1801 Morgan Street
Rockford, Illinois 61102
800-435-2931
www.molexkits.com
Datasheet for 76650-0192
General Information
Part Number:
76650-0192
Manufacturer:
Title:
Description:
Product Family:
Certificates:
Molex / Waldom
Deluxe Board Stacking Application Kit
Includes KK100, HDM, EBBI 50D, SEARAY, Plateau HS Mezz, IEEE1386,
SlimStack Product Families. Pitches range: 0.635mm (.025)" - 2.54mm (0.1)"
Mezzanine IEEE 1386, HDM®**, SlimStack™, KK® 100, EBBI™ 50D, Plateau HS
Mezz™, and SEARAY*
(Molex Parts within this kit) - EU RoHS and RoHS by Exempt Compliant
Country of Origin:
Kit assembled in U.S.A.
Specifications
Design
Configuration:
Pitch:
Connector Type:
Circuit Sizes:
Current Rating:
Voltage:
Product Highlights
The SEARAY board-to-board connector is designed for computer, networking,
telecom, storage and general market applications with high pin-count devices or
memory modules that are mounted on mezzanine or module PC Boards (PCBs).
The design of our SEARAY has superior electrical and mechanical features that are
cost competitive. The unique, Molex-patented, solder charge technology results in
better process yields and a lower applied cost versus equivalent BGA connector
products. Circuit sizes range from 160 through 500 positions, and mated stack
heights cover 7mm (.276") to 13mm (.512").
Molex's SlimStack connectors are tested to accommodate frequency rates up to 3
GHz for various high-speed applications. With a broad range of circuit sizes and
stack heights, SlimStack offers an economical way to achieve high-speed
performance in both 50 and 100 Ohm systems.
Utilizes proprietary Plateau Technology™ (plated gold housing) to provide a high-
speed high-density mezzanine connector system for differential and single-ended
signal applications. The gold-plated plastic shields each differential pair from neigh-
boring pairs, lowering crosstalk and improving signal clarity. Different stack heights
and circuit sizes provide flexibility in design and grounding the conductive housing
eliminates the need for individual ground pin designations within the connector.
* SEARAY is a trademark of Samtec, Inc.
** HDM® is a registered trademark of Amphenol Corporation
Board-to-Board
0.635mm (.025"), 1.0mm (.039"), 1.20mm (.047"), 1.27mm (.050"), [1.27mm
(.050")]sq. , 2mm (.079"), and 2.54mm (.100")
Receptacles and Headers/Plugs
2, 3, 4, 6, 8, 12, 20, 50, 64, 72 and 200
0.5, 1.0, 1.5, 2.5 and 4 Amps
30, 100 and 240 Volts
For additional Molex / Waldom Design and Solution Kits please go to www.molexkits.com
Page 1 of 6
1801 Morgan Street
Rockford, Illinois 61102
800-435-2931
www.molexkits.com
Datasheet for 76650-0192
Product Highlights continued
The High Density Metric (HDM) connector system is designed for applications that
require high interconnect density and high-speed signal integrity. Signal modules
of 72 and 144 contacts are available. Daughtercard modules are combined on a
metal stiffener so that they are handled as one connector. Special modules are
available for power, guidance, mounting and coding functions. These building
blocks can be combined to create very large connectors. Connectors of above
1000 circuits are not unusual. The power contacts can handle 15A of current per
power blade, efficiently delivering hundreds of watts in multiple voltage levels, even
in hot plug applications.
The IEEE 1386 standard contains the details for adding standardized PCI
mezzanine cards (PMC) to VMEbus and Multibus host boards. There are also
many LAN, WAN, telecommunications, PC and workstation users who want a
standardized mezzanine scheme and see the IEEE 1386 as the best approach.
The fully shrouded leaf-style design minimizes the chance of damaging plug
contacts. Our receptacle contacts feature a low mating force that reduces PCB
stress. Gold over Nickel contact plating enhances long-term reliability, while the
UL94V-0 LCP housings withstand SMT reflow processes.
Excellent tolerance absorption allows the connector to be used in combinations of
one to four mated pairs for up to 256 circuits. The connector design is hard-metric,
easy-mating, robust, surface-mounted and features high circuit density, with
excellent electrical performance. Along with that, it comes in a range of stacking
heights from 8.00 through 15.00mm (.315 through .591") for optimizing system
function.
