PILOT TECHNICAL DATASHEET
ELECTRICALLY CONDUCTIVE DIE ATTACH ADHESIVE
DESCRIPTION
ABLEBOND
®
8200C low bleed die attach adhesive is
designed for small and medium sized dies across a
variety of leadframes including PPF, Cu and Ag. This
electrically conductive adhesive offers improved JEDEC
performance on QFN type packages.
FEATURES
• HIgh electrical conductivity
• Excellent adhesion to silver and pre-plated leadframe
• Oven and snap curable
ABLEBOND 8200C adhesive is a new version of the
RP-751 series that provides improved MRT on silver
and pre-plated leadframe.
ABLEBOND
®
8200C
Typical Uncured Properties
Filler Type
Viscosity @ 25ºC
Thixotropic Index
Work Life @ 25ºC
Est. Storage Life @ -40ºC
Cure Process Data
Weight Loss on Cure
Recommended Cure Condition
Snap Cure Profile
Physiochemical Properties
- Post Cure
Ionics
Chloride
Sodium
Potassium
8200C
Silver
11,500 cP
5.0
24 hours
1 year
8200C
7%
Test Description
Test
Method
ATM-0018
ATM-0089
ATM-0087
ATM-0068
Test
Method
ATM-0031
Brookfield CP51 @ 5 rpm
Viscosity @ 0.5/Viscosity @ 5 rpm
25% increase in viscosity @ RT
Test Description
10 x 10 mm Si die on glass slide
30 minutes ramp to 175ºC + 15 minutes @ 175ºC
Zone Number
N
2
Flow
8200C
< 10 ppm
< 10 ppm
< 10 ppm
1%
1
2
3
4
5
6
7
Time
Temp ºC 140 150 160 200 220 220 220 120 sec
10 liters/minute @ 150ºC
Test Description
Teflon flask 5 gm sample / 20-40
mesh 50 gm DI water 100ºC for
24 hours
Thermogravimetric Analysis
Test
Method
ATM-0007
ATM-0073
Weight Loss @ 300ºC
Typical properties are not intended for use as specification limits. If you need to write a specification, ask for our
Standard Release Specification. This is a Pilot product that has been converted to high volume manufacturing and
is being monitored for process stability. During this monitoring period, certain properties may be adjusted slightly.
02/06
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8200C
Physiochemical Properties
- Post Cure
Glass Transition Temperature
Coefficient of Thermal Expansion
8200C
190ºC
Below Tg
Above Tg
@ 25ºC
Dynamic Tensile Modulus
@ 150ºC
@ 250ºC
Moisture Absorption @ Saturation
Thermal/Electrical Properties-
Post Cure
Volume Resistivity
Thermal Conductivity
Mechanical Properties-
Post Cure
Die Shear Strength (kg
f
/die)
vs. Temperature
Chip Warpage @ 25ºC
vs. Chip Size
Test Description
Dynamic mechanical thermal analysis
60 ppm/ºC
130 ppm/ºC
TMA expansion mode
Dynamic
mechanical thermal
analysis using
< 0.5mm thick sample
Test
Method
ATM-0112
ATM-0055
4630 MPa (670,000 psi)
1170 MPa (170,000 psi)
780 MPa (110,000 psi)
ATM-0112
0.20%
8200C
0.00017 ohm-cm
1.2 W/mK
8200C
@25ºC
19.1 kg
Chip Size
7.6x7.6mm
(300 x 300 mil)
Dynamic vapor sorption after 85ºC/
85% RH exposure
Test Description
4-point probe
Laser Flash
Test Description
3 x 3 mm (120 x 120 mil) Si die
on SPCLF
Warpage
16
µm
0.38mm (15mil)
thick Si die on
0.2mm Ag/Cu LF
6.7
µm
10.9
µm
ATM-0093
Test
Method
ATM-0020
ATM-0116
Test
Method
ATM-0052
ATM-0059
Chip Warpage
Post Dia Attach Cure
Post Mold Bake (4 hrs @ 175ºC)
ATM-0059
APPLICATION GUIDELINES
SHIPMENT
This Ablestik product is packed and shipped in dry ice
at -80°C. Inside every dry ice shipment of Ablestik’s
products is a small packet containing the ABLECUBE.
