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L7C174KMB20

Description
Cache Tag SRAM, 8KX8, 20ns, CMOS, CQCC32, CERAMIC, LCC-32
Categorystorage    storage   
File Size61KB,8 Pages
ManufacturerLOGIC Devices
Websitehttp://www.logicdevices.com/
Download Datasheet Parametric Compare View All

L7C174KMB20 Overview

Cache Tag SRAM, 8KX8, 20ns, CMOS, CQCC32, CERAMIC, LCC-32

L7C174KMB20 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerLOGIC Devices
Parts packaging codeQFJ
package instructionQCCN, LCC32,.45X.55
Contacts32
Reach Compliance Codeunknow
ECCN code3A001.A.2.C
Maximum access time20 ns
Other featuresMATCH OUTPUT
JESD-30 codeR-CQCC-N32
JESD-609 codee0
length13.97 mm
memory density65536 bi
Memory IC TypeCACHE TAG SRAM
memory width8
Humidity sensitivity level3
Number of functions1
Number of ports1
Number of terminals32
word count8192 words
character code8000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize8KX8
Output characteristics3-STATE
ExportableYES
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeQCCN
Encapsulate equivalent codeLCC32,.45X.55
Package shapeRECTANGULAR
Package formCHIP CARRIER
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)225
power supply5 V
Certification statusNot Qualified
Filter level38535Q/M;38534H;883B
Maximum seat height3.048 mm
Maximum standby current0.0002 A
Minimum standby current2 V
Maximum slew rate0.14 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width11.43 mm
L7C174
DEVICES INCORPORATED
8K x 8 Cache-Tag Static RAM
L7C174
DEVICES INCORPORATED
8K x 8 Cache-Tag Static RAM
DESCRIPTION
The
L7C174
is a high-performance,
low power CMOS static RAM opti-
mized for use as the address tag
comparator in high speed cache
memory systems. One L7C174 can be
used to map 8K cache lines into a
1 megabyte address space by compar-
ing 20 address bits organized as
13-line address bits and 7-page
address bits.
This device is available in five speed
grades with maximum address-to-
MATCH times of 12 ns to 35 ns.
Operation is from a single +5 V power
supply with power consumption only
being 300 mW (typical) at 35 ns.
Dissipation drops to 500 µW (typical)
when the memory is deselected
(Enable is high).
The L7C174 consumes only 30 µW
(typical) at 3 V allowing effective
battery backup operation. For mini-
mal power consumption, data may be
retained in inactive storage with a
supply voltage as low as 2 V.
The L7C174 provides fully asynchro-
nous (unclocked) operation with
matching access and cycle times. An
active low Chip Enable and Output
Enable along with a three state I/O
bus simplify the connection of several
chips for increased storage capacity.
Wide tag addresses are easily accom-
modated by paralleling devices and
Wire-ORing the MATCH outputs. A
low on the MATCH output indicates a
data mismatch.
Memory locations are specified on
address pins A
0
through A
12
with
functions defined in the Truth Table.
During CLEAR, the state of the I/O
pins remain completely defined by the
WE, CE, and OE control inputs. Data
In has the same polarity as Data Out.
8
5
COLUMN
ADDRESS
FEATURES
u
8K x 8 CMOS Static RAM with 8-bit
Tag Comparison Logic
u
High Speed Address-to-MATCH
— 12 ns maximum
u
High Speed Flash Clear
u
High Speed Read Access Time
— 12 ns maximum
u
Low Power Operation
Active: 300 mW typical at 35 ns
Standby: 500 µW typical
u
Data Retention at 2 V for Battery
Backup Operation
u
Available 100% Screened to
MIL-STD-883, Class B
u
Plug Compatible with IDT7174,
IDT71B74, MK48H74
u
Package Styles Available:
• 28-pin Plastic DIP
• 28-pin Ceramic DIP
• 28-pin Plastic SOJ
• 32-pin Ceramic LCC
L7C174 B
LOCK
D
IAGRAM
ROW
ADDRESS
CLEAR
BS
8
ROW
SELECT
8
8
COMPARATOR
O
8
1 (if MATCH)
The storage circuitry is organized as
8192 words by 8 bits per word and
includes an 8-bit data comparator
with MATCH output. The 8-bit data
is input/output on shared I/O pins
and comparison is performed between
8-bit incoming data and accessed
memory locations. Also provided is a
high speed CLEAR control which
clears all memory locations to zero
when activated. This allows all
address tag bits to be cleared when
powering on or when flushing the
cache.
O
I/O
7-0
WE
OE
CE
8
LE
256 x 32 x 8
MEMORY
ARRAY
COLUMN SELECT
& COLUMN SENSE
MATCH
(OPEN DRAIN)
1
Special Architecture Static RAMs
03/26/1999–LDS.174-M
TE
Latchup and static discharge protec-
tion are provided on-chip. The
L7C174 can withstand an injection
current of up to 200 mA on any pin
without damage.

