EEWORLDEEWORLDEEWORLD

Part Number

Search

BD105-17C-1-0250-0460-0250-NE

Description
Board Connector
CategoryThe connector    The connector   
File Size348KB,1 Pages
ManufacturerGlobal Connector Technology
Environmental Compliance
Download Datasheet Parametric View All

BD105-17C-1-0250-0460-0250-NE Overview

Board Connector

BD105-17C-1-0250-0460-0250-NE Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerGlobal Connector Technology
Reach Compliance Codecompli
ECCN codeEAR99
Connector typeBOARD CONNECTOR
Contact to complete cooperationTIN
Contact completed and terminatedTIN
Contact materialCOPPER ALLOY
JESD-609 codee3
Manufacturer's serial numberBD105
1
2
3
4
5
6
7
8
Global Connector Technology Ltd. - BD105: 1.27mm PITCH ELEVATED PIN HEADER, SINGLE ROW, SURFACE MOUNT, VERTICAL
A
A
B
C
D
E
SPECIFICATIONS
规格:
CURRENT RATING
电流额定值:
1 AMP
No. of Contacts
INSULATOR RESISTANCE
绝缘电阻值:
1000 MEGOHMS MIN.
03 to 33
F
DIELECTRIC WITHSTANDING
耐电压:
AC 300 V
Contact Plating
CONTACT RESISTANCE
接触电阻值:
20m
Max.
A = Gold Flash All Over
OPERATING TEMPERATURE
工½温度:
-40°C TO +105°C
B = Selective Gold Flash Contact Area/
CONTACT MATERIAL
端子物料:
COPPER ALLOY
Tin On Tail
INSULATOR MATERIAL
绝缘½物料
:
C = Tin All Over
STANDARD
标准物料
: POLYESTER
聚酯
, LCP, UL 94-V0
G = 10µ" Gold Contact Area/Tin On Tail
OPTIONS
可选物料
: POLYAMIDE
聚醯胺
, NYLON 6T, UL 94-V0
I = 30µ" Gold Contact Area/Tin On Tail
SOLDERING PROCESS
可焊性
:
Standard = Gold Flash All Over
LCP (STANDARD
标准物料
) -
G
IR REFLOW
回流焊
: 260°C for 10 sec.
WAVE
波峰焊
: 250°C for 5-10 sec
MANUAL SOLDER
人工焊接
: 350°C for 3-5 sec
NYLON 6T (OPTION
可选物料
) -
IR REFLOW
回流焊
: 260°C for 10 sec.
WAVE
波峰焊
: 230°C for 5-10 sec.
MANUAL SOLDER
人工焊接
: 350°C for 3-5sec
MATES WITH
配套之母座
(SUBJECT TO PIN LENGTH
在端子长度适合的条件下
):
BD074
BD075
BD080
BD090
H
By
DETAIL
REV
DATE
LYH
DRAWING
RELEASE
A
28/12/07
PN
STANDARD INSULATOR
MATERIAL & PACKING
OPTIONS CHANGED
CB
PACKING OPTIONS SOLDER TEMP & MATES
WITH INFO. UPDATED
CHANGED
B
27/04/09
1
C
20/05/09
G CE
N N
I
D E
N SC
E E
P L
O
S
B
GC
O
Ordering Grid
B
C
D
E
BD105
XX X
X
XXXX
XXXX
XXXX
X
X
Type
1 = R1 Type
2 = R2 Type
Packing Options
B = Tape and Reel with Cap (Standard)
D = Tube (Standard - where height exceeds 25mm)
E = Tube with Cap
Insulator Material
L = LCP (Standard)
N = Nylon 6T
F
Dimension C (1/100mm)
(Post Height)
Standard - 3.00mm = 0300
or specify Dimension C
e.g. 2.50mm = 0250
Tol +/- 0.2mm
Dimension D (1/100mm)
(Stack Height)
Standard - 4.60mm = 0460
Please Specify Dimension D
e.g. 2.5mm = 0250
Tol +/- 0.2mm
Part Number:-
Dimension E (1/100mm)
(Footprint Width)
Standard - 4.50mm = 0450
or specify Dimension E
e.g. 2.50mm = 0250
Tol +/- 0.2mm
G
Tolerances
(Except as noted)
Date:-
Dimensions in mm
BD105
28 DEC 07
AE
2
D
27/07/09
AE
DIMENSION
AMMENDED
E
27/08/09
3
AJO
BD105
X PCN
X
15/05/14
X.°±5°
.X°±2°
X.X ± 0.20
X.XX ± 0.15 .XX°±1°
X.XXX ± 0.10 .XXX°±0.5°
X. ± 0.30
Third Angle Projection
Description:-
H
Sheet No.
1/1
1.27mm PITCH ELEVATED PIN HEADER, SINGLE ROW
SURFACE MOUNT, VERTICAL
www.globalconnectortechnology.com
Material
Drawn by
LYH
X
See Note
E & OE
C
THIS DRAWING IS CONFIDENTIAL AND MUST NOT BE
COPIED OR DISCLOSED WITHOUT WRITTEN CONSENT
Scale
NTS
Revision
4
5
6
7
8
Third-party analysis of the design process of Altera floating-point DSP
This report is an independent analysis of Altera's floating-point DSP design flow by a third-party company.Friends who do digital signal processing can take a look....
wstt FPGA/CPLD
ADSP-2111 Signal Processor Features
(1) The ADSP-2111 chip uses the Harvard architecture, with 6 buses (1 program bus, 2 data buses, 2 address buses and 1 DMA bus) on the chip. This separation of the program bus and data bus allows the ...
dianzijie5 DSP and ARM Processors
Method of generating PWM with different frequencies simultaneously
A method to generate PWM of different frequencies at the same time. I need to generate two PWM channels at the same time for an experiment tonight. I can't configure it. Please give me some advice!...
乁year Microcontroller MCU
Signal Chain Basics Collection 2
Since the launch of "30 Examples of Power Switch Design Secrets", it has received enthusiastic responses from engineers. The Signal Chain Basics Collection, written by Texas Instruments senior enginee...
德州仪器 Power technology
M3 Questions about CMD file storage allocation
I am a newbie who just got in touch with the M3 core of F28M36. When I used it to write a CAN communication program, the following problem occurred. When I wrote the test CAN subroutine, the DEBUG deb...
柠檬海星 Microcontroller MCU
How to use residentFlash to save user data
I am using 2410+wince4.2, and the flash is K9F1208UOM. When the wince system is running, I can see the ResidentFlash folder, and it seems that I can use the properties to check the remaining space, th...
ayangyzl Embedded System

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1335  2279  1455  1145  2804  27  46  30  24  57 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号