The shrouded headers are interchangeable with those of the HR crimp style and insulation displacement connectors.
Top entry type
(2 circuits)
6.0(.236)
3.3(.130)
Model No.
B
3.8(.150)
Dimensions mm.(in)
A
2.5( .098)
5.0( .197)
7.5( .295)
10.0( .394)
12.5( .492)
15.0( .591)
17.5( .689)
20.0( .787)
22.5( .866)
25.0( .984)
27.5(1.083)
30.0(1.181)
32.5(1.280)
35.0(1.378)
Q'ty / box
Top entry
type
1,000
1,000
1,000
1,000
1,000
1,000
500
500
500
500
500
250
250
250
Cir-
cuits
2
3
4
5
Top entry
type
B 2B-EH-A
B 3B-EH-A
B 4B-EH-A
B 5B-EH-A
B 6B-EH-A
B 7B-EH-A
B 8B-EH-A
B 9B-EH-A
B10B-EH-A
B11B-EH-A
B12B-EH-A
B13B-EH-A
B14B-EH-A
B15B-EH-A
Side entry
type
S 2B-EH
S 3B-EH
S 4B-EH
S 5B-EH
S 6B-EH
S 7B-EH
S 8B-EH
S 9B-EH
S10B-EH
S11B-EH
S12B-EH
S13B-EH
S14B-EH
S15B-EH
B
7.5( .295)
10.0( .394)
12.5( .492)
15.0( .591)
17.5( .689)
20.0( .787)
22.5( .886)
25.0( .984)
27.5(1.083)
30.0(1.181)
32.5(1.280)
35.0(1.378)
37.5(1.476)
40.0(1.575)
Side entry
type
1,000
1,000
1,000
1,000
500
500
500
500
500
250
250
250
250
250
3.2(.126)
0.64
(.025)
A
Circuit No.1
1.6(.063)
6
7
8
9
2.5(.098)
(3 to 15 circuits)
3.8(.150)
10
11
12
6.0(.236)
3.3(.130)
13
5.1(.201)
14
15
3.2(.126)
Material and Finish
Post: Brass, copper-undercoated, tin/lead plated
Wafer: Nylon 66, UL94V-0, natural (white)
Circuit No.1
2.5
2.5 (.098)
(.098)
0.64
(.025)
A
B
1.6(.063)
Note:
1. Also available and identified as model BxxB-EH is a top entry type having a
post extension length of 4.0mm(.157")
¨
2. Top entry type headers are not TUV approved.
<For reference>
As the color identification,
the following alphabet shall be put in the underlined part.
For availability, delivery and minimum order quantity, contact JST.
<Top entry type>
6.7(.264)
Side entry type
4.2(.165)
4.0(.157)
6.0(.236)
2.2
(.087) 5.2(.205)
ex.
B2B-EH-A-o o-
(blank)…natural (white)
K…black R…red E…blue Y…yellow M…green
S2B-EH-o o-
(blank)…natural (white)
K…black R…red TR…tomato red E…blue Y…yellow
L…lemon yellow M…green O…orange N…brown P…purple
PK…pink H…gray LE…light blue FY…vivid yellow
Circuit No.1
2.5
(.098)
2.5
(.098)
A
B
0.64
(.025)
<Side entry type>
3.2
(.126)
ex.
PC board layout
(viewed from soldering side)
and Assembly layout –––––––––––––––––––
Top entry type
0.6(.024)
2.5±0.05
2.5
(.098±.002) (.098)
min.
2.2
(.087)
min.
3.8
(.150)
Side entry type
2.5±0.05
(.098±.002)
1.9
(.074)
min.
6.7
(.264)
min.
10.3(.406)
8.2(.323)
4.2
(.165)
7.5(.295)
0.1
0.9
+ 0
(.035
+.004
)dia.
0
0.1
0.9
+ 0
(.035
+.004
)dia.
0
Note:
1. Tolerances are non-cumulative: ±0.05mm(±.002" ) for all centers.
2. Hole dimension differ according to the kind of PC board and piercing method. If PC boards made of hard material such as FR-4 are used, the hole dimensions
should be larger. The dimensions above should serve as a guideline. Contact JST for details.
53
EH
CONNECTOR
Shrouded header on radial-tape –––––––––––––––––––––––––––––––––––––––––––––
<Taping specifications conform to EIAJ-RC-1008B and JIS C0805.>
•The shrouded headers are interchangeable with those of the HR crimp style and insulation displacement connectors .
¨
•Shrouded
headers on radial-tape are not TUV approved.
TS type
(2 circuits)
7.5(.295)
2.5(.098)
5.4(.213)
[1.0(.039)]
6.5
1.5(.059) (.255)
4.4
(.173)
2.2(.087)
Cir-
cuits
2
3
4
5
6
7
Model No.
B2B-EH-TS
B3B-EH-TS
B4B-EH-TS
B5B-EH-TS
B6B-EH-TS
B7B-EH-TS
B8B-EH-TS
Dimensions mm(in.)