The proven KK system of "building block" connectors can be used to create
thousands of different configurations. The Molex KK interconnection system can
provide all the options necessary to complement PC board interconnection design
requirements. For this reason, KK has become known as a versatile interconnecting
system developed to meet the challenge of modularization.
The Molex EBBI 50D series meets the market demand for low-cost, unshielded, high
density, leaf-style connectors. Several configurations are available including vertical,
right angle and blind-mating to provide valuable design flexibility and expandability.
Leaf-style terminals are arranged in two rows on .050" spacing within a polarized "D"-
shaped housing for rugged mechanical protection. Housings are made of high
temperature, UL 94V-0 thermoplastic. Terminals are plated with 30 micro-inches
min. gold in the mating area for long term reliability and durability.
** HDM® is a registered trademark of Amphenol Corporation
Features and Benefits
• Unique patented solder attach is more
cost effective and reliable than BGA
• SEARAY footprint is compatible with other
1.27mm(.050") by 1.27mm(.050") products
• Robust guidance and polarization aligns
connectors to mate in correct position
Applications
• High and Mid-Range Computers and Servers
• Medical Scanning Equipment
• Military
• Network Routers and Switches
• Mobile Base Stations
For additional Molex / Waldom Design and Solution Kits please go to www.molexkits.com
Page 2 of 6
1801 Morgan Street
Rockford, Illinois 61102
800-435-2931
www.molexkits.com
Datasheet for 76650-0192
Features and Benefits continued
• 3 GHz performance
• Cross Talk < 7%
• 6.00 to 16.00mm stack heights
• Economical design
• For 50 and 100 Ohm applications
• Anti-flux design
• Metal solder tabs provide PCB hold down
and strain relief for SMT tails
• Polarizing pegs assist placement
• Housing lock on 20 to 60 circuits
• Superior terminal design/wipe length
• Easy board processing
• Advanced gold-plated housings with
integrated shielding system
• Two points of contact on each signal
• Multiple stack heights from 10 to25mm
(.394 to .984")
• Available in 6, 12, 24, and 36 differential
pair sizes (12, 24, 48 and 72 contacts)
• Up to 32mm board-to-board stack heights
• For parallel board packaging
• Available in press-fit or solder tail
• For Mezzanine cards, parallel backplanes
and bridge board applications
• End walls facilitate blind mating
• Surface Mount Compatible
• High-density 2.00mm metric connector in
the same form factor as Future bus
• 6-row 2mm connector provides 30
contacts per linear centimeter (> 75/inch)
• Designed for high-density, high-speed
applications
• Modular components for design flexibility;
72 position (6 row by 12) and 144 position
(6 row by 24) modules
• Tail lengths available in 0.5mm
increments to optimize PCB thickness
Applications continued
• Mobile Phone
• PDA
• Digital Video Camera
• Digital Still Camera
• Digital Video Player
• Digital Audio Player
• Voice Recorder
• Notebook PC
• Any Compact Applications
• Switches and Hubs
• Routers
• Servers and Blade Servers
• Workstations
• Storage Devices
• High-End Computer
• Storage
• Telecom (General)
• Broadcast Equipment
• Telecom Infrastructure
• Networking
• Telecom (Home/Office)
Features and Benefits continued
Applications continued
For additional Molex / Waldom Design and Solution Kits please go to www.molexkits.com
Page 3 of 6
1801 Morgan Street
Rockford, Illinois 61102
800-435-2931
www.molexkits.com
Datasheet for 76650-0192
• Leaf-style design protects pins
• Low insertion force
• For use in combinations of 1 to 4 mated
pairs
• High-temperature LCP housing for use
with lead-free processing temps
• Multiple stack heights 8.00-15.00mm
(.315-.591"), offers design flexibility
