EEWORLDEEWORLDEEWORLD

Part Number

Search

LD06AC162KAB3A

Description
Ceramic Capacitor, Multilayer, Ceramic, 1000V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.0016uF, Surface Mount, 1206, CHIP
CategoryPassive components    capacitor   
File Size46KB,2 Pages
ManufacturerAVX
Download Datasheet Parametric View All

LD06AC162KAB3A Overview

Ceramic Capacitor, Multilayer, Ceramic, 1000V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.0016uF, Surface Mount, 1206, CHIP

LD06AC162KAB3A Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerAVX
package instruction, 1206
Reach Compliance Code_compli
ECCN codeEAR99
capacitance0.0016 µF
Capacitor typeCERAMIC CAPACITOR
dielectric materialsCERAMIC
high1.52 mm
JESD-609 codee0
length3.2 mm
Manufacturer's serial numberLD06
Installation featuresSURFACE MOUNT
multi-layerYes
negative tolerance10%
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
Package formSMT
method of packingTR, 13 INCH
positive tolerance10%
Rated (DC) voltage (URdc)1000 V
seriesLD(HIGH VOLTAGE)
size code1206
surface mountYES
Temperature characteristic codeX7R
Temperature Coefficient15% ppm/°C
Terminal surfaceTin/Lead (Sn/Pb) - with Nickel (Ni) barrie
Terminal shapeWRAPAROUND
width1.6 mm
High Voltage MLC Chips
Tin/Lead Termination “B”
For 600V to 5000V Applications
AVX Corporation will support those customers for commercial and mili-
tary Multilayer Ceramic Capacitors with a termination consisting of 5%
minimum lead. This termination is indicated by the use of a “B” in the
12th position of the AVX Catalog Part Number. This fulfills AVX’s
commitment to providing a full range of products to our customers. AVX
has provided in the following pages, a full range of values that we are
offering in this “B” termination.
Larger physical sizes than normally encountered chips are used to make
high voltage MLC chip product. Special precautions must be taken in
applying these chips in surface mount assemblies. The temperature
gradient during heating or cooling cycles should not exceed 4ºC per
second. The preheat temperature must be within 50ºC of the peak tem-
perature reached by the ceramic bodies through the soldering process.
Chip sizes 1210 and larger should be reflow soldered only. Capacitors
may require protective surface coating to prevent external arcing.
For 1825, 2225 and 3640 sizes, AVX offers leaded version in either
thru-hole or SMT configurations (for details see section on high voltage
leaded MLC chips).
NEW 630V RANGE
HOW TO ORDER
LD08
A
A
271
Capacitance Code
(2 significant digits
+ no. of zeros)
Examples:
10 pF = 100
100 pF = 101
1,000 pF = 102
22,000 pF = 223
220,000 pF = 224
1 μF = 105
K
Capacitance
Tolerance
C0G: J = ±5%
K = ±10%
M = ±20%
X7R: K = ±10%
M = ±20%
Z = +80%, -20%
A
Test
Level
A = Standard
B
1
A
Special Code
A = Standard
Voltage
Temperature
AVX
600V/630V = C
Coefficient
Style
1000V = A
C0G = A
LD05 - 0805
1500V = S
X7R = C
LD06 - 1206
2000V = G
LD10 - 1210
2500V = W
LD08 - 1808
3000V = H
LD12 - 1812
4000V = J
LD13 - 1825
5000V = K
LD20 - 2220
LD14 - 2225
LD40 - 3640
***
Termination
Packaging
B = 5% Min Pb 1 = 7" Reel
3 = 13" Reel
9 = Bulk
Notes: Capacitors with X7R dielectrics are not intended for applications across AC supply mains or AC line filtering with polarity reversal. Contact plant for recommendations.
