LH538000-ST-50 datasheet, PDF - EEWORLD Datasheet

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LH538000-ST-50: DescriptionMASK ROM, 1MX8, 200ns, CMOS, PDSO48, 12 X 18 MM, PLASTIC, TSOP1-48; Categorystorage storage; File Size140KB，6 Pages; ManufacturerSHARP; Websitehttp://sharp-world.com/products/device/

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LH538000-ST-50 Overview

MASK ROM, 1MX8, 200ns, CMOS, PDSO48, 12 X 18 MM, PLASTIC, TSOP1-48

LH538000-ST-50 Parametric

Parameter Name	Attribute value
Maker	SHARP
package instruction	12 X 18 MM, PLASTIC, TSOP1-48
Reach Compliance Code	unknow
Maximum access time	200 ns
Spare memory width	16
JESD-30 code	R-PDSO-G48
length	16.4 mm
memory density	8388608 bi
Memory IC Type	MASK ROM
memory width	8
Number of functions	1
Number of terminals	48
word count	1048576 words
character code	1000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	1MX8
Package body material	PLASTIC/EPOXY
encapsulated code	TSOP1
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	2.6 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	DUAL
width	12 mm

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LH538000-ST-50 Related Products

	LH538000-ST-50	LH538000-SD-50	LH538000-SN-50	LH538000-SM-50
Description	MASK ROM, 1MX8, 200ns, CMOS, PDSO48, 12 X 18 MM, PLASTIC, TSOP1-48	MASK ROM, 1MX8, 200ns, CMOS, PDIP42, 0.600 INCH, PLASTIC, DIP-42	MASK ROM, 1MX8, 200ns, CMOS, PDSO44, 0.600 INCH, PLASTIC, SOP-44	MASK ROM, 1MX8, 200ns, CMOS, PQFP64, 14 X 20 MM, PLASTIC, QFP-64
Maker	SHARP	SHARP	SHARP	SHARP
package instruction	12 X 18 MM, PLASTIC, TSOP1-48	0.600 INCH, PLASTIC, DIP-42	0.600 INCH, PLASTIC, SOP-44	14 X 20 MM, PLASTIC, QFP-64
Reach Compliance Code	unknow	unknown	unknown	unknown
Maximum access time	200 ns	200 ns	200 ns	200 ns
Spare memory width	16	16	16	16
JESD-30 code	R-PDSO-G48	R-PDIP-T42	R-PDSO-G44	R-PQFP-G64
length	16.4 mm	53.8 mm	28.2 mm	20 mm
memory density	8388608 bi	8388608 bit	8388608 bit	8388608 bit
Memory IC Type	MASK ROM	MASK ROM	MASK ROM	MASK ROM
memory width	8	8	8	8
Number of functions	1	1	1	1
Number of terminals	48	42	44	64
word count	1048576 words	1048576 words	1048576 words	1048576 words
character code	1000000	1000000	1000000	1000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C
organize	1MX8	1MX8	1MX8	1MX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSOP1	DIP	SOP	QFP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE	IN-LINE	SMALL OUTLINE	FLATPACK
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.2 mm	5.4 mm	3.25 mm	3.15 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	2.6 V	2.6 V	2.6 V	2.6 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V
surface mount	YES	NO	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	GULL WING	THROUGH-HOLE	GULL WING	GULL WING
Terminal pitch	0.5 mm	2.54 mm	1.27 mm	1 mm
Terminal location	DUAL	DUAL	DUAL	QUAD
width	12 mm	15.24 mm	13.2 mm	14 mm

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