V•I Chip – BCM
Bus Converter Module
TM
B048K120T15
1
• 48V to 12V V•I Chip Converter
• 150 Watt (225 Watt for 1 ms)
• High density – up to 600 W/in
3
• Small footprint – 150 W/in
2
• Low weight – 0.4 oz (12 g)
• Pick & Place / SMD
• >96% efficiency
• 125°C operation
• <1 µs transient response
• >3.5 million hours MTBF
• No output filtering required
• V•I Chip BGA package
Actual size
©
Vin = 42 - 53 V
Vout = 10.5 - 13.25 V
Iout = 12.5 A
K =
1
/
4
Rout = 32 mΩ max
Product Description
The V•I Chip Bus Converter Module
(BCM) is a high efficiency (>96%),
narrow input range Voltage
Transformation Module (VTM) operating
from a pre-regulated 48 Vdc primary bus
to deliver an isolated 12 V secondary for
Intermediate Bus Architecture
applications. The BCM may be used to
power non-isolated POL converters or as
an independent 12 V source. Due to the
fast response time and low noise of the
BCM, the need for limited life aluminum
electrolytic or tantalum capacitors at the
input of POL converters is reduced—or
eliminated—resulting in savings of board
area, materials and total system cost.
Absolute Maximum Ratings
Parameter
+In to -In
+In to -In
PC to -In
TM to -In
SG to -In
+Out to -Out
Isolation voltage
Operating junction temperature
Output current
Values
-1.0 to 60.0
100
-0.3 to 7.0
-0.3 to 7.0
500
-0.5 to 15.0
1500
-40 to 125
12.5
Unit
Vdc
Vdc
Vdc
Vdc
Notes
For 100 ms
Peak output current
The BCM achieves a power density of
600 W/in
3
and may be surface mounted
with a profile as low as 0.16" (4mm) over
the PCB. Its V•I Chip power BGA package
is compatible with on-board or in-board
surface mounting. The V•I Chip package
provides flexible thermal management
through its low Junction-to-Case and
Junction-to-BGA thermal resistance.
Owing to its high conversion efficiency
and safe operating temperature range, the
BCM does not require a discrete heat sink
in typical applications. It is also
compatible with heat sink options,
assuring low junction temperatures and
long life in the harshest environments.
P
L
E
R
R
θJC
R
θJB
R
θJA
R
θJA
Case temperature during reflow
Storage temperature
Output power
Peak output power
IN
IM
18.7
208
-40 to 150
150
225
Parameter
Junction-to-case
Junction-to-BGA
Junction-to-ambient
3
Junction-to-ambient
4
Y
R
A
mA
Vdc
Vdc
°C
A
See note 2
Continuous
A
For 1 ms
°C
°C
W
W
Continuous
For 1 ms
Typ
1.1
2.1
Max
1.5
2.5
Units
°C/W
°C/W
°C/W
°C/W
Input to Output
Thermal Resistance
Symbol
6.5
5.0
7.2
5.5
Notes
1. For complete product matrix see chart on page 10.
2. The referenced junction is defined as the semiconductor having the highest temperature. This
temperature is monitored by the temperature monitor (TM) signal and by a shutdown comparator.
3. B048K120T15 surface mounted in-board to a 2" x 2" FR4 board, 4 layers 2 oz Cu, 300 LFM.
4. B048L120T15 (0.25"H integral Pin Fins) surface mounted on FR4 board, 300 LFM.
45
Vicor Corporation
Tel: 800-735-6200
vicorpower.com
V•I Chip Bus Converter
B048K120T15
Rev. 1.2
Page 1 of 16
Specifications
INPUT
(Conditions are at nominal line, full load, and 25°C ambient unless otherwise specified)
Parameter
Input voltage range
Input dV/dt
Input undervoltage turn-on
Input undervoltage turn-off
Input overvoltage turn-on
Input overvoltage turn-off
Input quiescent current
Inrush current overshoot
Input current
Input reflected ripple current
No load power dissipation
Internal input capacitance
Internal input inductance
Recommended external input capacitance
Min
42
Typ
48
Max
53
10
42
Unit
V
V/µs
V
V
V
V
mA
A
A
mA p-p
W
µF
nH
µF
Note
37
53
P
L
E
R
8
IN
IM
1.5
0.8
59
1.8
40
1.9
4
20
3.5
60
3.0
PC low
Using test circuit in Fig.24; See Fig.1
Y
R
A
Using test circuit in Fig.24; See Fig.4
See Fig.6
200 nH maximum source inductance; See Fig.24
INPUT WAVEFORMS
Figure 1—
Inrush transient current at full load and nominal V
IN
with PC enabled
Figure 2—
Output voltage turn-on waveform with PC enabled
at full load and nominal V
IN
Figure 3—Output
voltage turn-on waveform with input turn-on
at full load and nominal V
IN
Figure 4—
Input reflected ripple current at full load and
nominal V
IN
45
Vicor Corporation