• Low mating forces, less stress on PCB
and solder joints
• Select 30u" Gold plating on contact, high
reliability with 100-cycle durability rating
• Anti-flux intrusion feature, compatible
with no-wash soldering processes
• End-to-end stackable
• Strain relieving board hooks
• Also available without board hooks
• Various pin lengths available
• Voided circuits available (contact Molex)
• Versions to accept mating pins vertically,
horizontally or through the PCB
• Network Interface Cards for NIC-HBA
• SCSI Host Bus and Adapter Cards for NIC-HBA
• Board-to-Board Mezzanine Connectors for Switch-
Router
• Mezzanine Card Connectors for Server
• Mezzanine Card Connectors for Disk Array
• Vending and Gaming Machines
• Production Equipment
• Industrial Instruments
• Energy and Power
• Comfort and Infotainment
• Brown Goods
• Security and Alarms
• Business Machines
• Computer Peripherals
• Consumer (General)
• Vending and Gaming
• Business Machines
• High-End Computer
• Production Equipment
• Polarized D-shape leaf contact for parallel
board packaging
• Leaf-style interface provides high-
durability
• Available in 50, 68, and 80 circuits
• Blind-mate version
• SMT versions available
• Receptacle mates to standard .062 inch
pc card edge
• Polarized guide posts allow extra lead-in
on blind-mate versions
• Polarized guide features provide generous
2.0mm radial lead-in for blind mating
• Press-fit retention pegs for mechanical
hold down before and after processing
• Low profile—12.50mm (.492") stack
height for parallel board stacking
• Surface Mount Compatible
Bill of Materials for Part No. 76650-0192
For additional Molex / Waldom Design and Solution Kits please go to www.molexkits.com
Page 4 of 6
1801 Morgan Street
Rockford, Illinois 61102
800-435-2931
www.molexkits.com
Datasheet for 76650-0192
Country
Molex Part No. of Origin
45970-2311
45971-2311
52885-0274
52901-0274
55091-0274
53647-0274
75003-0305
75003-0308
75005-0304
75005-0306
73770-0100
73780-2257
71436-0164
71436-2164
71439-0164
22-03-2021
22-03-2031
22-03-2041
22-03-2061
22-03-2081
USA
USA
Japan
Japan
Japan
Japan
USA
USA
USA
USA
USA
USA
USA
USA
USA
Quantity in Kit
Description
[1.27mm (.050")]sq. Pitch SEARAY* Plug, 200 Circuits, H =
6.1mm
1
[1.27mm (.050")]sq. Pitch SEARAY* Receptacle, 200
Circuits, H = 6.55mm
1
.635mm (.025") Pitch SlimStack™ 20 Circuit Receptacle, H =
5 MM
1
.635mm (.025") Pitch SlimStack™ 20 Circuit Receptacle, H =
11 MM
1
.635mm (.025") Pitch SlimStack™ 20 Circuit Plug, H = 6 mm
.635mm (.025") Pitch SlimStack™ 20 Circuit Plug, H = 8 mm
1.20mm (.047") Pitch Plateau HS Mezz™ Plug 6 Pair 12
Circuit, H = 5.5mm
1.20mm (.047") Pitch Plateau HS Mezz™ Plug 6 Pair 12
Circuit, H = 8.5mm
1.20mm (.047") Pitch Plateau HS Mezz™ Receptacle 6 Pair
12 Circuit, H = 4.5mm
1.20mm (.047") Pitch Plateau HS Mezz™ Receptacle 6 Pair
12 Circuit H = 6.5mm
2mm (.079") Pitch 72 Circuit HDM®** Press-Fit Stacking
Header, H = 15mm
2mm (.079") Pitch 72 Circuit HDM®** Press-Fit Receptacle,
H = 17mm
1.00mm (.039") Pitch Mezzanine IEEE 1386, 64 Circuit Plug,
H = 8mm
1.00mm (.039") Pitch Mezzanine IEEE 1386, 64 Circuit Plug,
H = 10mm
1.00mm (.039") Pitch Mezzanine IEEE 1386, 64 Circuit
Receptacle, H = 8mm
1
1
1
1
1
1
1
1
1
1
1
5
3
3
2
2
MEXICO 2.54mm (.100") Pitch KK® 100 Header Vertical 2 Circuit
MEXICO 2.54mm (.100") Pitch KK® 100 Header Vertical 3 Circuit
MEXICO 2.54mm (.100") Pitch KK® 100 Header Vertical 4 Circuit
MEXICO 2.54mm (.100") Pitch KK® 100 Header Vertical 6 Circuit
MEXICO 2.54mm (.100") Pitch KK® 100 Header Vertical 8 Circuit
* SEARAY is a trademark of Samtrec, Inc.
** HDM® is a registered trademark of Amphenol Corporation
Bill of Materials for Part No. 76650-0192 continued
For additional Molex / Waldom Design and Solution Kits please go to www.molexkits.com
Page 5 of 6
京公网安备 11010802033920号
EEWORLD
