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PPC7457RX1200LB

Description
RISC Microprocessor, 32-Bit, 1200MHz, CMOS, CBGA483, 29 X 29 MM, 1.27 MM PITCH, CERAMIC, BGA-483
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size2MB,87 Pages
ManufacturerMotorola ( NXP )
Websitehttps://www.nxp.com
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PPC7457RX1200LB Overview

RISC Microprocessor, 32-Bit, 1200MHz, CMOS, CBGA483, 29 X 29 MM, 1.27 MM PITCH, CERAMIC, BGA-483

PPC7457RX1200LB Parametric

Parameter NameAttribute value
MakerMotorola ( NXP )
package instruction29 X 29 MM, 1.27 MM PITCH, CERAMIC, BGA-483
Reach Compliance Codeunknow
ECCN code3A001.A.3
Address bus width36
bit size32
boundary scanYES
maximum clock frequency167 MHz
External data bus width64
FormatFLOATING POINT
Integrated cacheYES
JESD-30 codeS-CBGA-B483
length29 mm
low power modeYES
Number of terminals483
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeBGA
Package shapeSQUARE
Package formGRID ARRAY
Certification statusNot Qualified
Maximum seat height3.2 mm
speed1200 MHz
Maximum supply voltage1.35 V
Minimum supply voltage1.25 V
Nominal supply voltage1.3 V
surface mountYES
technologyCMOS
Terminal formBALL
Terminal pitch1.27 mm
Terminal locationBOTTOM
width29 mm
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR, RISC
Advance Information
MPC7457EC
Rev. 4, 11/2003
MPC7457
RISC Microprocessor
Hardware Specifications
This hardware specification is primarily concerned with the PowerPC™ MPC7457; however,
unless otherwise noted, all information here also applies to the MPC7447. The MPC7457 and
MPC7447 are implementations of the PowerPC microprocessor family of reduced instruction
set computer (RISC) microprocessors. This hardware specification describes pertinent
electrical and physical characteristics of the MPC7457. For functional characteristics of the
processor, refer to the
MPC7450 RISC Microprocessor Family User’s Manual.
This hardware specification contains the following topics:
Topic
Page
Section 1.1, “Overview”
1
Section 1.2, “Features”
2
Section 1.3, “Comparison with the MPC7455, MPC7445, MPC7450, MPC7451,
and MPC7441”
7
Section 1.4, “General Parameters”
10
Section 1.5, “Electrical and Thermal Characteristics”
10
Section 1.6, “Pin Assignments”
33
Section 1.7, “Pinout Listings”
35
Section 1.8, “Package Description”
41
Section 1.9, “System Design Information”
47
Section 1.10, “Document Revision History”
61
Section 1.11, “Ordering Information”
63
To locate any published updates for this hardware specification, refer to the website at
http://www.motorola.com/semiconductors.
1.1 Overview
The MPC7457 is the fourth implementation of the fourth generation (G4) microprocessors
from Motorola. The MPC7457 implements the full PowerPC 32-bit architecture and is
targeted at networking and computing systems applications. The MPC7457 consists of a
processor core, a 512-Kbyte L2, and an internal L3 tag and controller that support a glueless
backside L3 cache through a dedicated high-bandwidth interface. The MPC7447 is identical
to the MPC7457 except that it does not support the L3 cache interface.

