PRELIMINARY
V•I Chip Voltage Transformation Module
BCM
V•I Chip – BCM
Bus Converter Module
TM
B048K120T30
K indicates BGA configuration. For other
mounting options see Part Numbering below.
• 48 V to 12 V V•I Chip Converter
• 300 Watt (450 Watt for 1 ms)
• High density – 1200 W/in
3
• Small footprint – 280 W/in
2
• Low weight – 0.5 oz (14 g)
• ZVS/ZCS isolated sine
amplitude converter
• 96% efficiency
• 125°C operation
• <1 µs transient response
• 3.5 million hours MTBF
• No output filtering required
• Surface mount BGA or J-Lead
packages
©
Vin = 38 - 55 V
Vout = 9.5 - 13.7 V
Iout = 25 A
K = 1/4
Rout = 13.9 mΩ max
Actual size
Product Description
The V•I Chip Bus Converter Module (BCM) is a high
efficiency (>96%), narrow input range Sine Amplitude
Converter (SAC) operating from a 38 to 55 Vdc primary
bus to deliver an isolated 9.5 V to 13.7 V secondary. The
BCM may be used to power non-isolated POL converters
or as an independent 9.5 – 13.7 V source. Due to the
fast response time and low noise of the BCM, the need
for limited life aluminum electrolytic or tantalum
capacitors at the input of POL converters is reduced—or
eliminated—resulting in savings of board area, materials
and total system cost.
The BCM achieves a power density of 1200 W/in
3
and
may be surface mounted with a profile as low as 0.16"
(4 mm) over the PCB. Its V•I Chip power package is
compatible with onboard or inboard surface mounting.
The V•I Chip package provides flexible thermal
management through its low Junction-to-Case and
Junction-to-BGA thermal resistance. Owing to its high
conversion efficiency and safe operating temperature
range, the BCM does not require a discrete heat sink in
typical applications. It is also available with heat sink
options, assuring low junction temperatures and long
life in the harshest environments.
Absolute Maximum Ratings
Parameter
+In to -In
+In to -In
PC to -In
+Out to -Out
Isolation voltage
Output current
Peak output current
Output power
Peak output power
Case temperature
Operating junction temperature
(1)
Storage temperature
Note:
(1) The referenced junction is defined as the semiconductor having the highest temperature.
This temperature is monitored by a shutdown comparator.
Values
-1.0 to 60
100
-0.3 to 7.0
-0.5 to 30.0
2,250
25
37.5
300
450
208
-40 to 125
-55 to 125
-40 to 150
-65 to 150
Unit
Vdc
Vdc
Vdc
Vdc
Vdc
A
A
W
W
°C
°C
°C
°C
°C
Notes
For 100 ms
Input to Output
Continuous
For 1 ms
Continuous
For 1 ms
During reflow
T - Grade
M - Grade
T - Grade
M - Grade
Part Numbering
B
Bus Converter
Module
048
Input Voltage
Designator
K
120
Output Voltage
Designator
(=V
OUT
x10)
T
30
Output Power
Designator
(=P
OUT
/10)
Configuration Options
F = Onboard (Figure 20)
K = Inboard (Figure 19)
Product Grade Temperatures (°C)
Grade
Storage Operating
T
-40 to150 -40 to125
M
-65 to150 -55 to125
vicorpower.com
800-735-6200
V•I Chip Bus Converter Module
B048K120T30
Rev. 1.0
Page 1 of 16
PRELIMINARY
Specifications
Input
(Conditions are at 48 Vin, full load, and 25°C ambient unless otherwise specified)
Parameter
Input voltage range
Input dV/dt
Input undervoltage turn-on
Input undervoltage turn-off
Input overvoltage turn-on
Input overvoltage turn-off
Input quiescent current
Inrush current overshoot
Input current
Input reflected ripple current
No load power dissipation
Internal input capacitance
Internal input inductance
Recommended external input capacitance
V•I Chip Voltage Transformation Module
Min
38
Typ
48
Max
55
1
37.4
Unit
Vdc
V/µs
Vdc
Vdc
Vdc
Vdc
mA
A
Adc
mA p-p
W
µF
nH
µF
Note
32.6
55
59
2.5
2.0
6.8
170
4.7
4
20
47
5.7
PC low
Using test circuit in Figure 21; See Figure 1
Using test circuit in Figure 21; See Figure 4
200 nH maximum source inductance; See Figure 21
Input Waveforms
Figure 1—
Inrush transient current at full load and 48 Vin with PC enabled
Figure 2—
Output voltage turn-on waveform with PC enabled at full load
and 48 Vin
Figure 3—Output
voltage turn-on waveform with input turn-on at full load
and 48 Vin
Figure 4—
Input reflected ripple current at full load and 48 Vin
