TC9028AP datasheet, PDF - EEWORLD Datasheet

TC9028AP: DescriptionINFRARED REMOTE CONTROL TRANSMITTING CMOS LSI WITH MICROCONTROLLING; CategoryThe embedded processor and controller Microcontrollers and processors; File Size822KB，20 Pages; ManufacturerToshiba Semiconductor; Websitehttp://toshiba-semicon-storage.com/

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TC9028AP Overview

INFRARED REMOTE CONTROL TRANSMITTING CMOS LSI WITH MICROCONTROLLING

Parameter Name	Attribute value
Parts packaging code	DIP
package instruction	DIP,
Contacts	20
Reach Compliance Code	unknow
Has ADC	NO
Address bus width
bit size	4
maximum clock frequency	0.8 MHz
DAC channel	NO
DMA channel	NO
External data bus width
JESD-30 code	R-PDIP-T20
JESD-609 code	e0
length	24.6 mm
Number of I/O lines	15
Number of terminals	20
Maximum operating temperature	75 °C
Minimum operating temperature	-20 °C
PWM channel	NO
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Certification status	Not Qualified
ROM programmability	MROM
Maximum seat height	4.45 mm
Maximum supply voltage	4 V
Minimum supply voltage	2 V
Nominal supply voltage	3 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL EXTENDED
Terminal surface	TIN LEAD
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	7.62 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER
Base Number Matches	1

	TC9028AP	TC9028AF
Description	INFRARED REMOTE CONTROL TRANSMITTING CMOS LSI WITH MICROCONTROLLING	INFRARED REMOTE CONTROL TRANSMITTING CMOS LSI WITH MICROCONTROLLING
Parts packaging code	DIP	SOIC
package instruction	DIP,	0.300 INCH, 1.27 MM PITCH, PLASTIC, SOP-20
Contacts	20	20
Reach Compliance Code	unknow	unknow
Has ADC	NO	NO
bit size	4	4
maximum clock frequency	0.8 MHz	0.8 MHz
DAC channel	NO	NO
DMA channel	NO	NO
JESD-30 code	R-PDIP-T20	R-PDSO-G20
JESD-609 code	e0	e0
length	24.6 mm	12.8 mm
Number of I/O lines	15	15
Number of terminals	20	20
Maximum operating temperature	75 °C	75 °C
Minimum operating temperature	-20 °C	-20 °C
PWM channel	NO	NO
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	SOP
Package shape	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE
Certification status	Not Qualified	Not Qualified
ROM programmability	MROM	MROM
Maximum seat height	4.45 mm	1.8 mm
Maximum supply voltage	4 V	4 V
Minimum supply voltage	2 V	2 V
Nominal supply voltage	3 V	3 V
surface mount	NO	YES
technology	CMOS	CMOS
Temperature level	COMMERCIAL EXTENDED	COMMERCIAL EXTENDED
Terminal surface	TIN LEAD	TIN LEAD
Terminal form	THROUGH-HOLE	GULL WING
Terminal pitch	2.54 mm	1.27 mm
Terminal location	DUAL	DUAL
width	7.62 mm	5.3 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER	MICROCONTROLLER
Base Number Matches	1	1

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

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