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8200C

Description
ELECTRICALLY CONDUCTIVE DIE ATTACH ADHESIVE
File Size328KB,3 Pages
ManufacturerETC2
Download Datasheet View All

8200C Overview

ELECTRICALLY CONDUCTIVE DIE ATTACH ADHESIVE

PILOT TECHNICAL DATASHEET
ELECTRICALLY CONDUCTIVE DIE ATTACH ADHESIVE
DESCRIPTION
ABLEBOND
®
8200C low bleed die attach adhesive is
designed for small and medium sized dies across a
variety of leadframes including PPF, Cu and Ag. This
electrically conductive adhesive offers improved JEDEC
performance on QFN type packages.
FEATURES
• HIgh electrical conductivity
• Excellent adhesion to silver and pre-plated leadframe
• Oven and snap curable
ABLEBOND 8200C adhesive is a new version of the
RP-751 series that provides improved MRT on silver
and pre-plated leadframe.
ABLEBOND
®
8200C
Typical Uncured Properties
Filler Type
Viscosity @ 25ºC
Thixotropic Index
Work Life @ 25ºC
Est. Storage Life @ -40ºC
Cure Process Data
Weight Loss on Cure
Recommended Cure Condition
Snap Cure Profile
Physiochemical Properties
- Post Cure
Ionics
Chloride
Sodium
Potassium
8200C
Silver
11,500 cP
5.0
24 hours
1 year
8200C
7%
Test Description
Test
Method
ATM-0018
ATM-0089
ATM-0087
ATM-0068
Test
Method
ATM-0031
Brookfield CP51 @ 5 rpm
Viscosity @ 0.5/Viscosity @ 5 rpm
25% increase in viscosity @ RT
Test Description
10 x 10 mm Si die on glass slide
30 minutes ramp to 175ºC + 15 minutes @ 175ºC
Zone Number
N
2
Flow
8200C
< 10 ppm
< 10 ppm
< 10 ppm
1%
1
2
3
4
5
6
7
Time
Temp ºC 140 150 160 200 220 220 220 120 sec
10 liters/minute @ 150ºC
Test Description
Teflon flask 5 gm sample / 20-40
mesh 50 gm DI water 100ºC for
24 hours
Thermogravimetric Analysis
Test
Method
ATM-0007
ATM-0073
Weight Loss @ 300ºC
Typical properties are not intended for use as specification limits. If you need to write a specification, ask for our
Standard Release Specification. This is a Pilot product that has been converted to high volume manufacturing and
is being monitored for process stability. During this monitoring period, certain properties may be adjusted slightly.
02/06
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