210R2400KW datasheet, PDF - EEWORLD Datasheet

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210R2400KW: DescriptionRESISTOR, NETWORK, FILM, DIVIDER, 0.25W, SURFACE MOUNT, CHIP; CategoryPassive components The resistor; File Size396KB，1 Pages; ManufacturerCalifornia Micro Devices

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210R2400KW Overview

RESISTOR, NETWORK, FILM, DIVIDER, 0.25W, SURFACE MOUNT, CHIP

210R2400KW Parametric

Parameter Name	Attribute value
Maker	California Micro Devices
package instruction	CHIP
Reach Compliance Code	unknow
ECCN code	EAR99
The first element resistor	60 Ω
Manufacturer's serial number	210R
Installation features	SURFACE MOUNT
Network Type	DIVIDER
Number of components	12
Number of functions	1
Number of terminals	13
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package shape	RECTANGULAR PACKAGE
method of packing	TRAY
Rated power dissipation(P)	0.25 W
Rated temperature	70 °C
Resistor type	ARRAY/NETWORK RESISTOR
Second/last element resistor	60 Ω
surface mount	YES
technology	THIN FILM
Temperature Coefficient	250 ppm/°C
Terminal surface	ALUMINUM
Terminal shape	ONE SURFACE
Tolerance	10%
Operating Voltage	100 V

210R2400KW Preview

CALIFORNIA MICRO DEVICES

210R

THIN FILM RESISTOR SERIES

California Micro Devices 210R Series multi-terminal resistor chip offers the hybrid designer a component that provides a

wide range of resistance values on a single chip. Bonding pads segment the total resistance into five single elements of

resistance and seven 5X elements of resistance enabling the combination to cover the resistance range from 800 ohms to

240K ohms.

Parameter

TCR

Operating Voltage

Package

ating per re

Power R

Power

(

Rating

sistor)

Thermal Shock

High Temperature Exposure

Moisture Resistance

Life

Noise

Insulation Resistance

ELECTRICAL SPECIFICATIONS

Test Condition

-55°C to +125°C

@ 70°C (D erate linearly to zero @ 150° C )

Method 107 MIL-STD -202F

100 Hrs @ 150° C A m b i e n t

Method 106 MIL-STD -202F

Method 108 MIL-STD -202F (125° C / 1 0 0 0 h r )

Method 308 MIL-STD -202F

@ 25° C

0 to -250ppm/°C

100Vdc

250mw

±0.25% @

∆R

±0.25%

∆R

±0.5%

∆R

±0.5%

∆R

-20dB

1 0

Ω

Max

Min

PAD 1

PAD 13

PAD 8

Part Number

2 10 R

8000X

2 40 0 X

8 0 0 1X

8002X

16 0 2 X

2 40 3 X

VALUES

Total

Nominal/Single

Resistance

Element of Resistance

800

Ω

2 40 0

Ω

8000

Ω

80000

Ω

16 0 0 0 0

Ω

2 40 0 0 0

Ω

200

2000

40 0 0

6000

Formats

Die Size:

30±3 mils square

Bonding Pads:

4x4 mils typical

MECHANICAL SPECIFICATIONS

Substrate

Isolation Layer

Backing

Metalization

Silicon 10±2 mils thick

100,000Å thick, min

Lapped (gold optional)

Aluminum 10,000Å thick, min

(15,000Å gold optional)

PACKAGING

Two inch square trays of 400 chips maximum.

NOTE S

1. The tolerance applies to the total resistance value only.

2. Resistor pattern may vary from one value to another.

210R

Series

8502

Value

First 3 digits are

significant value.

Last digit represents

number of zeros.

R indicates decimal point

PART NUMBER DESIGNATION

Tolerance

J = ±5%

K = ±10%

M = ±20%

B o n d P a ds

G = Go l d

No Letter = Aluminum

Backing

W = Go l d

L = Lapped

No Letter = Either

3/02

C0740400

215 Topaz Street, Milpitas, California 95035

Tel: (408) 263-3214

Fax: (408) 263-7846

www.calmicro.com

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