L7C174KMB20 Related Products

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Description Cache Tag SRAM, 8KX8, 20ns, CMOS, CQCC32, CERAMIC, LCC-32 Cache Tag SRAM, 8KX8, 15ns, CMOS, CQCC32, CERAMIC, LCC-32 Cache Tag SRAM, 8KX8, 20ns, CMOS, CDIP28, 0.300 INCH, CERAMIC, DIP-28 Cache Tag SRAM, 8KX8, 22ns, CMOS, CDIP28, 0.300 INCH, CERAMIC, DIP-28 Cache Tag SRAM, 8KX8, 12ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 Cache Tag SRAM, 8KX8, 22ns, CMOS, CQCC32, CERAMIC, LCC-32 Cache Tag SRAM, 8KX8, 20ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28 Cache Tag SRAM, 8KX8, 20ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Parts packaging code QFJ QFJ DIP DIP DIP QFJ DIP DIP
package instruction QCCN, LCC32,.45X.55 QCCN, LCC32,.45X.55 DIP, DIP28,.3 DIP, DIP28,.3 DIP, DIP28,.6 QCCN, LCC32,.45X.55 DIP, DIP28,.6 DIP, DIP28,.6
Contacts 32 32 28 28 28 32 28 28
Reach Compliance Code unknow unknown unknown unknown unknown unknown unknown unknow
ECCN code 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C EAR99 3A001.A.2.C 3A001.A.2.C EAR99
Maximum access time 20 ns 15 ns 20 ns 22 ns 12 ns 22 ns 20 ns 20 ns
Other features MATCH OUTPUT MATCH OUTPUT MATCH OUTPUT MATCH OUTPUT MATCH OUTPUT MATCH OUTPUT MATCH OUTPUT MATCH OUTPUT
JESD-30 code R-CQCC-N32 R-CQCC-N32 R-GDIP-T28 R-GDIP-T28 R-PDIP-T28 R-CQCC-N32 R-GDIP-T28 R-PDIP-T28
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0
length 13.97 mm 13.97 mm 36.83 mm 36.83 mm 37.084 mm 13.97 mm 36.83 mm 37.084 mm
memory density 65536 bi 65536 bit 65536 bit 65536 bit 65536 bit 65536 bit 65536 bit 65536 bi
Memory IC Type CACHE TAG SRAM CACHE TAG SRAM CACHE TAG SRAM CACHE TAG SRAM CACHE TAG SRAM CACHE TAG SRAM CACHE TAG SRAM CACHE TAG SRAM
memory width 8 8 8 8 8 8 8 8
Humidity sensitivity level 3 3 3 3 3 3 3 3
Number of functions 1 1 1 1 1 1 1 1
Number of ports 1 1 1 1 1 1 1 1
Number of terminals 32 32 28 28 28 32 28 28
word count 8192 words 8192 words 8192 words 8192 words 8192 words 8192 words 8192 words 8192 words
character code 8000 8000 8000 8000 8000 8000 8000 8000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 70 °C 125 °C 125 °C 85 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C - -55 °C -55 °C -40 °C
organize 8KX8 8KX8 8KX8 8KX8 8KX8 8KX8 8KX8 8KX8
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Exportable YES YES YES YES YES YES YES YES
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED PLASTIC/EPOXY
encapsulated code QCCN QCCN DIP DIP DIP QCCN DIP DIP
Encapsulate equivalent code LCC32,.45X.55 LCC32,.45X.55 DIP28,.3 DIP28,.3 DIP28,.6 LCC32,.45X.55 DIP28,.6 DIP28,.6
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form CHIP CARRIER CHIP CARRIER IN-LINE IN-LINE IN-LINE CHIP CARRIER IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 225 225 225 225 225 225 225 225
power supply 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 3.048 mm 3.048 mm 5.08 mm 5.08 mm 5.08 mm 3.048 mm 5.08 mm 5.08 mm
Maximum standby current 0.0002 A 0.0002 A 0.0002 A 0.0002 A 0.0002 A 0.0002 A 0.0002 A 0.0002 A
Minimum standby current 2 V 2 V 2 V 2 V 2 V 2 V 2 V 2 V
Maximum slew rate 0.14 mA 0.165 mA 0.14 mA 0.115 mA 0.195 mA 0.115 mA 0.14 mA 0.14 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES NO NO NO YES NO NO
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level MILITARY MILITARY MILITARY MILITARY COMMERCIAL MILITARY MILITARY INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form NO LEAD NO LEAD THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE NO LEAD THROUGH-HOLE THROUGH-HOLE
Terminal pitch 1.27 mm 1.27 mm 2.54 mm 2.54 mm 2.54 mm 1.27 mm 2.54 mm 2.54 mm
Terminal location QUAD QUAD DUAL DUAL DUAL QUAD DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 11.43 mm 11.43 mm 7.62 mm 7.62 mm 15.24 mm 11.43 mm 15.24 mm 15.24 mm
Maker LOGIC Devices - - - LOGIC Devices LOGIC Devices LOGIC Devices LOGIC Devices

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