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AGLN125V2-ZQNG100I

Description
FPGA, 520 CLBS, 20000 GATES, PBGA81
CategoryProgrammable logic devices    Programmable logic   
File Size7MB,148 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Environmental Compliance
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AGLN125V2-ZQNG100I Overview

FPGA, 520 CLBS, 20000 GATES, PBGA81

AGLN125V2-ZQNG100I Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerMicrosemi
package instructionLGA, LGA100(UNSPEC)
Reach Compliance Codecompli
JESD-30 codeS-PBCC-B100
Number of entries71
Number of logical units3072
Output times71
Number of terminals100
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeLGA
Encapsulate equivalent codeLGA100(UNSPEC)
Package shapeSQUARE
Package formCHIP CARRIER
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply1.2/1.5 V
Programmable logic typeFIELD PROGRAMMABLE GATE ARRAY
Certification statusNot Qualified
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formBUTT
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
Revision 19
DS0110
IGLOO nano Low Power Flash FPGAs
with Flash*Freeze Technology
Features and Benefits
Low Power
nanoPower Consumption—Industry’s Lowest Power
1.2 V to 1.5 V Core Voltage Support for Low Power
Supports Single-Voltage System Operation
Low Power Active FPGA Operation
Flash*Freeze Technology Enables Ultra-Low Power
Consumption while Maintaining FPGA Content
• Easy Entry to / Exit from Ultra-Low Power Flash*Freeze Mode
• As Small as 3x3 mm in Size
High-Performance Routing Hierarchy
Advanced I/Os
• Segmented, Hierarchical Routing and Clock Structure
• 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation
• Bank-Selectable I/O Voltages—up to 4 Banks per Chip
• Single-Ended I/O Standards: LVTTL, LVCMOS
3.3 V / 2.5 V / 1.8 V / 1.5 V / 1.2 V
• Wide Range Power Supply Voltage Support per JESD8-B,
Allowing I/Os to Operate from 2.7 V to 3.6 V
• Wide Range Power Supply Voltage Support per JESD8-12,
Allowing I/Os to Operate from 1.14 V to 1.575 V
• I/O Registers on Input, Output, and Enable Paths
• Selectable Schmitt Trigger Inputs
• Hot-Swappable and Cold-Sparing I/Os
• Programmable Output Slew Rate and Drive Strength
• Weak Pull-Up/-Down
• IEEE 1149.1 (JTAG) Boundary Scan Test
• Pin-Compatible Packages across the IGLOO
®
Family
• Up to Six CCC Blocks, One with an Integrated PLL
• Configurable Phase Shift, Multiply/Divide, Delay
Capabilities, and External Feedback
• Wide Input Frequency Range (1.5 MHz up to 250 MHz)
• 1 kbit of FlashROM User Nonvolatile Memory
• SRAMs and FIFOs with Variable-Aspect-Ratio 4,608-Bit RAM
Blocks (×1, ×2, ×4, ×9, and ×18 organizations)
• True Dual-Port SRAM (except × 18 organization)
• Tj = -20°C to +85°C
Small Footprint Packages
Wide Range of Features
Reprogrammable Flash Technology
130-nm, 7-Layer Metal, Flash-Based CMOS Process
Instant On Level 0 Support
Single-Chip Solution
Retains Programmed Design When Powered Off
250 MHz (1.5 V systems) and 160 MHz (1.2 V systems) System
Performance
• 10,000 to 250,000 System Gates
• Up to 36 kbits of True Dual-Port SRAM
• Up to 71 User I/Os
Clock Conditioning Circuit (CCC) and PLL
In-System Programming (ISP) and Security
Embedded Memory
• ISP Using On-Chip 128-Bit Advanced Encryption Standard
(AES) Decryption via JTAG (IEEE 1532–compliant)
• FlashLock
®
Designed to Secure FPGA Contents
• 1.2 V Programming
Enhanced Commercial Temperature Range
AGLN060
AGLN030Z
1
IGLOO nano Devices
IGLOO nano-Z Devices
System Gates
Typical Equivalent Macrocells
VersaTiles (D-flip-flops)
Flash*Freeze Mode (typical, µW)
RAM Kbits (1,024 bits)
2
4,608-Bit Blocks
Secure (AES)
2
1
AGLN010 AGLN015
1
AGLN020
10,000
86
260
2
1
2,3
AGLN125
1
AGLN250
1
AGLN060Z
60,000
512
1,536
10
18
4
1
Yes
1
18
2
71
71
AGLN125Z
125,000
1,024
3,072
16
36
8
1
Yes
1
18
2
71
71
AGLN250Z
1
250,000
2,048
6,144
24
36
8
1
Yes
1
18
4
68
68
15,000
128
384
4
1
4
3
49
20,000
172
520
4
1
4
3
52
52
30,000
256
768
5
1
6
2
77
83
FlashROM Kbits (1,024 bits)
ISP
2
Integrated PLL in CCCs
VersaNet Globals
I/O Banks
Maximum User I/Os (packaged device)
Maximum User I/Os (Known Good Die)
4
2
34
34
† AGLN030 and smaller devices do not support this feature.
October 2015
© 2015 Microsemi Corporation
I
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