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WF128K32-120G2LC5

Description
Flash Module, 128KX32, 120ns, CQFP68, 22.40 X 22.40 MM, 4.06 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68
Categorystorage    storage   
File Size420KB,15 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric View All

WF128K32-120G2LC5 Overview

Flash Module, 128KX32, 120ns, CQFP68, 22.40 X 22.40 MM, 4.06 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68

WF128K32-120G2LC5 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerMicrosemi
Parts packaging codeQFP
package instructionQFP,
Contacts68
Reach Compliance Codecompli
ECCN codeEAR99
Maximum access time120 ns
Other featuresUSER CONFIGURABLE AS 512K X 8
Spare memory width16
JESD-30 codeS-CQFP-G68
JESD-609 codee4
length22.36 mm
memory density4194304 bi
Memory IC TypeFLASH MODULE
memory width32
Number of functions1
Number of terminals68
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize128KX32
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeQFP
Package shapeSQUARE
Package formFLATPACK
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Programming voltage5 V
Certification statusNot Qualified
Maximum seat height5.1 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceGOLD
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width22.36 mm
White Electronic Designs
WF128K32-XXX5
128K
X
32 5V FLASH MODULE, SMD 5962-94716
FEATURES
Access Times of 50**, 60, 70, 90, 120, 150ns
Packaging:
66 pin, PGA Type, 1.075 inch square, Hermetic
Ceramic HIP (Package 400)
68 lead, Hermetic CQFP (G2U), 22.4mm
(0.880 inch) square, 3.56mm (0.140 inch) high
(Package 510)
68 lead, Hermetic CQFP (G2L), 22.4mm
(0.880 inch) square, 4.06mm (0.160 inch) high
(Package 528)
8 equal size sectors of 16KBytes each
Any combination of sectors can be concurrently
erased. Also supports full chip erase
Commercial, Industrial and Military Temperature
Ranges
5 Volt Programming. 5V ± 10% Supply
Low Power CMOS, 1mA Standby Typical
Embedded Erase and Program Algorithms
TTL Compatible Inputs and CMOS Outputs
Built-in Decoupling Caps and Multiple Ground Pins
for Low Noise Operation
Page Program Operation and Internal Program
Control Time
Weight
WF128K32-XG2LX5 - 8 grams typical
WF128K32-XG2UX5 - 8 grams typical
WF128K32-XH1X5 - 13 grams typical
Note: For programming information refer to Flash Programming 1M5 Application Note.
* This product is subject to change without notice.
* * The access time of 50ns is available in Industrial and Commercial temperature
ranges only.
Sector Architecture
100,000 Erase/Program Cycles Typical, 0°C to
+70°C
Organized as 128Kx32
FIGURE 1 – PIN CONFIGURATION FOR WF128K32N-XH1X5
Top View
I/O
8
I/O
9
I/O
10
A
14
A
16
A
11
A
0
NC
I/O
0
I/O
1
I/O
2
WE
2
#
CS
2
#
GND
I/O
11
A
10
A
9
A
15
V
CC
CS
1
#
NC
I/O
3
I/O
15
I/O
14
I/O
13
I/O
12
OE#
NC
WE
1
#
I/O
7
I/O
6
I/O
5
I/O
4
I/O
24
I/O
25
I/O
26
A
7
A
12
NC
A
13
A
8
I/O
16
I/O
17
I/O
18
V
CC
CS
4
#
WE
4
#
I/O
27
A
4
A
5
A
6
WE
3
#
CS
3
#
GND
I/O
19
I/O
31
I/O
30
I/O
29
I/O
28
A
1
A
2
A
3
I/O
23
I/O
22
I/O
21
8
8
8
8
OE#
A
0-16
Pin Description
I/O
0-31
A
0-16
WE
1-4
#
CS
1-4
#
OE#
V
CC
GND
NC
Data Inputs/Outputs
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
Not Connected
Block Diagram
WE
1
# CS
1
#
WE
2
# CS
2
#
WE
3
# CS
3
#
WE
4
# CS
4
#
128K x 8
128K x 8
128K x 8
128K x 8
I/O
20
I/O
0-7
I/O
8-15
I/O
16-23
I/O
24-31
March 2006
Rev. 8
1
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com

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