This is a small blue cube which retains its shape at
-40°C. If the ABLECUBE is exposed to temperatures
higher than -40°C, the cube will melt.
Please check the state of the ABLECUBE to ensure the
integrity of the shipment. If the ABLECUBE has melted
upon Receiving Inspection, place the entire shipment
in a -40°C freezer and contact your Ablestik Customer
Service or Sales Representative.
UNPACKING
Transfer the syringes from the dry ice to a -40°C freezer
without ANY delays. Freeze-thaw voids will form in
the syringes if the syringes are repeatedly thawed and
refrozen.
STORAGE
This Ablestik product must be stored at -40°C. The shelf
life of the material is only valid when the material has
been stored at the specified storage condition. Incorrect
storage conditions will degrade the performance of the
material in both handling (e.g. dispensing or screen
printing) and final cured properties.
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8200C
THAWING
Allow the container to reach room temperature before
use. After removing from the freezer, set the syringes
to stand vertically while thawing. Refer to Syringe Thaw
Time chart for the thaw time recommendation.
DO NOT open the container before contents reach
ambient temperature. Any moisture that collects on the
thawed container should be removed prior to opening
the container.
DO NOT re-freeze. Once thawed to room temperature,
the adhesive should not be re-frozen.
ADHESIVE APPLICATION
Thawed adhesive should be immediately placed
on dispense equipment for use. If the adhesive is
transferred to a final dispensing reservoir, care must be
exercised to avoid entrapment of contaminants and/or
air into the adhesive. Adhesive must be completely
used within the product’s recommended work life of >24
hours.
Apply enough adhesive to achieve a 25-50 µm (1-2 mil) wet
bondline thickness, dispensed with approximately 25% - 50%
filleting on all sides of the die. Alternate dispense amounts
may be used depending on the application requirements.
Star or cross shaped dispense patterns will yield fewer
bondline voids than the matrix style of dispense pattern.
Contact Ablestik Technical Service Department for detailed
recommendation on adhesive application, including
dispensing.
CURE
This adhesive can be cured in box or in-line ovens. The
recommended box oven cure temperature for this adhesive
is 175°C.
AVAILABILITY
ABLEBOND® adhesives are packaged in syringes or jars
per customer specification. Available package sizes range
from 1cc to 30cc and 1 ounce to 1 pound. For details, refer
to the Ablestik Standard Package Data Set or contact your
Customer Service Representative.
CAUTION: This product may cause skin irritation in sensitive persons. Avoid skin contact. If contact does occur, wash area
immediately with soap and water. Please refer to the Material Safety Data Sheet for more details.
20021 Susana Road, Rancho Dominguez, CA 90221
(310) 764-4600 Fax (310) 764-2545 Customer Service Fax (310) 764-1783
For a technical contact nearest you, visit
www.ablestik.com
The information given and the recommendations made herein are believed to be accurate but no guarantee of their accuracy is made. In every
case we recommend that purchasers before using any product conduct their own tests to determine whether the product is suitable for their
particular purposes under their own operating conditions. No representative of ours has any authority to waive or change the foregoing provisions
but, subject to such provisions, our engineers are available to assist purchasers in adapting our products to their needs. Nothing contained
herein shall be construed to imply the nonexistence of any relevant patents or to constitute a permission, inducement or recommendation
to practice any invention covered by any patent, without the authority from the owner of this patent. These materials are not designed or
manufactured for implantation in the human body. Approval from FDA for such use as part of any product to be implanted in the human body
has NOT been sought nor received. We also expect purchasers to use our products in accordance with the guiding principles of the American
Chemistry Council’s Responsible Care® program.
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