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MT47H64M8GB-25EAT:B

Description
DDR DRAM, 128MX8, 0.4ns, CMOS, PBGA60, 12 X 10 MM, FBGA-60
Categorystorage    storage   
File Size9MB,139 Pages
ManufacturerMicron Technology
Websitehttp://www.mdtic.com.tw/
Download Datasheet Parametric View All

MT47H64M8GB-25EAT:B Overview

DDR DRAM, 128MX8, 0.4ns, CMOS, PBGA60, 12 X 10 MM, FBGA-60

MT47H64M8GB-25EAT:B Parametric

Parameter NameAttribute value
MakerMicron Technology
Parts packaging codeBGA
package instructionTFBGA,
Contacts60
Reach Compliance Codeunknow
ECCN codeEAR99
access modeFOUR BANK PAGE BURST
Maximum access time0.4 ns
Other featuresAUTO/SELF REFRESH
JESD-30 codeR-PBGA-B60
length12 mm
memory density1073741824 bi
Memory IC TypeDDR DRAM
memory width8
Number of functions1
Number of ports1
Number of terminals60
word count134217728 words
character code128000000
Operating modeSYNCHRONOUS
Maximum operating temperature105 °C
Minimum operating temperature-40 °C
organize128MX8
Package body materialPLASTIC/EPOXY
encapsulated codeTFBGA
Package shapeRECTANGULAR
Package formGRID ARRAY
Certification statusNot Qualified
Maximum seat height1.2 mm
self refreshYES
Maximum supply voltage (Vsup)1.9 V
Minimum supply voltage (Vsup)1.7 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
width10 mm
512Mb: x4, x8, x16 DDR2 SDRAM
Features
DDR2 SDRAM
MT47H128M4 – 32 Meg x 4 x 4 banks
MT47H64M8 – 16 Meg x 8 x 4 banks
MT47H32M16 – 8 Meg x 16 x 4 banks
Features
Vdd = +1.8V ±0.1V, VddQ = +1.8V ±0.1V
JEDEC-standard 1.8V I/O (SSTL_18-compatible)
Differential data strobe (DQS, DQS#) option
4n-bit prefetch architecture
Duplicate output strobe (RDQS) option for x8
DLL to align DQ and DQS transitions with CK
4 internal banks for concurrent operation
Programmable CAS latency (CL)
Posted CAS additive latency (AL)
WRITE latency = READ latency - 1
t
CK
Selectable burst lengths: 4 or 8
Adjustable data-output drive strength
64ms, 8,192-cycle refresh
On-die termination (ODT)
Industrial temperature (IT) option
Automotive temperature (AT) option
RoHS compliant
Supports JEDEC clock jitter specification
Options
1
Configuration
256 Meg x 4 (32 Meg x 4 x 4 banks)
128 Meg x 8 (16 Meg x 8 x 4 banks)
64 Meg x 16 (8 Meg x 16 x 4 banks)
FBGA package (Pb-free) – x16
84-ball FBGA (12mm x 12.5mm) Rev. B
84-ball FBGA (10mm x 12.5mm) Rev. D
84-ball FBGA (8mm x 12.5mm) Rev. F
FBGA package (Pb-free) – x4, x8
60-ball FBGA (12mm x 10mm) Rev. B
60-ball FBGA (10mm x 10mm) Rev. D
60-ball FBGA (8mm x 10mm) Rev. F
FBGA package (lead solder) – x16
84-ball FBGA (12mm x 12.5mm) Rev. B
84-ball FBGA (10mm x 12.5mm) Rev. D
84-ball FBGA (8mm x 12.5mm) Rev. F
FBGA package (lead solder) – x4, x8
60-ball FBGA (12mm x 10mm) Rev. B
60-ball FBGA (10mm x 10mm) Rev. D
60-ball FBGA (8mm x 10mm) Rev. F
Timing – cycle time
2.5ns @ CL = 5 (DDR2-800)
2.5ns @ CL = 6 (DDR2-800)
3.0ns @ CL = 4 (DDR2-667)
3.0ns @ CL = 5 (DDR2-667)
3.75ns @ CL = 4 (DDR2-533)
5.0ns @ CL = 3 (DDR2-400)
Self refresh
Standard
Low-power
Operating temperature
Commercial (0°C
T
C
85°C)
Industrial (–40°C
T
C
95°C;
–40°C
T
A
85°C)
Automotive, Revision :D only
(–40°C
T
C
, T
A
105°C)
Revision
Note:
Marking
128M4
64M8
32M16
CC
BN
HR
CB
B6
CF
GC
FN
HW
GB
F6
JN
-25E
-25
-3E
-3
-37E
-5E
None
L
None
IT
AT
:B/:D/:F
1. Not all options listed can be combined to
define an offered product. Use the Part
Catalog Search on
www.micron.com
for
product offerings and availability.
PDF: 09005aef82f1e6e2
Rev. M 9/08 EN
1
Products and specifications discussed herein are subject to change by Micron without notice.
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2004 Micron Technology, Inc. All rights reserved.
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