66AK2E05DABDA25 datasheet, PDF

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66AK2E05DABDA25: DescriptionMulticore DSP+ARM KeyStone II System-on-Chip (SoC) 1089-FCBGA; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，282 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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66AK2E05DABDA25 Overview

Multicore DSP+ARM KeyStone II System-on-Chip (SoC) 1089-FCBGA

66AK2E05DABDA25 Parametric

Parameter Name	Attribute value
Brand Name	Texas Instruments
Is it lead-free?	Contains lead
Maker	Texas Instruments
package instruction	FBGA,
Reach Compliance Code	unknow
Address bus width	16
boundary scan	YES
External data bus width	16
Format	FLOATING POINT
Integrated cache	YES
JESD-30 code	S-PBGA-B1089
length	27 mm
low power mode	YES
Number of terminals	1089
Package body material	PLASTIC/EPOXY
encapsulated code	FBGA
Package shape	SQUARE
Package form	GRID ARRAY, FINE PITCH
Maximum seat height	3.55 mm
speed	1250 MHz
Maximum supply voltage	1.05 V
Minimum supply voltage	0.95 V
Nominal supply voltage	1 V
surface mount	YES
technology	CMOS
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
width	27 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC

66AK2E05DABDA25 Related Products

	66AK2E05DABDA25	66AK2E05DABDA4	66AK2E05SABDA25	66AK2E05SABDA4
Description	Multicore DSP+ARM KeyStone II System-on-Chip (SoC) 1089-FCBGA	Multicore DSP+ARM KeyStone II System-on-Chip (SoC) 1089-FCBGA	Multicore DSP+ARM KeyStone II System-on-Chip (SoC) 1089-FCBGA	Multicore DSP+ARM KeyStone II System-on-Chip (SoC) 1089-FCBGA
Brand Name	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
package instruction	FBGA,	FBGA,	FBGA,	FBGA,
Reach Compliance Code	unknow	unknow	unknow	unknow
Address bus width	16	16	16	16
boundary scan	YES	YES	YES	YES
External data bus width	16	16	16	16
Format	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT
Integrated cache	YES	YES	YES	YES
JESD-30 code	S-PBGA-B1089	S-PBGA-B1089	S-PBGA-B1089	S-PBGA-B1089
length	27 mm	27 mm	27 mm	27 mm
low power mode	YES	YES	YES	YES
Number of terminals	1089	1089	1089	1089
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	FBGA	FBGA	FBGA	FBGA
Package shape	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY, FINE PITCH	GRID ARRAY, FINE PITCH	GRID ARRAY, FINE PITCH	GRID ARRAY, FINE PITCH
Maximum seat height	3.55 mm	3.55 mm	3.55 mm	3.55 mm
speed	1250 MHz	1400 MHz	1250 MHz	1400 MHz
Maximum supply voltage	1.05 V	1.05 V	1.05 V	1.05 V
Minimum supply voltage	0.95 V	0.95 V	0.95 V	0.95 V
Nominal supply voltage	1 V	1 V	1 V	1 V
surface mount	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Terminal form	BALL	BALL	BALL	BALL
Terminal pitch	0.8 mm	0.8 mm	0.8 mm	0.8 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM
width	27 mm	27 mm	27 mm	27 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC

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