliminary Datasheet Rev. 0.99

• 184-pin Unbuffered 8-Byte Dual-In-Line

DDR-I SDRAM non-parity and ECC-Modules

for PC and Server main memory applications

• One bank 32M

64, 32M x 72 and two bank

64M x 64, 64M

72 organization

• JEDEC standard Double Data Rate

Synchronous DRAMs (DDR-I SDRAM)

Single + 2.5 V (± 0.2 V) power supply

• Built with 256Mbit DDR-I SDRAMs

organisaed as 32Mb x 8 in 66-Lead TSOPII

package

• Programmable CAS Latency, Burst Length,

and Wrap Sequence (Sequential &

Interleave)

• Performance:

-7

Component Speed Grade

Module Speed Grade

• Auto Refresh (CBR) and Self Refresh

• All inputs and outputs SSTL_2 compatible

• Serial Presence Detect with E

PROM

• Jedec standard MO-206a form factor:

133.35 mm

31.75 mm

4.00 mm

• Jedec standard reference layout

• Gold plated contacts

-7.5

PC2100

133

100

-8

PC1600

125

100

Unit

DDR266A DDR266B DDR200

PC2100

143

133

MHz

Clock Frequency (max.) @ CL = 2.5

Clock Frequency (max.) @ CL = 2

The HYS64/72Dxx0x0GU are industry standard 184-pin 8-byte Dual in-line Memory Modules

(DIMMs) organized as 32M

64 and 64M

64 for non-parity and 32M x 72 and 64M x 72 for ECC

main memory applications. The memory array is designed with Double Data Rate Synchronous

DRAMs. A variety of decoupling capacitors are mounted on the PC board. The DIMMs feature serial

presence detect based on a serial E

PROM device using the 2-pin I

C protocol. The first 128 bytes

are programmed with configuration data and the second 128 bytes are available to the customer.

INFINEON Technologies

2.01

HYS72D32000GU-7.5 Related Products

	HYS72D32000GU-7.5	HYS64D64020GU-7.5	HYS72D32000GU-7	HYS64D32000GU-7.5	HYS72D64020GU-7	HYS72D64020GU-7.5	HYS72D64020GU-8	HYS72D32000GU-8
Description	DDR DRAM Module, 32MX72, 0.75ns, CMOS, DIMM-184	DDR DRAM Module, 64MX64, 0.75ns, CMOS, DIMM-184	DDR DRAM Module, 32MX72, 0.75ns, CMOS, DIMM-184	DDR DRAM Module, 32MX64, 0.75ns, CMOS, DIMM-184	DDR DRAM Module, 64MX72, 0.75ns, CMOS, DIMM-184	DDR DRAM Module, 64MX72, 0.75ns, CMOS, DIMM-184	DDR DRAM Module, 64MX72, 0.8ns, CMOS, DIMM-184	DDR DRAM Module, 32MX72, 0.8ns, CMOS, DIMM-184
Maker	Infineon	Infineon	Infineon	Infineon	Infineon	Infineon	Infineon	Infineon
Parts packaging code	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM
Contacts	184	184	184	184	184	184	184	184
Reach Compliance Code	unknow	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
access mode	SINGLE BANK PAGE BURST	DUAL BANK PAGE BURST	SINGLE BANK PAGE BURST	SINGLE BANK PAGE BURST	DUAL BANK PAGE BURST	DUAL BANK PAGE BURST	DUAL BANK PAGE BURST	SINGLE BANK PAGE BURST
Maximum access time	0.75 ns	0.75 ns	0.75 ns	0.75 ns	0.75 ns	0.75 ns	0.8 ns	0.8 ns
Other features	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH
JESD-30 code	R-XDMA-N184	R-XDMA-N184	R-XDMA-N184	R-XDMA-N184	R-XDMA-N184	R-XDMA-N184	R-XDMA-N184	R-XDMA-N184
memory density	2415919104 bi	4294967296 bit	2415919104 bit	2147483648 bit	4831838208 bit	4831838208 bit	4831838208 bit	2415919104 bit
Memory IC Type	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE
memory width	72	64	72	64	72	72	72	72
Number of functions	1	1	1	1	1	1	1	1
Number of ports	1	1	1	1	1	1	1	1
Number of terminals	184	184	184	184	184	184	184	184
word count	33554432 words	67108864 words	33554432 words	33554432 words	67108864 words	67108864 words	67108864 words	33554432 words
character code	32000000	64000000	32000000	32000000	64000000	64000000	64000000	32000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	32MX72	64MX64	32MX72	32MX64	64MX72	64MX72	64MX72	32MX72
Package body material	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
self refresh	YES	YES	YES	YES	YES	YES	YES	YES
Maximum supply voltage (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
Minimum supply voltage (Vsup)	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V
Nominal supply voltage (Vsup)	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V
surface mount	NO	NO	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL

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