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AGL600V2-UC484PP

Description
FPGA, 24576 CLBS, 1000000 GATES, 108 MHz, PBGA484
Categorysemiconductor    Programmable logic devices   
File Size12MB,250 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric View All

AGL600V2-UC484PP Overview

FPGA, 24576 CLBS, 1000000 GATES, 108 MHz, PBGA484

AGL600V2-UC484PP Parametric

Parameter NameAttribute value
Number of functions1
Number of terminals484
Maximum operating temperature85 Cel
Minimum operating temperature-40 Cel
Maximum supply/operating voltage1.58 V
Minimum supply/operating voltage1.42 V
Rated supply voltage1.5 V
Processing package description23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484
stateACTIVE
CraftsmanshipCMOS
packaging shapeSQUARE
Package SizeGRID ARRAY
surface mountYes
Terminal formBALL
Terminal spacing1 mm
terminal coatingTIN LEAD SILVER
Terminal locationBOTTOM
Packaging MaterialsPLASTIC/EPOXY
Temperature levelINDUSTRIAL
organize24576 CLBS, 1000000 GATES
Maximum FCLK clock frequency108 MHz
Number of configurable logic modules24576
Programmable logic typeFIELD PROGRAMMABLE GATE ARRAY
Number of equivalent gate circuits1.00E6
Revision 23
IGLOO Low Power Flash FPGAs
with Flash*Freeze Technology
Features and Benefits
Low Power
1.2 V to 1.5 V Core Voltage Support for Low Power
Supports Single-Voltage System Operation
5 µW Power Consumption in Flash*Freeze Mode
Low Power Active FPGA Operation
Flash*Freeze Technology Enables Ultra-Low Power
Consumption while Maintaining FPGA Content
• Easy Entry to / Exit from Ultra-Low Power Flash*Freeze Mode
• 15K to 1 Million System Gates
• Up to 144 Kbits of True Dual-Port SRAM
• Up to 300 User I/Os
• Bank-Selectable I/O Voltages—up to 4 Banks per Chip
• Single-Ended I/O Standards: LVTTL, LVCMOS
3.3 V / 2.5 V / 1.8 V / 1.5 V / 1.2 V, 3.3 V PCI / 3.3 V PCI-X
,
and LVCMOS 2.5 V / 5.0 V Input
• Differential I/O Standards: LVPECL, LVDS, B-LVDS, and M-
LVDS (AGL250 and above)
• Wide Range Power Supply Voltage Support per JESD8-B,
Allowing I/Os to Operate from 2.7 V to 3.6 V
• Wide Range Power Supply Voltage Support per JESD8-12,
Allowing I/Os to Operate from 1.14 V to 1.575 V
• I/O Registers on Input, Output, and Enable Paths
• Hot-Swappable and Cold-Sparing I/Os
• Programmable Output Slew Rate
and Drive Strength
• Weak Pull-Up/-Down
• IEEE 1149.1 (JTAG) Boundary Scan Test
• Pin-Compatible Packages across the IGLOO Family
• Six CCC Blocks, One with an Integrated PLL
• Configurable Phase Shift, Multiply/Divide, Delay Capabilities,
and External Feedback
• Wide Input Frequency Range (1.5 MHz up to 250 MHz)
• 1 kbit of FlashROM User Nonvolatile Memory
• SRAMs and FIFOs with Variable-Aspect-Ratio 4,608-Bit
RAM
Blocks (×1, ×2, ×4, ×9, and ×18 organizations)
• True Dual-Port SRAM (except ×18)
• M1 IGLOO Devices—Cortex™-M1 Soft Processor Available
with or without Debug
AGL250
M1AGL250
250,000
2,048
6,144
24
36
8
1
Yes
1
18
4
143
CS81, CS196
5
QN132
5,6
VQ100
FG144
FG144, FG256, FG144, FG256, FG144, FG256,
FG484
FG484
FG484
High Capacity
Reprogrammable Flash Technology
130-nm, 7-Layer Metal, Flash-Based CMOS Process
Instant On Level 0 Support
Single-Chip Solution
Retains Programmed Design When Powered Off
250 MHz (1.5 V systems) and 160 MHz (1.2 V systems) System
Performance
Clock Conditioning Circuit (CCC) and PLL
In-System Programming (ISP) and Security
High-Performance Routing Hierarchy
Advanced I/O
• ISP Using On-Chip 128-Bit Advanced Encryption Standard
(AES) Decryption (except ARM
®
-enabled IGLOO
®
devices) via
JTAG (IEEE 1532–compliant)
• FlashLock
®
Designed to Secure FPGA Contents
• Segmented, Hierarchical Routing and Clock Structure
• 700 Mbps DDR, LVDS-Capable I/Os (AGL250 and above)
• 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation
Embedded Memory
ARM Processor Support in IGLOO FPGAs
IGLOO Devices
AGL015
1
ARM-Enabled IGLOO Devices
2
System Gates
15,000
Typical Equivalent Macrocells
128
VersaTiles (D-flip-flops)
384
Flash*Freeze Mode (typical, µW)
5
RAM kbits (1,024 bits)
4,608-Bit Blocks
FlashROM Kbits (1,024 bits)
1
2
AES-Protected ISP
3
Integrated PLL in CCCs
6
VersaNet Globals
4
I/O Banks
2
Maximum User I/Os
49
Package Pins
UC/CS
QFN
VQFP
FBGA
QN68
AGL030
30,000
256
768
5
1
6
2
81
AGL060 AGL125
60,000
512
1,536
10
18
4
1
Yes
1
18
2
96
125,000
1,024
3,072
16
36
8
1
Yes
1
18
2
133
CS196
QN132
VQ100
FG144
AGL400
400,000
9,216
32
54
12
1
Yes
1
18
4
194
CS196
AGL600
M1AGL600
600,000
13,824
36
108
24
1
Yes
1
18
4
235
CS281
AGL1000
M1AGL1000
1,000,000
24,576
53
144
32
1
Yes
1
18
4
300
CS281
UC81
CS121
3
CS81
QN48, QN68, QN132
QN132
VQ100
VQ100
FG144
6
Notes:
1.
2.
3.
4.
5.
6.
7.
AGL015 is not recommended for new designs
AES is not available for ARM-enabled IGLOO devices.
AGL060 in CS121 does not support the PLL.
Six chip (main) and twelve quadrant global networks are available for AGL060 and above.
The M1AGL250 device does not support this package.
Device/package support TBD.
The
IGLOOe
datasheet and
IGLOOe FPGA Fabric User’s Guide
provide information on higher densities and additional features.
† AGL015 and AGL030 devices do not support this feature.
December 2012
© 2012 Microsemi Corporation
‡ Supported only by AGL015 and AGL030 devices.
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