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IDT71T65602S133BG

Description
ZBT SRAM, 256KX36, 4.2ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, BGA-119
Categorystorage    storage   
File Size535KB,25 Pages
ManufacturerIDT (Integrated Device Technology)
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IDT71T65602S133BG Overview

ZBT SRAM, 256KX36, 4.2ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, BGA-119

IDT71T65602S133BG Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerIDT (Integrated Device Technology)
Parts packaging codeBGA
package instructionBGA,
Contacts119
Reach Compliance Code_compli
ECCN code3A991.B.2.A
Maximum access time4.2 ns
JESD-30 codeR-PBGA-B119
JESD-609 codee0
length22 mm
memory density9437184 bi
Memory IC TypeZBT SRAM
memory width36
Humidity sensitivity level3
Number of functions1
Number of terminals119
word count262144 words
character code256000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize256KX36
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Package shapeRECTANGULAR
Package formGRID ARRAY
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)225
Certification statusNot Qualified
Maximum seat height2.36 mm
Maximum supply voltage (Vsup)2.625 V
Minimum supply voltage (Vsup)2.375 V
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch1.27 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature20
width14 mm
256K x 36, 512K x 18
2.5V Synchronous ZBT™ SRAMs
2.5V I/O, Burst Counter
Pipelined Outputs
Features
u
256K x 36, 512K x 18 memory configurations
u
Supports high performance system speed - 150 MHz
u
ZBT
TM
Feature - No dead cycles between write and read
u
Internally synchronized output buffer enable eliminates the
u
Single R/W (READ/WRITE) control pin
u
Positive clock-edge triggered address, data, and control
u
u
u
u
u
u
u
need to control
OE
cycles
(3.8 ns Clock-to-Data Access)
Preliminary
IDT71T65602
IDT71T65802
Description
signal registers for fully pipelined applications
4-word burst capability (interleaved or linear)
Individual byte write (BW
1
-
BW
4
) control (May tie active)
Three chip enables for simple depth expansion
2.5V power supply (±5%)
2.5V I/O Supply (V
DDQ
)
Power down controlled by ZZ input
Packaged in a JEDEC standard 100-pin plastic thin quad
flatpack (TQFP), 119 ball grid array (BGA) and 165 fine pitch
ball grid array (fBGA).
The IDT71T65602/5802 are 2.5V high-speed 9,437,184-bit
(9 Megabit) synchronous SRAMs. They are designed to eliminate dead
bus cycles when turning the bus around between reads and writes, or
writes and reads. Thus, they have been given the name ZBT
TM
, or Zero
Bus Turnaround.
Address and control signals are applied to the SRAM during one
clock cycle, and two cycles later the associated data cycle occurs, be it
read or write.
The IDT71T65602/5802 contain data I/O, address and control signal
registers. Output enable is the only asynchronous signal and can be used
to disable the outputs at any given time.
A Clock Enable
CEN
pin allows operation of the IDT71T65602/5802
to be suspended as long as necessary. All synchronous inputs are ignored
when (CEN) is high and the internal device registers will hold their previous
values.
There are three chip enable pins (CE
1
, CE
2
,
CE
2
) that allow the
user to deselect the device when desired. If any one of these three is not
asserted when ADV/LD is low, no new memory operation can be initiated.
Pin Description Summary
A
0
-A
18
CE
1
, CE
2
,
CE
2
OE
R/W
CEN
BW
1
,
BW
2
,
BW
3
,
BW
4
CLK
ADV/LD
LBO
TMS
TDI
TCK
TDO
ZZ
I/O
0
-I/O
31
, I/O
P1
-I/O
P4
V
DD
, V
DDQ
V
SS
Address Inputs
Chip Enables
Output Enable
Read/Write Signal
Clock Enable
Individual Byte Write Selects
Clock
Advance burst address / Load new address
Linear / Interleaved Burst Order
Test Mode Select
Test Data Input
Test Clock
Test Data Output
Sleep Mode
Data Input / Output
Core Power, I/O Power
Ground
Input
Input
Input
Input
Input
Input
Input
Input
Input
Input
Input
Input
Output
Input
I/O
Supply
Supply
Synchronous
Synchronous
Asynchronous
Synchronous
Synchronous
Synchronous
N/A
Synchronous
Static
N/A
N/A
N/A
N/A
Asynchronous
Synchronous
Static
Static
5302 tbl 01
ZBT and Zero Bus Turnaround are trademarks of Integrated Device Technology, Inc. and the architecture is supported by Micron Technology and Motorola, Inc.
NOVEMBER 2000
DSC-5302/02
1
©2000 Integrated Device Technology, Inc.