A
-
5.0(.197)
7.5(.295)
10.0(.394)
12.5(.492)
15.0(.591)
17.5(.689)
B
-
10.0(.394)
12.5(.492)
15.0(.591)
17.5(.689)
20.0(.787)
22.5(.886)
Q'ty /
box
1,400
1,400
700
700
700
700
700
0.64(.025) dia.
8
Material and Finish
Pin: Brass, copper-undercoated, tin/lead-plated
Wafer: Nylon 66, UL94V-0, natural (white)
<For reference>
As the color identification,
the following alphabet shall be put in the underlined part.
For availability, delivery and minimum order quantity, contact JST.
Distance between the end of the tape and the first connector's center
line (either end)
Tail tape
H
TERMIN
ALS &
CONN
ECTOR
S
Lead tape
R
W
Package type
Distance between folds
Box size
Distance between the end of the
tape and the first connector´s
center line (either end)
Flat pack (zigzag folded)
24 indexing holes per fold (304.8mm/12")
(316x45x330mm)12.4"(W)x1.8"(D) x13.0"(H)
19.05mm(.750")
PC board layout
(viewed from soldering side)
and Assembly layout –––––––––––––––––––
4.4
(.173)
2.5±0.05
2.5
(.098±.002) (.098)
min.
2.2
(.087)
min.
0.1
0.9
+ 0
.004
(.035
+0
)dia.
Note:
1. Tolerances are non-cumulative: ±0.05mm(±.002" ) for all centers.
2. Hole dimension differ according to the kind of PC board and piercing method. If PC boards made of hard material such as FR-4 are used, the hole dimensions
should be larger. The dimensions above should serve as a guideline. Contact JST for details.
What do sram, srom, rom, ram, and sdram in s3c2440 refer to? My device is TQ2440. It has nor flash, nand flash, and 64MB of memory. According to the user manual, there is also SteppingStone. Does sdra...
How does the OMAP 5 SoC bring new performance and features to mobile devices and pave the way for new and exciting user experiences? This video will take you on a virtual tour of the OMAP 5 system-on-...
[i=s]This post was last edited by dontium on 2015-1-23 12:53[/i] In the medical field, endoscopes are used to peer into the human body to examine organs. When used to examine a confined space in a tec...
[i=s]This post was last edited by paulhyde on 2014-9-15 04:25[/i] This is the wireless environment monitoring simulation device we made (schematic diagram + PCB), I hope it is useful to everyone!...
[i=s] This post was last edited by yjtyjt on 2016-11-8 20:48 [/i] [align=center][b][font=宋体][size=16.0pt]Use[/size][/font][/b][b][size=16.0pt]89C2051[/size][/b][b][font=宋体][size=16.0pt] to make a ligh...
If the ultimate form of a car is a silicon-based life form, then in
the field of
intelligent driving
, it has gradually taken on the appearance of a "veteran driver." In
the field of
the ...[Details]
While
the solid-state battery
industry is still engaged in a long technological marathon for
the "ultimate solution" for
electric vehicles
, some companies have begun looking for mor...[Details]
The mass production process of the new generation of cockpit platform has started, and the smart cockpit market has entered a new bonus cycle of technology iteration and platform upgrade.
...[Details]
Limited vocabulary recognition
According to the number of characters, words or short sentences in the vocabulary, it can be roughly divided into: less than 100 is small vocabulary; 100-1000 is...[Details]
For autonomous vehicles to safely navigate the road, they must identify far more complex objects than just traffic lights, pedestrians, and other familiar objects. Among these obstacles is a crucia...[Details]
1. Multi-channel DAC technology bottleneck
Currently,
the development of multi-channel DAC technology focuses on two core challenges.
First, industrial applications urgently ...[Details]
On August 22, the Wall Street Journal reported on the 21st local time that the new US government does not plan to acquire equity in semiconductor wafer foundry giant TSMC and Micron, one of the thr...[Details]
According to foreign media reports, Ford Motor has applied to the U.S. Patent and Social Security Office (USPTO) for a patent for a door anti-collision system that may be used in future Ford vehicl...[Details]
As the range of electric vehicles continues to increase, driving electric vehicles for long-distance travel has become a trend. For high-speed travel, how much impact will high-speed driving of ele...[Details]
On August 18th, China's largest expressway
charging station,
the G25 Changshen Expressway Tonglu Service Area (South Area), officially opened and launched its integrated solar-storage-charg...[Details]
With the growth of the Internet of Things (IoT), wearable, and portable devices, consumers are growing weary of cluttered cables and the need for frequent battery recharges. The benefits of wireles...[Details]
As the core of electric vehicles, batteries are concerned with vehicle use and maintenance. The operation of vehicles is guaranteed by the electricity generated by batteries. For batteries, battery...[Details]
As automotive technology develops at an ever-increasing pace, the performance requirements for automotive internal structures, components, and accessories are becoming increasingly demanding. The d...[Details]
Recently, UBTECH announced its patent for "robot self-battery replacement structure, device and method".
The Qichacha patent abstract shows that the robot's self-battery replacement stru...[Details]
Thoughts triggered by the Wuhan Radish Run incident
It's so hot, even Ferraris spontaneously combust. A recent incident on a Wuhan overpass: a red Ferrari...[Details]