Contact factory for availability of Termination and Tolerance options for Specific Part Numbers.
***
AVX offers nonstandard chip sizes. Contact factory for details.
W
L
T
DIMENSIONS
SIZE
(L) Length
t
millimeters (inches)
LD05 (0805)
LD06 (1206)
LD10* (1210) LD08* (1808) LD12* (1812) LD13* (1825) LD20* (2220) LD14* (2225) LD40* (3640)
2.01 ± 0.20
3.20 ± 0.20
3.20 ± 0.20
4.57 ± 0.25
4.50 ± 0.30
4.50 ± 0.30
5.70 ± 0.40
5.72 ± 0.25
9.14 ± 0.25
(0.079 ± 0.008) (0.126 ± 0.008) (0.126 ± 0.008) (0.180 ± 0.010) (0.177 ± 0.012) (0.177 ± 0.012) (0.224 ± 0.016) (0.225 ± 0.010) (0.360 ± 0.010)
(W) Width
1.25 ± 0.20
1.60 ± 0.20
2.50 ± 0.20
2.03 ± 0.25
3.20 ± 0.20
6.40 ± 0.30
5.00 ± 0.40
6.35 ± 0.25
10.2 ± 0.25
(0.049 ±0.008) (0.063 ± 0.008) (0.098 ± 0.008) (0.080 ± 0.010) (0.126 ± 0.008) (0.252 ± 0.012) (0.197 ± 0.016) (0.250 ± 0.010) (0.400 ± 0.010)
(T) Thickness
1.30
1.52
1.70
2.03
2.54
2.54
3.30
2.54
2.54
Max.
(0.051)
(0.060)
(0.067)
(0.080)
(0.100)
(0.100)
(0.130)
(0.100)
(0.100)
(t) terminal min. 0.50 ± 0.25
0.25 (0.010)
0.25 (0.010)
0.25 (0.010)
0.25 (0.010)
0.25 (0.010)
0.25 (0.010)
0.25 (0.010)
0.76 (0.030)
max. (0.020 ± 0.010) 0.75 (0.030)
0.75 (0.030)
1.02 (0.040)
1.02 (0.040)
1.02 (0.040)
1.02 (0.040)
1.02 (0.040)
1.52 (0.060)
* Reflow soldering only.
84
Smart mobile power bank supports high voltage charging
[align=left][color=#000] Power banks are becoming increasingly popular as battery capacity outperforms the operating power of personal electronic devices such as smartphones and tablets. High-performa...
maylove Analogue and Mixed Signal
Regarding the calculation of magnetic components in power supplies, there are a few points I don't know if I understand correctly? Please trouble the moderator and everyone, thank you
[table=98%] [tr][td]Hello everyone. I am new to switching power supplies and have some inadequacies in my understanding of transformers. I would like to ask you a few questions. (1) For flyback power ...
jonny0811 Power technology
Differential driver in front of AD
AD is a differential input. The driver AD4932-1 in front of it can be used for single-ended to differential and differential to differential conversion. AD4932-1 has single power supply and dual power...
萤火 ADI Reference Circuit
A Brief Discussion on Bluetooth Wireless Testing
In order to obtain the Bluetooth trademark, Bluetooth product manufacturers must submit their Bluetooth products to BQTF (Bluetooth Certification Test Facility) for testing, and send their test result...
Aguilera RF/Wirelessly
dsp5402 DMA and Mcbsp0 coordination issues
The process of signal input and output with a sampling period of 16K : input from Mcbsp0, stored in two buffers Lin_bufA and Lin_bufB through DMA2 interrupt (the two buffers receive data alternately, ...
wonderglass DSP and ARM Processors
Ask at24c08 reading and writing problems
0x00 , # 30h mov 0x4a , # 31h mov r2 , # 1 mov 0x30,#81hmov 0x31 ,# 20h callwrite_eeprom mov0x49,#31hmov 0x4a,#32hmov r2,#1call read_eeprommov p1,0x32jmp test_eeprom init_eeprom:mov 0x47,#0a0hmov 0x48...
cheesetree 51mcu

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1913  2903  1037  1568  2556  39  59  21  32  52 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号