B048F120T15 datasheet, PDF - EEWORLD Datasheet

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B048F120T15: DescriptionVI Chip - BCM Bus Converter Module; File Size527KB，16 Pages; ManufacturerVICOR; Websitehttp://www.vicorpower.com/

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B048F120T15 Overview

VI Chip - BCM Bus Converter Module

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V•I Chip – BCM

Bus Converter Module

B048K120T15

• 48V to 12V V•I Chip Converter

• 150 Watt (225 Watt for 1 ms)

• High density – up to 600 W/in

• Small footprint – 150 W/in

• Low weight – 0.4 oz (12 g)

• Pick & Place / SMD

• >96% efficiency

• 125°C operation

• <1 µs transient response

• >3.5 million hours MTBF

• No output filtering required

• V•I Chip BGA package

Actual size

Vin = 42 - 53 V

Vout = 10.5 - 13.25 V

Iout = 12.5 A

K =

Rout = 32 mΩ max

Product Description

The V•I Chip Bus Converter Module

(BCM) is a high efficiency (>96%),

narrow input range Voltage

Transformation Module (VTM) operating

from a pre-regulated 48 Vdc primary bus

to deliver an isolated 12 V secondary for

Intermediate Bus Architecture

applications. The BCM may be used to

power non-isolated POL converters or as

an independent 12 V source. Due to the

fast response time and low noise of the

BCM, the need for limited life aluminum

electrolytic or tantalum capacitors at the

input of POL converters is reduced—or

eliminated—resulting in savings of board

area, materials and total system cost.

Absolute Maximum Ratings

Parameter

+In to -In

PC to -In

TM to -In

SG to -In

+Out to -Out

Isolation voltage

Operating junction temperature

Output current

Values

-1.0 to 60.0

100

-0.3 to 7.0

500

-0.5 to 15.0

1500

-40 to 125

12.5

Unit

Vdc

Notes

For 100 ms

Peak output current

The BCM achieves a power density of

600 W/in

and may be surface mounted

with a profile as low as 0.16" (4mm) over

the PCB. Its V•I Chip power BGA package

is compatible with on-board or in-board

surface mounting. The V•I Chip package

provides flexible thermal management

through its low Junction-to-Case and

Junction-to-BGA thermal resistance.

Owing to its high conversion efficiency

and safe operating temperature range, the

BCM does not require a discrete heat sink

in typical applications. It is also

compatible with heat sink options,

assuring low junction temperatures and

long life in the harshest environments.

θJC

θJB

θJA

Case temperature during reflow

Storage temperature

Output power

Peak output power

18.7

208

-40 to 150

150

225

Parameter

Junction-to-case

Junction-to-BGA

Junction-to-ambient

Vdc

°C

See note 2

Continuous

For 1 ms

°C

Continuous

For 1 ms

Typ

1.1

2.1

Max

1.5

2.5

Units

°C/W

Input to Output

Thermal Resistance

Symbol

6.5

5.0

7.2

5.5

Notes

1. For complete product matrix see chart on page 10.

2. The referenced junction is defined as the semiconductor having the highest temperature. This

temperature is monitored by the temperature monitor (TM) signal and by a shutdown comparator.

3. B048K120T15 surface mounted in-board to a 2" x 2" FR4 board, 4 layers 2 oz Cu, 300 LFM.

4. B048L120T15 (0.25"H integral Pin Fins) surface mounted on FR4 board, 300 LFM.

Vicor Corporation

Tel: 800-735-6200

vicorpower.com

V•I Chip Bus Converter

B048K120T15

Rev. 1.2

Page 1 of 16

B048F120T15 Related Products

	B048F120T15	B048G120T15	B048K120T15	B048L120T15
Description	VI Chip - BCM Bus Converter Module	VI Chip - BCM Bus Converter Module	VI Chip - BCM Bus Converter Module	VI Chip - BCM Bus Converter Module

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