PPC7457RX1200LB Related Products

PPC7457RX1200LB MC7447RX1000NB MC7447RX1000NBR2 PPC7457RX867LB PPC7457RX1000LB PPC7457RX1267LB PPC7447RX1000LB PPC7447RX867LB PPC7447RX1200LB PPC7447RX1267LB
Description RISC Microprocessor, 32-Bit, 1200MHz, CMOS, CBGA483, 29 X 29 MM, 1.27 MM PITCH, CERAMIC, BGA-483 32-BIT, 1000MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, FLIP CHIP, BGA-360 32-BIT, 1000MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, FLIP CHIP, BGA-360 RISC Microprocessor, 32-Bit, 867MHz, CMOS, CBGA483, 29 X 29 MM, 1.27 MM PITCH, CERAMIC, BGA-483 RISC Microprocessor, 32-Bit, 1000MHz, CMOS, CBGA483, 29 X 29 MM, 1.27 MM PITCH, CERAMIC, BGA-483 RISC Microprocessor, 32-Bit, 1267MHz, CMOS, CBGA483, 29 X 29 MM, 1.27 MM PITCH, CERAMIC, BGA-483 RISC Microprocessor, 32-Bit, 1000MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 RISC Microprocessor, 32-Bit, 867MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 RISC Microprocessor, 32-Bit, 1200MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 32-BIT, 1267MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360
package instruction 29 X 29 MM, 1.27 MM PITCH, CERAMIC, BGA-483 BGA, BGA360,19X19,50 BGA, 29 X 29 MM, 1.27 MM PITCH, CERAMIC, BGA-483 29 X 29 MM, 1.27 MM PITCH, CERAMIC, BGA-483 29 X 29 MM, 1.27 MM PITCH, CERAMIC, BGA-483 BGA, BGA, BGA, BGA,
Reach Compliance Code unknow unknown unknown unknown unknown unknown unknown unknown unknown unknown
ECCN code 3A001.A.3 3A001.A.3 3A001.A.3 3A001.A.3 3A001.A.3 3A001.A.3 3A001.A.3 3A001.A.3 3A001.A.3 3A001.A.3
Address bus width 36 36 36 36 36 36 36 36 36 36
bit size 32 32 32 32 32 32 32 32 32 32
boundary scan YES YES YES YES YES YES YES YES YES YES
maximum clock frequency 167 MHz 167 MHz 167 MHz 167 MHz 167 MHz 167 MHz 167 MHz 167 MHz 167 MHz 167 MHz
External data bus width 64 64 64 64 64 64 64 64 64 64
Format FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT
Integrated cache YES YES YES YES YES YES YES YES YES YES
JESD-30 code S-CBGA-B483 S-CBGA-B360 S-CBGA-B360 S-CBGA-B483 S-CBGA-B483 S-CBGA-B483 S-CBGA-B360 S-CBGA-B360 S-CBGA-B360 S-CBGA-B360
length 29 mm 25 mm 25 mm 29 mm 29 mm 29 mm 25 mm 25 mm 25 mm 25 mm
low power mode YES YES YES YES YES YES YES YES YES YES
Number of terminals 483 360 360 483 483 483 360 360 360 360
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
encapsulated code BGA BGA BGA BGA BGA BGA BGA BGA BGA BGA
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 3.2 mm 3.2 mm 3.2 mm 3.2 mm 3.2 mm 3.2 mm 3.2 mm 3.2 mm 3.2 mm 3.2 mm
speed 1200 MHz 1000 MHz 1000 MHz 867 MHz 1000 MHz 1267 MHz 1000 MHz 867 MHz 1200 MHz 1267 MHz
Maximum supply voltage 1.35 V 1.15 V 1.15 V 1.35 V 1.35 V 1.35 V 1.35 V 1.35 V 1.35 V 1.35 V
Minimum supply voltage 1.25 V 1.05 V 1.05 V 1.25 V 1.25 V 1.25 V 1.25 V 1.25 V 1.25 V 1.25 V
Nominal supply voltage 1.3 V 1.1 V 1.1 V 1.3 V 1.3 V 1.3 V 1.3 V 1.3 V 1.3 V 1.3 V
surface mount YES YES YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Terminal form BALL BALL BALL BALL BALL BALL BALL BALL BALL BALL
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
width 29 mm 25 mm 25 mm 29 mm 29 mm 29 mm 25 mm 25 mm 25 mm 25 mm
uPs/uCs/peripheral integrated circuit type MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Maker Motorola ( NXP ) - - Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP )

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