EEWORLDEEWORLDEEWORLD

Part Number

Search

PTN0805E1451BGTS

Description
RESISTOR, THIN FILM, 0.2 W, 0.1 %, 25 ppm, 1450 ohm, SURFACE MOUNT, 0805, CHIP, ROHS COMPLIANT
CategoryPassive components    The resistor   
File Size80KB,4 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Environmental Compliance  
Download Datasheet Parametric View All

PTN0805E1451BGTS Overview

RESISTOR, THIN FILM, 0.2 W, 0.1 %, 25 ppm, 1450 ohm, SURFACE MOUNT, 0805, CHIP, ROHS COMPLIANT

PTN0805E1451BGTS Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerVishay
package instructionSMT, 0805
Reach Compliance Codecompli
ECCN codeEAR99
Other featuresANTI-SULFUR; LASER TRIMMABLE; NON-INDUCTIVE
structureRectangul
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature155 °C
Minimum operating temperature-55 °C
Package height0.838 mm
Package length2.032 mm
Package formSMT
Package width1.27 mm
method of packingTR
Rated power dissipation(P)0.2 W
Rated temperature70 °C
resistance1450 Ω
Resistor typeFIXED RESISTOR
size code0805
surface mountYES
technologyTHIN FILM
Temperature Coefficient25 ppm/°C
Terminal surfaceGold (Au) - with Nickel (Ni) barrie
Terminal shapeWRAPAROUND
Tolerance0.1%
Operating Voltage100 V
PTN
Vishay Thin Film
Commercial Thin Film Chip Resistor, Surface Mount Chip
FEATURES
• Moisture resistant
• High purity alumina substrate
• Non-standard values available
Actual Size
1505
• Will pass + 85 °C, 85 % relative humidity and
10 % rated power
• 100 % visual inspected per MIL-PRF-55342
• Very low noise and voltage coefficient (< - 30 dB)
• Non-inductive
• Laser-trimmed tolerances to ± 0.1 %
• Wraparound resistance less than 10 mΩ
• Epoxy bondable termination available
• Compliant to RoHS Directive 2002/95/EC
These chip resistors are available in both “top side” and
“wraparound” termination styles in a variety of sizes. They
incorporate self passivated, enhanced Tantalum Nitride
films, to give superior performance on moisture resistance,
voltage coefficient, power handling and resistance stability.
The terminations consist of an adhesion layer, a leach
resistant nickel barrier, and solder coating. This product will
out-perform all requirements of characteristic E of
MIL-PRF-55342.
CONSTRUCTION
Passivation
Tantalum Nitride
Resistive Film
Solder
Coating
TYPICAL PERFORMANCE
ABSOLUTE
TCR
25
0.1
Nickel Barrier
High Purity
Alumina Substrate
Adhesion Layer
TOL.
STANDARD ELECTRICAL SPECIFICATIONS
TEST
Material
Resistance Range
TCR: Absolute
Tolerance: Absolute
Stability: Absolute
Stability: Ratio
Voltage Coefficient
Working Voltage
Operating Temperature Range
Storage Temperature Range
Noise
Shelf Life Stability: Absolute
SPECIFICATIONS
Tantalum nitride
10
Ω
to 3 MΩ
± 25 ppm/°C to ± 100 ppm/°C
± 0.1 % to ± 5 %
ΔR
± 0.03 %
-
0.1 ppm/V
75 V to 200 V
- 55 °C to + 125 °C
- 55 °C to + 150 °C
< - 30 dB
-
CONDITIONS
-
-
- 55 °C to + 125 °C
+ 25 °C
2000 h at 70 °C
-
-
-
-
-
-
-
COMPONENT RATINGS
CASE SIZE
(1)
POWER RATING (mW)
0402
50
0502
100
0505
150
0603
150
0705
200
0805
200
1005
250
1010
500
1206
400
1505
400
2208
750
2010
800
2512
1000
Note
(1)
0705 and 0805 are the same (only use 0805 when ordering)
WORKING VOLTAGE (V)
75
75
75
75
100
100
100
150
200
150
150
200
200
RESISTANCE RANGE (Ω)
20 to 35K
20 to 65K
20 to 130K
10 to 120K
10 to 301K
10 to 301K
10 to 360K
50 to 600K
10 to 1M
10 to 1M
10 to 1.75M
10 to 2M
10 to 3M
* Pb containing terminations are not RoHS compliant, exemptions may apply
www.vishay.com
64
For technical questions, contact:
thinfilm@vishay.com
Document Number: 60026
Revision: 30-Nov-10
Belide Electronic Technology (Shenzhen) Co., Ltd. Recruitment (SMT Supervisor)
Belide Electronic Technology (Shenzhen) Co., Ltd.SMT SupervisorEmail: hr@palit.com.cnrelease date: 2006-07-28 Work Location: ShenzhenRecruitment Number: 2 Years of working experience: Two years or mor...
fighting Analog electronics
Bit Operation in AVR Microcontroller
In the standard C language textbook, the operation of bit operation is basically not involved, but in the program of the single-chip computer system, it is necessary to frequently operate various regi...
楞伽山人 Microchip MCU
Why should we transplant the operating system on M3? What are the advantages?
I want to learn the embedded operating system UC/OSII recently, but I don't know much about its uses and advantages....
dayup Microcontroller MCU
Analysis and Suppression of Electromagnetic Interference of Switching Power Supply
Abstract: Based on the introduction of flyback switching power supply and its performance, the grid-side harmonics and suppression, switch buffering, optoelectronic isolation and other issues in the p...
zbz0529 Power technology
M0 board emulator cannot be initialized
When programming with Zhou Ligong's M0 board (LPC1114), it says that the emulator cannot be initialized, and the error is AGDI fatal error: initialize fail. The hardware self-check cannot be performed...
taixian1 ARM Technology
LWip-1.4.1 transplantation on STM32F107VCT6 chip
[i=s] This post was last edited by chaoweidianzi on 2015-7-10 19:41[/i] [color=#ff0000]Hardware framework[/color]: STM32F107VCT6+DP83848 [color=#ff0000]Software framework[/color]: LWip-1.4.1 [color=#f...
chaoweidianzi stm32/stm8

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2829  1153  1380  644  742  57  24  28  13  15 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号