IDT71T65602S133BG Related Products

IDT71T65602S133BG IDT71T65602S133PF IDT71T65602S100BQ IDT71T65602S100PF IDT71T65602S150PF IDT71T65602S150BG IDT71T65602S150BQ IDT71T65602S100BG
Description ZBT SRAM, 256KX36, 4.2ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, BGA-119 ZBT SRAM, 256KX36, 4.2ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIHGT, PLASTIC, TQFP-100 ZBT SRAM, 256KX36, 5ns, CMOS, PBGA165, 13 X 15 MM, FBGA-165 ZBT SRAM, 256KX36, 5ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIHGT, PLASTIC, TQFP-100 ZBT SRAM, 256KX36, 3.8ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIHGT, PLASTIC, TQFP-100 ZBT SRAM, 256KX36, 3.8ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, BGA-119 ZBT SRAM, 256KX36, 3.8ns, CMOS, PBGA165, 13 X 15 MM, FBGA-165 ZBT SRAM, 256KX36, 5ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, BGA-119
Is it lead-free? Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Parts packaging code BGA QFP BGA QFP QFP BGA BGA BGA
package instruction BGA, LQFP, TBGA, LQFP, LQFP, BGA, TBGA, BGA,
Contacts 119 100 165 100 100 119 165 119
Reach Compliance Code _compli not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant _compli
ECCN code 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A
Maximum access time 4.2 ns 4.2 ns 5 ns 5 ns 3.8 ns 3.8 ns 3.8 ns 5 ns
JESD-30 code R-PBGA-B119 R-PQFP-G100 R-PBGA-B165 R-PQFP-G100 R-PQFP-G100 R-PBGA-B119 R-PBGA-B165 R-PBGA-B119
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0
length 22 mm 20 mm 15 mm 20 mm 20 mm 22 mm 15 mm 22 mm
memory density 9437184 bi 9437184 bit 9437184 bit 9437184 bit 9437184 bit 9437184 bit 9437184 bit 9437184 bi
Memory IC Type ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM
memory width 36 36 36 36 36 36 36 36
Humidity sensitivity level 3 3 3 3 3 3 3 3
Number of functions 1 1 1 1 1 1 1 1
Number of terminals 119 100 165 100 100 119 165 119
word count 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words
character code 256000 256000 256000 256000 256000 256000 256000 256000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 256KX36 256KX36 256KX36 256KX36 256KX36 256KX36 256KX36 256KX36
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA LQFP TBGA LQFP LQFP BGA TBGA BGA
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY FLATPACK, LOW PROFILE GRID ARRAY, THIN PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE GRID ARRAY GRID ARRAY, THIN PROFILE GRID ARRAY
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 225 240 225 240 240 225 225 225
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 2.36 mm 1.6 mm 1.2 mm 1.6 mm 1.6 mm 2.36 mm 1.2 mm 2.36 mm
Maximum supply voltage (Vsup) 2.625 V 2.625 V 2.625 V 2.625 V 2.625 V 2.625 V 2.625 V 2.625 V
Minimum supply voltage (Vsup) 2.375 V 2.375 V 2.375 V 2.375 V 2.375 V 2.375 V 2.375 V 2.375 V
Nominal supply voltage (Vsup) 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V
surface mount YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form BALL GULL WING BALL GULL WING GULL WING BALL BALL BALL
Terminal pitch 1.27 mm 0.65 mm 1 mm 0.65 mm 0.65 mm 1.27 mm 1 mm 1.27 mm
Terminal location BOTTOM QUAD BOTTOM QUAD QUAD BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature 20 20 20 20 20 20 20 20
width 14 mm 14 mm 13 mm 14 mm 14 mm 14 mm 13 mm 14 mm
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) - - IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
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