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NSHC182J50TRA1

Description
CAPACITOR, METALLIZED FILM, POLYPHENYLENE SULPHIDE, 50V, 0.0018uF, SURFACE MOUNT, 0805, CHIP
CategoryPassive components    capacitor   
File Size117KB,3 Pages
ManufacturerNichicon
Websitehttp://www.nichicon.co.jp
Download Datasheet Parametric View All

NSHC182J50TRA1 Overview

CAPACITOR, METALLIZED FILM, POLYPHENYLENE SULPHIDE, 50V, 0.0018uF, SURFACE MOUNT, 0805, CHIP

NSHC182J50TRA1 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerNichicon
package instruction, 0805
Reach Compliance Codecompli
ECCN codeEAR99
capacitance0.0018 µF
Capacitor typeFILM CAPACITOR
dielectric materialsPOLYPHENYLENE SULPHIDE
high0.9 mm
JESD-609 codee0
length2 mm
Manufacturer's serial numberNSHC
Installation featuresSURFACE MOUNT
negative tolerance5%
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
Package formSMT
method of packingTR, EMBOSSED PLASTIC, 7 INCH
positive tolerance5%
Rated (AC) voltage (URac)40 V
Rated (DC) voltage (URdc)50 V
seriesNSHC(0805,50 VOLT)
size code0805
surface mountYES
Terminal surfaceTin/Lead (Sn/Pb)
Terminal shapeWRAPAROUND
width1.25 mm
Stacked Film Capacitor Chips
FEATURES
• STACKED METALLIZED POLYPHENYLENE SULFIDE (PPS) FILM
• STANDARD EIA 0603, 0805, 1206, 1210, 1913 AND 2416 SIZES
• WIDE TEMPERATURE RANGE UP TO +125
O
C (100pF ~ 0.1µF)
• HIGH HEAT AND MOISTURE RESISTANT
• VERY STABLE TEMPERATURE, FREQUENCY, VOLTAGE, BIAS AND
nDIELECTRIC
ABSORPTION CHARACTERISTICS
• SUITABLE FOR REFLOW (100pF ~ 0.1µF) & FLOW (0.12µF ~ 0.22µF)
SOLDERING
• TAPE AND REEL PACKAGING
SPECIFICATIONS
Capacitance Range
Voltage Ratings
Capacitance Tolerance
Temperature Range
Dissipation Factor (20°C)
Insulation Resistance (20°C)
Dielectric Withstanding Voltage
Temperature Characteristic
Dielectric Absorption
o
NSHC Series
NEW
Case Sizes
0603
0805
1206
1210
1913
2416
100pF ~ 0.0027
µF
100pF ~ .01
µF
3300pF ~ .047
µF
.012
µ
F ~ .1
µF
.047
µ
F ~ .1
µF
0.12
µ
F ~ 0.22
µF
16Vdc (12Vrms), 50Vdc (40Vrms)
±5% Std, ±2% Opt
-55 C ~ +125°C (0.12
µ
F ~ 0.22
µ
F voltage derated above 105°C)
0.6% max @ 1 KHz
3 Gigohms Minimum
150% of Rated Voltage 60 Seconds
175% of Rated Voltage for 5 Seconds (except 1913 and 2416 case sizes)
±3%
C Maximum Over Temperature Range
0.05 ~ 0.10% Typical
ENVIRONMENTAL CHARACTERISTICS
Life Test At +125°C
1000 Hours at 125% of
Rated Voltage
Resistance to Soldering Heat:
+260°C Peak for 5 Seconds
(0.047
µ
F ~ 0.22
µ
F)
Humidity Load Life (Note 1):
(1) 1000 Hours, +40°C
(2) 500 Hours, +60°C
Solderability with
10% Wt Rosin-Methanol Flux
Capacitance Change
Dissipation Factor
Insulation Resistance
Capacitance Change
Dissipation Factor
Insulation Resistance
Capacitance Change
Dissipation Factor
Insulation Resistance
Within ±2% of Initial Value
0.66% Maximum
1 Gigohm Minimum
Within ±3% of Initial Value
0.66% Maximum
1 Gigohm Minimum
Within ±2% of Initial Value
0.90% Maximum
(1) 1 Gigohm Minimum
(2) 0.5 Gigohm Minimum
NSHC IS
RECOMMENDED
FOR NEW DESIGNS
90% Minimum Coverage After 5 Second Dip into 235°C Solder Pot
RECOMMENDED SOLDERING PROFILES
REFLOW SOLDERING
300
T
E
M
P
E
R
A
T
U
R
E
FLOW SOLDERING
0.12µF ~ 0.22µF only
300
Soldering
250°C Max.
RECOMMENDED LAND
PATTERN (mm)
EIA Size
0603
0805
1206
1210
1913
2416
A
0.6
0.8
1.8
1.8
2.6
3.8
B
2.0
2.4
3.6
3.6
6.6
7.8
C
0.7
1.1
1.4
2.3
3.0
3.8
250
200
°C 150
100
50
0
Pre-Heat
150°C Max.
Soldering
230°C Max.
Cool
Down
0
5 Seconds Max.
2 1/2 Minutes Max.
Less than
15 Seconds
2 Minutes Min.
3 Minutes Max.
5 Seconds Max.
2 Minutes Min.
A
B
®
NIC COMPONENTS
www.niccomp.com
www.lowESR.com
www.RFpassives.com
181
C
T
E
M
P
E
R
A
T
U
R
E
250
200
°C 150
100
50
Pre-Heat
150°C Max.
Cool
Down

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