0.2A, 150V, SILICON, SIGNAL DIODE, DO-35
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Texas Instruments |
| package instruction | O-PALF-W2 |
| Reach Compliance Code | unknow |
| ECCN code | EAR99 |
| Shell connection | ISOLATED |
| Configuration | SINGLE |
| Diode component materials | SILICON |
| Diode type | RECTIFIER DIODE |
| Maximum forward voltage (VF) | 1.2 V |
| JEDEC-95 code | DO-35 |
| JESD-30 code | O-PALF-W2 |
| JESD-609 code | e0 |
| Maximum non-repetitive peak forward current | 4 A |
| Number of components | 1 |
| Number of terminals | 2 |
| Maximum operating temperature | 175 °C |
| Maximum output current | 0.2 A |
| Package body material | PLASTIC/EPOXY |
| Package shape | ROUND |
| Package form | LONG FORM |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Maximum power dissipation | 0.5 W |
| Certification status | Not Qualified |
| Maximum repetitive peak reverse voltage | 150 V |
| Maximum reverse current | 0.05 µA |
| Maximum reverse recovery time | 0.06 µs |
| surface mount | NO |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | WIRE |
| Terminal location | AXIAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| FDH444 | FDLL444 | FDLL400 | FDH400 | |
|---|---|---|---|---|
| Description | 0.2A, 150V, SILICON, SIGNAL DIODE, DO-35 | 0.2A, SILICON, SIGNAL DIODE, LL-34, 2 PIN | 0.2A, SILICON, SIGNAL DIODE, LL-34, 2 PIN | 0.2A, 200V, SILICON, SIGNAL DIODE, DO-35 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| package instruction | O-PALF-W2 | O-LELF-R2 | O-LELF-R2 | O-PALF-W2 |
| Reach Compliance Code | unknow | unknown | unknown | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 |
| Shell connection | ISOLATED | ISOLATED | ISOLATED | ISOLATED |
| Configuration | SINGLE | SINGLE | SINGLE | SINGLE |
| Diode component materials | SILICON | SILICON | SILICON | SILICON |
| Diode type | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE |
| Maximum forward voltage (VF) | 1.2 V | 1.2 V | 1.1 V | 1.1 V |
| JESD-30 code | O-PALF-W2 | O-LELF-R2 | O-LELF-R2 | O-PALF-W2 |
| JESD-609 code | e0 | e0 | e0 | e0 |
| Maximum non-repetitive peak forward current | 4 A | 4 A | 4 A | 4 A |
| Number of components | 1 | 1 | 1 | 1 |
| Number of terminals | 2 | 2 | 2 | 2 |
| Maximum operating temperature | 175 °C | 175 °C | 175 °C | 175 °C |
| Maximum output current | 0.2 A | 0.2 A | 0.2 A | 0.2 A |
| Package body material | PLASTIC/EPOXY | GLASS | GLASS | PLASTIC/EPOXY |
| Package shape | ROUND | ROUND | ROUND | ROUND |
| Package form | LONG FORM | LONG FORM | LONG FORM | LONG FORM |
| Maximum power dissipation | 0.5 W | 0.5 W | 0.5 W | 0.5 W |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum repetitive peak reverse voltage | 150 V | 100 V | 150 V | 200 V |
| Maximum reverse current | 0.05 µA | 0.05 µA | 0.1 µA | 0.1 µA |
| Maximum reverse recovery time | 0.06 µs | 0.06 µs | 0.05 µs | 0.05 µs |
| surface mount | NO | YES | YES | NO |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | WIRE | WRAP AROUND | WRAP AROUND | WIRE |
| Terminal location | AXIAL | END | END | AXIAL |
| Maker | Texas Instruments | - | Texas Instruments | Texas Instruments |