EEWORLDEEWORLDEEWORLD

Part Number

Search

BD105-08A-2-0250-0460-0250-NE

Description
Board Connector
CategoryThe connector    The connector   
File Size348KB,1 Pages
ManufacturerGlobal Connector Technology
Environmental Compliance
Download Datasheet Parametric View All

BD105-08A-2-0250-0460-0250-NE Overview

Board Connector

BD105-08A-2-0250-0460-0250-NE Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerGlobal Connector Technology
Reach Compliance Codecompli
ECCN codeEAR99
Connector typeBOARD CONNECTOR
Contact to complete cooperationGOLD FLASH
Contact completed and terminatedGOLD FLASH
Contact materialCOPPER ALLOY
JESD-609 codee4
Manufacturer's serial numberBD105
1
2
3
4
5
6
7
8
Global Connector Technology Ltd. - BD105: 1.27mm PITCH ELEVATED PIN HEADER, SINGLE ROW, SURFACE MOUNT, VERTICAL
A
A
B
C
D
E
SPECIFICATIONS
规格:
CURRENT RATING
电流额定值:
1 AMP
No. of Contacts
INSULATOR RESISTANCE
绝缘电阻值:
1000 MEGOHMS MIN.
03 to 33
F
DIELECTRIC WITHSTANDING
耐电压:
AC 300 V
Contact Plating
CONTACT RESISTANCE
接触电阻值:
20m
Max.
A = Gold Flash All Over
OPERATING TEMPERATURE
工½温度:
-40°C TO +105°C
B = Selective Gold Flash Contact Area/
CONTACT MATERIAL
端子物料:
COPPER ALLOY
Tin On Tail
INSULATOR MATERIAL
绝缘½物料
:
C = Tin All Over
STANDARD
标准物料
: POLYESTER
聚酯
, LCP, UL 94-V0
G = 10µ" Gold Contact Area/Tin On Tail
OPTIONS
可选物料
: POLYAMIDE
聚醯胺
, NYLON 6T, UL 94-V0
I = 30µ" Gold Contact Area/Tin On Tail
SOLDERING PROCESS
可焊性
:
Standard = Gold Flash All Over
LCP (STANDARD
标准物料
) -
G
IR REFLOW
回流焊
: 260°C for 10 sec.
WAVE
波峰焊
: 250°C for 5-10 sec
MANUAL SOLDER
人工焊接
: 350°C for 3-5 sec
NYLON 6T (OPTION
可选物料
) -
IR REFLOW
回流焊
: 260°C for 10 sec.
WAVE
波峰焊
: 230°C for 5-10 sec.
MANUAL SOLDER
人工焊接
: 350°C for 3-5sec
MATES WITH
配套之母座
(SUBJECT TO PIN LENGTH
在端子长度适合的条件下
):
BD074
BD075
BD080
BD090
H
By
DETAIL
REV
DATE
LYH
DRAWING
RELEASE
A
28/12/07
PN
STANDARD INSULATOR
MATERIAL & PACKING
OPTIONS CHANGED
CB
PACKING OPTIONS SOLDER TEMP & MATES
WITH INFO. UPDATED
CHANGED
B
27/04/09
1
C
20/05/09
G CE
N N
I
D E
N SC
E E
P L
O
S
B
GC
O
Ordering Grid
B
C
D
E
BD105
XX X
X
XXXX
XXXX
XXXX
X
X
Type
1 = R1 Type
2 = R2 Type
Packing Options
B = Tape and Reel with Cap (Standard)
D = Tube (Standard - where height exceeds 25mm)
E = Tube with Cap
Insulator Material
L = LCP (Standard)
N = Nylon 6T
F
Dimension C (1/100mm)
(Post Height)
Standard - 3.00mm = 0300
or specify Dimension C
e.g. 2.50mm = 0250
Tol +/- 0.2mm
Dimension D (1/100mm)
(Stack Height)
Standard - 4.60mm = 0460
Please Specify Dimension D
e.g. 2.5mm = 0250
Tol +/- 0.2mm
Part Number:-
Dimension E (1/100mm)
(Footprint Width)
Standard - 4.50mm = 0450
or specify Dimension E
e.g. 2.50mm = 0250
Tol +/- 0.2mm
G
Tolerances
(Except as noted)
Date:-
Dimensions in mm
BD105
28 DEC 07
AE
2
D
27/07/09
AE
DIMENSION
AMMENDED
E
27/08/09
3
AJO
BD105
X PCN
X
15/05/14
X.°±5°
.X°±2°
X.X ± 0.20
X.XX ± 0.15 .XX°±1°
X.XXX ± 0.10 .XXX°±0.5°
X. ± 0.30
Third Angle Projection
Description:-
H
Sheet No.
1/1
1.27mm PITCH ELEVATED PIN HEADER, SINGLE ROW
SURFACE MOUNT, VERTICAL
www.globalconnectortechnology.com
Material
Drawn by
LYH
X
See Note
E & OE
C
THIS DRAWING IS CONFIDENTIAL AND MUST NOT BE
COPIED OR DISCLOSED WITHOUT WRITTEN CONSENT
Scale
NTS
Revision
4
5
6
7
8
TI C6000 DSP Notes
DSP C6000 Architecture (1) Harvard structure: Programs and data are stored in different memories, and each independent memory is independently addressed and accessed.(2) Multi-stage pipeline: A DSP in...
灞波儿奔 DSP and ARM Processors
Research on the design of DDS noise signal generator
[p=35, null, left][color=rgb(46, 46, 46)][font=微软雅黑, 宋体][size=18.6667px]Abstract: Based on the DDS principle, a noise signal generator with adjustable bandwidth and power is designed by adopting modul...
ld056k Analog electronics
[Recruitment] [Turing Robot] Hardware Engineer
Turing Robot: tuling123.com Job requirements: Proficient in programming and development of STM32, Keil and other single-chip microcomputers Familiar with or understand the development and use of Andro...
tuling Recruitment
Flash API Error #65535
When programming DSP F2808, Flash API Error #65535: The Device in in limp mode, operation failed appears. Has anyone encountered this before and what is the cause?...
rayemarine Microcontroller MCU
Star series driver (included in the LM3S811 CD)
When I sawGreen Leaf, Piaosaid that he needed the driver for LM3S. Here is a copy for everyone!...
zhang5157098 Microcontroller MCU
Can LPC1768 Flash be used as storage?
Can the internal Flash of LPC1768 be used as storage? I feel that it is not very good to operate it in IAP mode....
john1337 NXP MCU

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2608  2457  698  1633  1369  53  50  15  33  28 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号