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66AK2E05SABDA25

Description
Multicore DSP+ARM KeyStone II System-on-Chip (SoC) 1089-FCBGA
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size2MB,282 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
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66AK2E05SABDA25 Overview

Multicore DSP+ARM KeyStone II System-on-Chip (SoC) 1089-FCBGA

66AK2E05SABDA25 Parametric

Parameter NameAttribute value
Brand NameTexas Instruments
Is it lead-free?Contains lead
MakerTexas Instruments
package instructionFBGA,
Reach Compliance Codeunknow
Address bus width16
boundary scanYES
External data bus width16
FormatFLOATING POINT
Integrated cacheYES
JESD-30 codeS-PBGA-B1089
length27 mm
low power modeYES
Number of terminals1089
Package body materialPLASTIC/EPOXY
encapsulated codeFBGA
Package shapeSQUARE
Package formGRID ARRAY, FINE PITCH
Maximum seat height3.55 mm
speed1250 MHz
Maximum supply voltage1.05 V
Minimum supply voltage0.95 V
Nominal supply voltage1 V
surface mountYES
technologyCMOS
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
width27 mm
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR, RISC

66AK2E05SABDA25 Related Products

66AK2E05SABDA25 66AK2E05DABDA25 66AK2E05DABDA4 66AK2E05SABDA4
Description Multicore DSP+ARM KeyStone II System-on-Chip (SoC) 1089-FCBGA Multicore DSP+ARM KeyStone II System-on-Chip (SoC) 1089-FCBGA Multicore DSP+ARM KeyStone II System-on-Chip (SoC) 1089-FCBGA Multicore DSP+ARM KeyStone II System-on-Chip (SoC) 1089-FCBGA
Brand Name Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Is it lead-free? Contains lead Contains lead Contains lead Contains lead
Maker Texas Instruments Texas Instruments Texas Instruments Texas Instruments
package instruction FBGA, FBGA, FBGA, FBGA,
Reach Compliance Code unknow unknow unknow unknow
Address bus width 16 16 16 16
boundary scan YES YES YES YES
External data bus width 16 16 16 16
Format FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT
Integrated cache YES YES YES YES
JESD-30 code S-PBGA-B1089 S-PBGA-B1089 S-PBGA-B1089 S-PBGA-B1089
length 27 mm 27 mm 27 mm 27 mm
low power mode YES YES YES YES
Number of terminals 1089 1089 1089 1089
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code FBGA FBGA FBGA FBGA
Package shape SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH
Maximum seat height 3.55 mm 3.55 mm 3.55 mm 3.55 mm
speed 1250 MHz 1250 MHz 1400 MHz 1400 MHz
Maximum supply voltage 1.05 V 1.05 V 1.05 V 1.05 V
Minimum supply voltage 0.95 V 0.95 V 0.95 V 0.95 V
Nominal supply voltage 1 V 1 V 1 V 1 V
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Terminal form BALL BALL BALL BALL
Terminal pitch 0.8 mm 0.8 mm 0.8 mm 0.8 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM
width 27 mm 27 mm 27 mm 27 mm
uPs/uCs/peripheral integrated circuit type MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC
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