vicorpower.com
800-735-6200
V•I Chip Bus Converter Module
B048K120T30
Rev. 1.0
Page 2 of 16
PRELIMINARY
Specifications
(continued)
V•I Chip Voltage Transformation Module
Output
(Conditions are at 48 Vin, full load, and 25°C ambient unless otherwise specified)
Parameter
Output voltage
Rated DC current
Peak repetitive current
DC current limit
Current share accuracy
Efficiency
Half load
Full load
Internal output inductance
Internal output capacitance
Load capacitance
Output overvoltage setpoint
Output ripple voltage
No external bypass
10 µF bypass capacitor
Average short circuit current
Effective switching frequency
Line regulation
K
Load regulation
R
OUT
Transient response
Voltage overshoot
Response time
Recovery time
Output overshoot
Input turn-on
PC enable
Output turn-on delay
From application of power
From release of PC pin
25.5
30.0
5
95.5
96.0
1.1
55
1,000
13.8
144
12.8
0.16
2.5
0.2475
2.8
1/4
11.7
355
200
1
0
0
308
80
214
Min
9.5
9.2
0
Typ
Max
13.7
13.4
25
37.5
36.3
10
Unit
Vdc
Vdc
Adc
A
Adc
%
%
%
nH
µF
µF
Vdc
mV
mV
A
MHz
Note
No load
Full load
Module will shut down when current limit is
reached or exceeded
Max pulse width 1ms, max duty cycle 10%,
baseline power 50%
See Parallel Operation on Page 12
See Figure 5
See Figure 5
Effective value
95.0
95.0
See Figures 7 and 9
See Figure 8
Fixed, 1.4 MHz per phase
V
OUT
= K•V
IN
at no load
3.2
0.2525
13.9
mΩ
mV
ns
µs
mV
mV
ms
ms
100% load step; See Figures 10 and 11
See Figures 10 and 11
See Figures 10 and 11
No output filter; See Fig.3
No output filter; See Fig.2
No output filter; See Fig.3
No output filter
Output Waveforms
Efficiency vs. Output Power
98
96
14
Power Dissipation vs. Output Power
12
10
8
6
4
2
0
Efficiency (%)
94
92
90
88
86
84
0
30
60
90
120
150
180
210
240
270
300
Power Dissipation (W)
0
30
60
90
120
150
180
210
240
270
300
Output Power (W)
Output Power (W)
Figure 5—
Efficiency vs. output power at 48 Vin
Figure 6—Power
dissipation as a function of output power
vicorpower.com
800-735-6200
V•I Chip Bus Converter Module
B048K120T30
Rev. 1.0
Page 3 of 16
PRELIMINARY
Specifications
(continued)
V•I Chip Voltage Transformation Module
Figure 7—
Output voltage ripple at full load and 48 Vin; without any
external bypass capacitor.
Figure 8—Output
voltage ripple at full load and 48 Vin with 10 µF ceramic
external bypass capacitor and 20 nH of distribution inductance.
Ripple Voltage vs. Output Power
160
140
Output Ripple (mVpk-pk)
120
100
80
60
40
20
0
0
30
60
90
120
150
180
210
240
270
300
Output Power (W)
Figure 9—
Output voltage ripple vs. output power at 48 Vin line without
any external bypass capacitor.
Figure 10—
0 -25 A load step with 47 µF input capacitor and no
output capacitor.
Figure 11—
25- 0 A load step with 47 µF input capacitance.
vicorpower.com
800-735-6200
V•I Chip Bus Converter Module
B048K120T30
Rev. 1.0
Page 4 of 16
PRELIMINARY
Specifications
General
Parameter
MTBF
MIL-HDBK-217F
Telcordia TR-NT-000332
Isolation specifications
Voltage
Capacitance
Resistance
Agency approvals (pending)
Mechanical parameters
Weight
Dimensions
Length
Width
Height
1.26 / 32
0.85 / 21.5
0.23 / 6
in / mm
in / mm
in / mm
0.50 / 14
oz / g
10
cTÜVus
CE Mark
2,250
3,000
Vdc
pF
MΩ
Input to Output
Input to Output
Input to Output
UL/CSA 60950, EN 60950
Low voltage directive
See Mechanical Drawing, Figures 15 and 17
3.5
4.2
Mhrs
Mhrs
25°C, GB
(continued)
V•I Chip Voltage Transformation Module
Min
Typ
Max
Unit
Note
Auxiliary Pins
(Conditions are at 48 Vin, full load, and 25°C ambient unless otherwise specified)
Parameter
Primary control (PC)
DC voltage
Module disable voltage
Module enable voltage
Current limit
Enable delay time
Disable delay time
2.4
4.8
2.4
5.0
2.5
2.5
2.5
80
10
2.6
2.9
5.2
Vdc
Vdc
Vdc
mA
ms
µs
See Fig.12 time from PC low to output low
Source only
Min
Typ
Max
Unit
Note
Figure 12—
V
OUT
at full load vs. PC disable
Figure 13—
PC signal during fault
vicorpower.com
800-735-6200
V•I Chip Bus Converter Module
B048K120T30
Rev. 1.0
Page 5 of 16
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