Microcontroller, 8-Bit, MROM, Z8 CPU, 8MHz, CMOS, PDIP18, PLASTIC, DIP-18
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Zilog, Inc. |
| Parts packaging code | DIP |
| package instruction | DIP, DIP18,.3 |
| Contacts | 18 |
| Reach Compliance Code | unknow |
| Has ADC | NO |
| Other features | OPTIONAL LOW EMI MODE; ROM PROTECT; TWO STANDBY MODES |
| Address bus width | |
| bit size | 8 |
| boundary scan | NO |
| CPU series | Z8 |
| maximum clock frequency | 8 MHz |
| DAC channel | NO |
| DMA channel | NO |
| External data bus width | |
| Format | FIXED POINT |
| Integrated cache | NO |
| JESD-30 code | R-PDIP-T18 |
| JESD-609 code | e0 |
| length | 22.86 mm |
| low power mode | YES |
| Number of DMA channels | |
| Number of external interrupt devices | 6 |
| Number of I/O lines | 14 |
| Number of serial I/Os | |
| Number of terminals | 18 |
| Number of timers | 1 |
| On-chip data RAM width | 8 |
| On-chip program ROM width | 8 |
| Maximum operating temperature | 105 °C |
| Minimum operating temperature | -40 °C |
| PWM channel | NO |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP18,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | 240 |
| power supply | 3.3/5 V |
| Certification status | Not Qualified |
| RAM (bytes) | 60 |
| RAM (number of words) | 60 |
| rom(word) | 512 |
| ROM programmability | MROM |
| Maximum seat height | 4.24 mm |
| speed | 8 MHz |
| Maximum slew rate | 11 mA |
| Maximum supply voltage | 5.5 V |
| Minimum supply voltage | 3 V |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 7.62 mm |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER |
| Z86C0308PEC | Z86C0612SSC | Z86C0308PSC | Z86C0308SEC | Z86C0308SSC | Z86C0612SEC | |
|---|---|---|---|---|---|---|
| Description | Microcontroller, 8-Bit, MROM, Z8 CPU, 8MHz, CMOS, PDIP18, PLASTIC, DIP-18 | IC 8-BIT, MROM, 12 MHz, MICROCONTROLLER, PDSO18, PLASTIC, SOIC-18, Microcontroller | IC 8-BIT, MROM, 8 MHz, MICROCONTROLLER, PDIP18, PLASTIC, DIP-18, Microcontroller | Microcontroller, 8-Bit, MROM, Z8 CPU, 8MHz, CMOS, PDSO18, PLASTIC, SOIC-18 | IC 8-BIT, MROM, 8 MHz, MICROCONTROLLER, PDSO18, PLASTIC, SOIC-18, Microcontroller | IC 8-BIT, MROM, 12 MHz, MICROCONTROLLER, PDSO18, PLASTIC, SOIC-18, Microcontroller |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | Zilog, Inc. | Zilog, Inc. | Zilog, Inc. | Zilog, Inc. | Zilog, Inc. | Zilog, Inc. |
| Parts packaging code | DIP | SOIC | DIP | SOIC | SOIC | SOIC |
| package instruction | DIP, DIP18,.3 | SOP, SOP18,.4 | DIP, DIP18,.3 | SOP, SOP18,.4 | SOP, SOP18,.4 | SOP, SOP18,.4 |
| Contacts | 18 | 18 | 18 | 18 | 18 | 18 |
| Reach Compliance Code | unknow | unknown | unknow | unknow | unknow | unknow |
| Has ADC | NO | NO | NO | NO | NO | NO |
| Other features | OPTIONAL LOW EMI MODE; ROM PROTECT; TWO STANDBY MODES | OPTIONAL LOW EMI MODE; ROM PROTECT; TWO STANDBY MODES | OPTIONAL LOW EMI MODE; ROM PROTECT; TWO STANDBY MODES | OPTIONAL LOW EMI MODE; ROM PROTECT; TWO STANDBY MODES | OPTIONAL LOW EMI MODE; ROM PROTECT; TWO STANDBY MODES | OPTIONAL LOW EMI MODE; ROM PROTECT; TWO STANDBY MODES |
| bit size | 8 | 8 | 8 | 8 | 8 | 8 |
| boundary scan | NO | NO | NO | NO | NO | NO |
| CPU series | Z8 | Z8 | Z8 | Z8 | Z8 | Z8 |
| maximum clock frequency | 8 MHz | 12 MHz | 8 MHz | 8 MHz | 8 MHz | 12 MHz |
| DAC channel | NO | NO | NO | NO | NO | NO |
| DMA channel | NO | NO | NO | NO | NO | NO |
| Format | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT |
| Integrated cache | NO | NO | NO | NO | NO | NO |
| JESD-30 code | R-PDIP-T18 | R-PDSO-G18 | R-PDIP-T18 | R-PDSO-G18 | R-PDSO-G18 | R-PDSO-G18 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
| length | 22.86 mm | 11.55 mm | 22.86 mm | 11.575 mm | 11.575 mm | 11.55 mm |
| low power mode | YES | YES | YES | YES | YES | YES |
| Number of external interrupt devices | 6 | 6 | 6 | 6 | 6 | 6 |
| Number of I/O lines | 14 | 14 | 14 | 14 | 14 | 14 |
| Number of terminals | 18 | 18 | 18 | 18 | 18 | 18 |
| Number of timers | 1 | 2 | 1 | 1 | 1 | 2 |
| On-chip data RAM width | 8 | 8 | 8 | 8 | 8 | 8 |
| On-chip program ROM width | 8 | 8 | 8 | 8 | 8 | 8 |
| Maximum operating temperature | 105 °C | 70 °C | 70 °C | 105 °C | 70 °C | 105 °C |
| PWM channel | NO | NO | NO | NO | NO | NO |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | SOP | DIP | SOP | SOP | SOP |
| Encapsulate equivalent code | DIP18,.3 | SOP18,.4 | DIP18,.3 | SOP18,.4 | SOP18,.4 | SOP18,.4 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| Peak Reflow Temperature (Celsius) | 240 | 225 | NOT SPECIFIED | 240 | 225 | 225 |
| power supply | 3.3/5 V | 3.3/5 V | 3.3/5 V | 3.3/5 V | 3.3/5 V | 3.3/5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM (bytes) | 60 | 124 | 60 | 60 | 60 | 124 |
| RAM (number of words) | 60 | 124 | 60 | 60 | 60 | 124 |
| rom(word) | 512 | 1024 | 512 | 512 | 512 | 1024 |
| ROM programmability | MROM | MROM | MROM | MROM | MROM | MROM |
| Maximum seat height | 4.24 mm | 2.65 mm | 4.24 mm | 2.65 mm | 2.65 mm | 2.65 mm |
| speed | 8 MHz | 12 MHz | 8 MHz | 8 MHz | 8 MHz | 12 MHz |
| Maximum slew rate | 11 mA | 15 mA | 11 mA | 11 mA | 11 mA | 15 mA |
| Maximum supply voltage | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | YES | NO | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | GULL WING |
| Terminal pitch | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | 30 | NOT SPECIFIED | NOT SPECIFIED | 30 | 30 |
| width | 7.62 mm | 7.5 mm | 7.62 mm | 7.5 mm | 7.5 mm | 7.5 mm |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
| Is it lead-free? | - | Contains lead | Contains lead | - | Contains lead | Contains lead |
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