Tel: 800-735-6200
vicorpower.com
V•I Chip Bus Converter
B048K120T15
Rev. 1.2
Page 2 of 16
Specifications, continued
OUTPUT
(Conditions are at nominal line, full load, and 25°C ambient unless otherwise specified)
Parameter
Rated DC current
Peak repetitive current
DC current limit
Current share accuracy
Efficiency
Half load
Full load
Internal output inductance
Internal output capacitance
Load capacitance
Output overvoltage setpoint
Output ripple voltage
No external bypass
1µF bypass capacitor
Average short circuit current
Effective switching frequency
Line regulation
K
Load regulation
R
OUT
Transient response
Voltage undershoot
Voltage overshoot
Response time
Recovery time
Output overshoot
Input turn-on
PC enable
Output turn-on delay
From application of power
From release of PC pin
12.5
16.0
5
95.8
96.0
1.6
12
1000
14.75
90
8
200
3.5
150
Min
0
Typ
Max
12.5
18.7
20.0
10
Unit
A
A
A
%
%
%
nH
µF
µF
V
mV
mV
mA
MHz
Note
Max pulse width 1ms, max duty cycle 10%,
baseline power 50%
See Parallel Operation on page 11
See Fig.5
See Fig.5
Effective value
95.0
95.0
See Figs.7 and 10
See Fig.8
2.8
0.245
P
L
E
R
Efficiency vs. Output Power
IN
IM
4.2
0.250
0.255
32
mΩ
mV
mV
ns
µs
148
144
200
1
0
0
160
320
300
410
mV
mV
ms
µs
Fixed, 1.75 MHz per phase
V
OUT
=K•V
IN
at no load
See Figs.9 and 28
Y
R
A
0-12.5A load step, w/Cin = 100µF, see Fig.11
12.5-0A load step, w/Cin =100µF, see Fig.12
See Figs.11 and 12
See Figs.11 and 12
No output filter; See Fig.2
No output filter; See Fig.3
See Fig.3
See Fig.2
OUTPUT WAVEFORMS
Power Dissipation
7
97
96
6
Power Dissipation (W)
0
20
40
60
80
100
120
140
95
Efficiency (%)
5
94
93
92
91
90
89
88
4
3
2
1
0
0
20
40
60
80
100
120
140
Output Power (W)
Output Power (W)
Figure 5—
Efficiency vs. output power at nominal V
IN
Figure 6—Power
dissipation as a function of output power
45
Vicor Corporation
Tel: 800-735-6200
vicorpower.com
V•I Chip Bus Converter
B048K120T15
Rev. 1.2
Page 3 of 16
Specifications, continued
PRELIMINARY
Figure 7—
Output voltage ripple at full load and nominal V
IN
;
without any external bypass capacitor.
Figure 8—Output
voltage ripple at full load and nominal V
IN
with 1 µF ceramic external bypass capacitor.
90
80
70
Output Ripple (mV)
60
50
40
30
20
10
0
0
20
40
60
80
Output Power
100
120
140
Figure 9—
Output impedance vs. frequency
Figure 10—
Output voltage ripple vs. output power at nominal
line without any external bypass capacitor.
Figure 11—
0 -12.5A transient response with no external bypass
capacitance.
Figure 12—
12.5-0A transient response with no external
bypass capacitance.
45
Vicor Corporation
Tel: 800-735-6200
vicorpower.com
V•I Chip Bus Converter
B048K120T15
Rev. 1.2
Page 4 of 16
Specifications, continued
GENERAL
Parameter
MTBF
MIL-HDBK-217F
Telcordia TR-NT-000332
Telcordia SR-332
Demonstrated
Isolation specifications
Voltage
Capacitance
Resistance
Agency approvals(pending)
Mechanical parameters
Weight
Dimensions
Length
Width
Height
Min
Typ
3.6
4.2
TBD
TBD
1,500
5,000
10
cTÜVus
CE Mark
0.43 / 12.25
1.26 / 32
0.85 / 21.5
0.24 / 6
oz / g
in / mm
in / mm
in / mm
6,500
Max
Unit
Mhrs
Mhrs
hrs
hrs
Vdc
pF
MΩ
Note
25°C, GB
Input to Output
Input to Output
Input to Output
UL/CSA 60950, EN 60950
Low Voltage Directive
See mechanical drawing, Figs.16 and 18
Auxiliary Pins
(Conditions are at nominal line, full load, and 25°C ambient unless otherwise specified)
Parameter
Primary control (PC)
DC voltage
Module disable voltage
Module enable voltage
Current limit
Enable delay time
Disable delay time
Temperature Monitor (TM)
27°C setting
Temperature coefficient
Full range accuracy
Current limit
P
L
E
R
Min
4.8
2.4
2.4
2.95
-5
100
IN
IM
Typ
5.0
2.5
2.5
2.5
320
16
3.00
10
Max
5.2
2.6
2.9
410
40
3.05
5
Unit
V
V
V
mA
µs
µs
V
mV/°C
°C
µA
Y
R
A
Note
Source only
See Fig. 2
See Fig.13
Operating junction temperature
Operating junction temperature
Source only
Figure 13—
V
OUT
at full load vs. PC disable
Figure 14—
PC signal during fault
45
Vicor Corporation
Tel: 800-735-6200
vicorpower.com
V•I Chip Bus Converter
B048K120T15
Rev. 1.2
Page 5 of 16
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