Low-Gain Op Amp with Fast 14-Bit Settling
| CLC402A8B | CLC402 | CLC402AJE | CLC402AJP | CLC402ALC | CLC402AMC | |
|---|---|---|---|---|---|---|
| Description | Low-Gain Op Amp with Fast 14-Bit Settling | Low-Gain Op Amp with Fast 14-Bit Settling | Low-Gain Op Amp with Fast 14-Bit Settling | Low-Gain Op Amp with Fast 14-Bit Settling | Low-Gain Op Amp with Fast 14-Bit Settling | Low-Gain Op Amp with Fast 14-Bit Settling |
| Parts packaging code | - | - | SOIC | DIP | WAFER | WAFER |
| package instruction | - | - | PLASTIC, SOIC-8 | DIP, DIP8,.3 | DIE, DIE OR CHIP | DIE |
| Reach Compliance Code | - | - | unknow | unknow | unknow | unknow |
| ECCN code | - | - | EAR99 | EAR99 | EAR99 | EAR99 |
| Amplifier type | - | - | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
| Architecture | - | - | CURRENT-FEEDBACK | CURRENT-FEEDBACK | CURRENT-FEEDBACK | CURRENT-FEEDBACK |
| Maximum bias current (IIB) at 25C | - | - | 30 µA | 30 µA | 30 µA | 30 µA |
| Nominal Common Mode Rejection Ratio | - | - | 65 dB | 65 dB | 65 dB | 65 dB |
| frequency compensation | - | - | YES | YES | YES | YES |
| Maximum input offset voltage | - | - | 2800 µV | 2800 µV | 1600 µV | 1600 µV |
| JESD-30 code | - | - | R-PDSO-G8 | R-PDIP-T8 | X-XUUC-N5 | X-XUUC-N5 |
| low-bias | - | - | NO | NO | NO | NO |
| low-dissonance | - | - | NO | NO | NO | NO |
| micropower | - | - | NO | NO | NO | NO |
| Negative supply voltage upper limit | - | - | -7 V | -7 V | -7 V | -7 V |
| Nominal Negative Supply Voltage (Vsup) | - | - | -5 V | -5 V | -5 V | -5 V |
| Number of functions | - | - | 1 | 1 | 1 | 1 |
| Number of terminals | - | - | 8 | 8 | 5 | 5 |
| Maximum operating temperature | - | - | 85 °C | 85 °C | 125 °C | 125 °C |
| Minimum operating temperature | - | - | -40 °C | -40 °C | -55 °C | -55 °C |
| Package body material | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED |
| encapsulated code | - | - | SOP | DIP | DIE | DIE |
| Encapsulate equivalent code | - | - | SOP8,.25 | DIP8,.3 | DIE OR CHIP | DIE OR CHIP |
| Package shape | - | - | RECTANGULAR | RECTANGULAR | UNSPECIFIED | UNSPECIFIED |
| Package form | - | - | SMALL OUTLINE | IN-LINE | UNCASED CHIP | UNCASED CHIP |
| power | - | - | NO | NO | NO | NO |
| power supply | - | - | +-5 V | +-5 V | +-5 V | +-5 V |
| Programmable power | - | - | NO | NO | NO | NO |
| Certification status | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| minimum slew rate | - | - | 500 V/us | 500 V/us | 500 V/us | 500 V/us |
| Nominal slew rate | - | - | 800 V/us | 800 V/us | 800 V/us | 800 V/us |
| Maximum slew rate | - | - | 20 mA | 20 mA | 20 mA | 20 mA |
| Supply voltage upper limit | - | - | 7 V | 7 V | 7 V | 7 V |
| Nominal supply voltage (Vsup) | - | - | 5 V | 5 V | 5 V | 5 V |
| surface mount | - | - | YES | NO | YES | YES |
| technology | - | - | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| Temperature level | - | - | INDUSTRIAL | INDUSTRIAL | MILITARY | MILITARY |
| Terminal form | - | - | GULL WING | THROUGH-HOLE | NO LEAD | NO LEAD |
| Terminal location | - | - | DUAL | DUAL | UPPER | UPPER |
| broadband | - | - | YES | YES | YES | YES |